Abstract: Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.

Abstract: A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

Abstract: In this method for reduced pressure lamination of a light sensitive material in film form to a printed circuit base board, when adhering the light sensitive material in film form comprising a flexible support either continuous or cut to the dimensions of the base board and a light sensitive layer to the printed circuit base board under reduced pressure, a main container for carrying out the adhesion and an intake container and an exit container connected thereto are provided, the base board is supplied to the intake container set to atmospheric pressure, and thereafter the pressure in the intake container is reduced, next the base board is supplied into the main container at reduced pressure and the light sensitive material in film form is adhered to the base board, next the light sensitive material in film form is in the case that it is continuous to the dimensions of the base board, and after supplying the base board to which the light sensitive material in film form has been adhered to the exit container a