Patents by Inventor Tadakatsu Nakajima
Tadakatsu Nakajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7839640Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductinType: GrantFiled: August 19, 2009Date of Patent: November 23, 2010Assignee: Hitachi, LtdInventors: Tomoo Hayashi, Tadakatsu Nakajima, Yoshihiro Kondo, Hiroyuki Toyoda, Akio Idei, Shigeyasu Tsubaki
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Patent number: 7836712Abstract: An air conditioning apparatus comprises an air-conditioning unit including at least a cooling coil as a heat exchanger, a blower, a chiller, and a coolant pump for conducting air-conditioning, wherein the coolant pump pumps the coolant cooled by the chiller to the cooling coil, the cooling coil cools the air through heat exchange of the coolant and the air, the blower supplies the cooled air into a room. Coolant temperature of the chiller, the coolant flow rate of the coolant pump, and the air flow rate of the blower are calculated in accordance with the set points of the indoor temperature and the indoor humidity, and the chiller, coolant pump, and blower are controlled on the basis of the arithmetic calculation results. Thereby, the indoor temperature and indoor humidity are independently controlled in the central air-conditioning system.Type: GrantFiled: September 28, 2006Date of Patent: November 23, 2010Assignee: Hitachi, Ltd.Inventors: Keiji Sasao, Tadakatsu Nakajima
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Patent number: 7826217Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.Type: GrantFiled: December 5, 2008Date of Patent: November 2, 2010Assignee: Hitachi, Ltd.Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
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Publication number: 20100124012Abstract: A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink.Type: ApplicationFiled: November 18, 2009Publication date: May 20, 2010Inventors: Yoshihiro KONDO, Tadakatsu NAKAJIMA, Akio IDEI, Shigeyasu TSUBAKI, Hiroyuki TOYODA, Tomoo HAYASHI
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Publication number: 20100106988Abstract: To provide a system that can reduce the power consumption of an air conditioner and the power consumption of a storage device.Type: ApplicationFiled: January 29, 2009Publication date: April 29, 2010Inventors: Shinichi Hayashi, Yuichi Taguchi, Katsumi Ouchi, Yoko Shiga, Takeshi Kato, Jun Okitsu, Tadakatsu Nakajima
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Publication number: 20100073866Abstract: A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.Type: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Hiroyuki TOYODA, Akio Idei, Shigeyasu Tsubaki, Tadakatsu Nakajima, Yoshihiro Kondo, Tomoo Hayashi
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Publication number: 20100073865Abstract: An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conductinType: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Tomoo HAYASHI, Tadakatsu Nakajima, Yoshihiro Kondo, Hiroyuki Toyoda, Akio Idei, Shigeyasu Tsubaki
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Publication number: 20100073863Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.Type: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Hitoshi MATSUSHIMA, Tadakatsu Nakajima, Takayuki Atarashi, Yoshihiro Kondo, Hiroyuki Toyoda, Tomoo Hayashi, Akio Idei, Shigeyasu Tsubaki, Takumi Sugiura, Yasuhiro Kashirajima
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Publication number: 20100076608Abstract: The present invention relates to a system and method for controlling air conditioning facilities, and a system and method for power management of a computer room. In an air-conditioning facility control system of a computer room (cooling room) equipped with air-conditioning facilities for air-cooling the computer room in which a large number of information processing units are installed, an air-conditioner monitoring and controlling unit calculates a temperature sensitivity coefficient of each information processing unit, and that of each air conditioner, and then determines discharge air temperature of each air conditioner by use of the temperature sensitivity coefficients in such a manner that the sum of squares of a deviation of a change in discharge air temperature of each information processing unit becomes the smallest, and in such a manner that the sum total of the power consumption of the individual air conditioners becomes the smallest.Type: ApplicationFiled: August 19, 2009Publication date: March 25, 2010Inventors: Tadakatsu NAKAJIMA, Takeshi Kato, Yoko Shiga, Hitoshi Matsushima
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Publication number: 20100027216Abstract: Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.Type: ApplicationFiled: February 13, 2009Publication date: February 4, 2010Inventors: Hitoshi MATSUSHIMA, Hiroshi Fukuda, Tadakatsu Nakajima
