Abstract: A multilayer circuit board 3a includes a core substrate 7; a resin section 8, which covers the side surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11, which are disposed within the resin section 8. The core substrate 7 includes a ceramic multilayer section 9, which is disposed on the mother-substrate side of the core substrate 7; and a resin multilayer section 10, which is stacked on a main surface 13 on a side of the ceramic multilayer section 9, the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11, and a through-hole 22, which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22, to mount the multilayer circuit board 3a on the mother substrate.

Abstract: A multilayer circuit board 3a includes a core substrate 7; a resin section 8, which covers the side surface and a lower surface 12 of the core substrate 7; and a plurality of metal pins 11, which are disposed within the resin section 8. The core substrate 7 includes a ceramic multilayer section 9, which is disposed on the mother-substrate side of the core substrate 7; and a resin multilayer section 10, which is stacked on a main surface 13 on a side of the ceramic multilayer section 9, the side being opposite to the mother substrate. The resin section 8 includes the plurality of metal pins 11, and a through-hole 22, which extends through the resin section 8 in its thickness direction. A fastening part 24 penetrates the through-hole 22, to mount the multilayer circuit board 3a on the mother substrate.

Abstract: An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.

Abstract: A probe card for use in electrical testing of a device under test includes a mother substrate, a multilayer circuit board mounted on one main surface of the mother substrate, an outer electrode on the mother substrate, a coupling electrode on the main surface of the multilayer circuit board opposite the mother substrate to which a probe pin for supplying power to the device under test is connected, a power line PL coupling the outer electrode and the coupling electrode together, and a blowout portion including fuse wiring, the fuse wiring inserted in the power line PL and having a smaller current capacity than the power line PL. The power line PL has an exposed portion that is exposed on the surface of the multilayer circuit board, and the blowout portion is in the exposed portion of the power line PL.

Abstract: A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers, a resin multilayer body on the ceramic multilayer body 2 that is a stack of multiple resin layers, conductive vias in the uppermost ceramic layer, and conductive vias in the lowermost resin layer. The upper end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body. The lower end faces of the conductive vias are exposed on the interface between the ceramic multilayer body and the resin multilayer body and directly connected to the upper end faces of the conductive vias in the uppermost ceramic layer. The lower end faces of the conductive vias on the resin layer side are within the upper end faces of the conductive vias on the ceramic layer side in plan view.

Abstract: A method of manufacturing a composite module prevents a connection electrode electrically coupled to a functional element from separating from a first principal surface of an element substrate. A transmission filter element, a reception filter element, connection electrodes electrically coupled to the transmission filter element and the reception filter element, and an insulating layer surrounding the transmission filter element, the reception filter element, and the connection electrodes are disposed on a first principal surface of an element substrate. The insulating layer covers at least a portion of the surface of each of the connection electrodes. Because the portion of the surface of each of the connection electrodes in an exposed state is covered with the insulating layer, the connection electrodes electrically coupled to the transmission filter element and the reception filter element are prevented from separating from the first principal surface of the element substrate.

Abstract: A multilayer circuit board 1 includes a ceramic multilayer body 2, in which a plurality of ceramic layers 2a to 2d are stacked, and a resin multilayer body 3 which is stacked on the ceramic multilayer body 2 and in which a plurality of resin insulating layers 3a to 3c are stacked, wherein the peripheral portion of the resin multilayer body 3 is thinner than the central portion. Consequently, residual stress that acts on the peripheral portion of the interface serving as a base point of interfacial peeling between the resin multilayer body 3 and the ceramic multilayer body 2 can be relaxed and, thereby, interfacial peeling between the resin multilayer body 3 and the ceramic multilayer body 2 can be reduced. Also, the volume of the resin insulating layer 3 decreases by making the peripheral portion of the resin insulating layer 3 thin.

Abstract: A surface acoustic wave device includes a piezoelectric substrate including an interdigital transducer located on one principal surface thereof, an insulating layer arranged around the interdigital transducer, a cover layer arranged over the insulating layer and the interdigital transducer, and a columnar electrode penetrating through the insulating layer and the cover layer, and connected to the interdigital transducer through a connection wiring, wherein a buffer layer is arranged on the other principal surface of the piezoelectric substrate.

Abstract: Interfacial delamination of a resin multilayer body from a ceramic multilayer body that occurs in a multilayer circuit board composed of a ceramic multilayer body and a resin multilayer body thereon is reduced, and the warpage of the multilayer circuit board is reduced. A multilayer circuit board includes a ceramic multilayer body that is a stack of multiple ceramic layers and a resin multilayer body that is a stack of multiple resin insulating layers to and is on the ceramic multilayer body. The resin multilayer body contains dummy electrode pads for relaxing shrinkage stress in the resin multilayer body. This lessens the stress on the interface between the ceramic multilayer body and the resin multilayer body because the dummy electrode pads work to prevent the resin multilayer body from shrinking.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract: An electronic component element includes a piezoelectric substrate and a comb-shaped electrode located on one principal surface of the piezoelectric substrate. A support layer is arranged around the comb-shaped electrode. A cover layer is disposed so as to cover the support layer and the comb-shaped electrode. Via-hole electrodes extend through the cover layer and are connected to the comb-shaped electrode. An uneven portion is located on a principal surface of the cover layer that is opposite to a principal surface of the cover layer that is opposed to the comb-shaped electrode.

Abstract: A surface acoustic wave device includes a piezoelectric substrate including an interdigital transducer located on one principal surface thereof, an insulating layer arranged around the interdigital transducer, a cover layer arranged over the insulating layer and the interdigital transducer, and a columnar electrode penetrating through the insulating layer and the cover layer, and connected to the interdigital transducer through a connection wiring, wherein a buffer layer is arranged on the other principal surface of the piezoelectric substrate.

Abstract: A method of manufacturing a composite module prevents a connection electrode electrically coupled to a functional element from separating from a first principal surface of an element substrate. A transmission filter element, a reception filter element, connection electrodes electrically coupled to the transmission filter element and the reception filter element, and an insulating layer surrounding the transmission filter element, the reception filter element, and the connection electrodes are disposed on a first principal surface of an element substrate. The insulating layer covers at least a portion of the surface of each of the connection electrodes. Because the portion of the surface of each of the connection electrodes in an exposed state is covered with the insulating layer, the connection electrodes electrically coupled to the transmission filter element and the reception filter element are prevented from separating from the first principal surface of the element substrate.

Abstract: A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.