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Publication number: 20090327778Abstract: A technique for determining task allocation for reducing power consumption of an entire system is disclosed. This system includes physical computers, a cooling apparatus for cooling the physical computers, and a power-saving control server for controlling the physical computers and cooling apparatus. The power-saving control server includes a virtual server layout generator which sets up a plurality of sets of task allocations with respect to the physical computers, a server power calculator for calculating power consumption of the physical computers in each task allocation, a physical computer profile used to estimate a heat release amount of the physical computers in each task allocation, a cooling power calculator which computes power consumption of the cooling apparatus, and a virtual server relocator which determines a task allocation with a total of calculated values of the server/cooling power calculators being minimized to be the optimum task allocation for the physical computers.Type: ApplicationFiled: February 19, 2009Publication date: December 31, 2009Inventors: Yoko SHIGA, Keisuke Hatasaki, Yoshifumi Takamoto, Takeshi Kato, Tadakatsu Nakajima
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Publication number: 20090259345Abstract: Total power consumption of information-processing devices and power supply/cooling facilities is reduced to realize energy saving operation of information-processing system. The information-processing system includes information-processing devices, power supply facilities, cooling facilities and an operations management device. The operations management device is connected to the devices and the facilities and includes layout information constituted of locations and operating information of the devices and locations and environmental information of the facilities. Also, the operations management device obtains the power consumption of the devices, the power supply loss of the power supply facilities and the cooling power of the cooling facilities by using the layout information, and then allocates the workloads to the devices so as to reduce the total sum of power consumption, supply loss and cooling power.Type: ApplicationFiled: January 12, 2009Publication date: October 15, 2009Inventors: Takeshi Kato, Tadakatsu Nakajima, Tatsuya Saito, Jun Okitsu, Yoko Shiga, Yoshio Miki
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Publication number: 20090154104Abstract: It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.Type: ApplicationFiled: December 5, 2008Publication date: June 18, 2009Inventors: Yoshihiro Kondo, Akio Idei, Shigeyasu Tsubaki, Hitoshi Matsushima, Tadakatsu Nakajima, Hiroyuki Toyoda, Tomoo Hayashi, Tatsuya Saito, Takeshi Kato, Kenji Ogiro
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Patent number: 7225171Abstract: A control server includes a device information database storing device characteristic data constituting the air conditioning equipment, a fuel/power rate database storing price and rate data regarding gas, oil, power and the like, a device characteristic and price database, an air conditioning equipment simulator for calculating running costs by using the data stored in the fuel/power rate database, and communication portion for performing communications through a network. The control server, and an air conditioning management controller for managing and controlling the air conditioning equipment provided with the communication portion for performing communications through the network, are connected to the network.Type: GrantFiled: May 27, 2003Date of Patent: May 29, 2007Assignee: Hitachi, Ltd.Inventors: Hiroshige Kikuchi, Tadakatsu Nakajima, Keiji Sasao
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Publication number: 20070107450Abstract: An air conditioning apparatus comprises an air-conditioning unit including at least a cooling coil as a heat exchanger, a blower, a chiller, and a coolant pump for conducting air-conditioning, wherein the coolant pump pumps the coolant cooled by the chiller to the cooling coil, the cooling coil cools the air through heat exchange of the coolant and the air, the blower supplies the cooled air into a room. Coolant temperature of the chiller, the coolant flow rate of the coolant pump, and the air flow rate of the blower are calculated in accordance with the set points of the indoor temperature and the indoor humidity, and the chiller, coolant pump, and blower are controlled on the basis of the arithmetic calculation results. Thereby, the indoor temperature and indoor humidity are independently controlled in the central air-conditioning system.Type: ApplicationFiled: September 28, 2006Publication date: May 17, 2007Inventors: Keiji Sasao, Tadakatsu Nakajima
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Publication number: 20060206369Abstract: A collection method and system which restrains an increase in initial cost of energy-saving facilities. According to the invention, the reduced amount of running cost of energy-saving facilities for a predetermined period is computed based on a prediction of operation of the facilities, and an initial cost is determined. Actual operation of the energy-saving facilities is monitored, and stored in a history database. Based on the actual operation, the reduced amount of the running cost is periodically calculated and stored in a database. A business enterpriser draws the amount from the customer's account corresponding to the reduced amount.Type: ApplicationFiled: May 15, 2006Publication date: September 14, 2006Inventors: Toshihiko Fukushima, Tadakatsu Nakajima
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Patent number: 6732540Abstract: Provided are an air conditioning plant control method by which an air conditioning plant can be operated in a most desirable state, and an air conditioning plant so controlled. An air conditioning plant is controlled, which has at least one air conditioner, a refrigerating machine supplying cold water to the air conditioner and a cooling tower supplying cooling water to the refrigerating machine. Within an extent satisfying set conditions of air conditioning, setpoints of the draft temperature of the at least one air conditioner, the cold water temperature of the refrigerating machine and the temperature of cooling water from the cooling tower are altered and optimized so as to minimize energy consumption, operating cost or carbon dioxide emission of the air conditioning plant.Type: GrantFiled: December 19, 2002Date of Patent: May 11, 2004Assignee: Hitachi Plant Engineering & Construction Co., Ltd.Inventors: Yoshibumi Sugihara, Yuuji Miyajima, Takumi Sugiura, Hiroo Sakai, Noboru Oshima, Tadakatsu Nakajima, Hiroshige Kikuchi
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Patent number: 6701727Abstract: A management apparatus and a management method which can forecast inspection time before the lowering of performance or the occurrence of abnormality in a heat source unit for an air conditioner are provided. The operating condition of the air conditioner heat source unit is monitored by a central monitoring unit of the management apparatus connected to the heat source unit through an information communication network. Operating data of the heat source unit is analyzed so that the lowering of the performance and the advance of the degree of abnormality in the heat source unit are diagnosed. Thus, the loss of a user caused by the failure stop or the performance lowering of the heat source unit is reduced. Further, the load on the heat source unit is grasped by the central monitoring unit so that remote central control is carried out to make the operating cost minimal.Type: GrantFiled: October 10, 2002Date of Patent: March 9, 2004Assignee: Hitachi Building Systems Co., Ltd.Inventors: Tomohiro Komatsu, Tadakatsu Nakajima, Akira Nishiguchi, Tatsuo Fujii, Masaru Noujyo, Kyoichi Sekiguchi, Kenji Machizawa, Yoshikazu Hanawa, Tomio Nakajima, Haruo Nashimoto
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Publication number: 20040011066Abstract: Provided are an air conditioning plant control method by which an air conditioning plant can be operated in a most desirable state, and an air conditioning plant so controlled. An air conditioning plant is controlled, which has at least one air conditioner, a refrigerating machine supplying cold water to the air conditioner and a cooling tower supplying cooling water to the refrigerating machine. Within an extent satisfying set conditions of air conditioning, setpoints of the draft temperature of the at least one air conditioner, the cold water temperature of the refrigerating machine and the temperature of cooling water from the cooling tower are altered and optimized so as to minimize energy consumption, operating cost or carbon dioxide emission of the air conditioning plant.Type: ApplicationFiled: December 19, 2002Publication date: January 22, 2004Applicant: Hitachi Plant Engineering & Construction Co., Ltd.Inventors: Yoshibumi Sugihara, Yuuji Miyajima, Takumi Sugiura, Hiroo Sakai, Noboru Oshima, Tadakatsu Nakajima, Hiroshige Kikuchi
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Publication number: 20030192328Abstract: A control server includes a device information database storing device characteristic data constituting the air conditioning equipment, a fuel/power rate database storing price and rate data regarding gas, oil, power and the like, a device characteristic and price database, an air conditioning equipment simulator for calculating running costs by using the data stored in the fuel/power rate database, and communication portion for performing communications through a network. The control server, and an air conditioning management controller for managing and controlling the air conditioning equipment provided with the communication portion for performing communications through the network, are connected to the network.Type: ApplicationFiled: May 27, 2003Publication date: October 16, 2003Inventors: Hiroshige Kikuchi, Tadakatsu Nakajima, Keiji Sasao