Patents by Inventor Tadakazu Miyashita
Tadakazu Miyashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220297223Abstract: A work processing apparatus performs processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate. The processing head includes a plasma electrode that generates plasma and radiates the plasma to the surface to be processed of the work. In the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode.Type: ApplicationFiled: March 16, 2022Publication date: September 22, 2022Inventors: Hideo AIDA, Hidetoshi TAKEDA, Toshiro DOI, Tadakazu MIYASHITA, Atsushi KAJIKURA
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Patent number: 8888562Abstract: In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.Type: GrantFiled: November 7, 2011Date of Patent: November 18, 2014Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Shogo Koyama
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Patent number: 8454410Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.Type: GrantFiled: January 29, 2008Date of Patent: June 4, 2013Assignees: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery Corp.Inventors: Koji Kitagawa, Junichi Ueno, Syuichi Kobayashi, Hideo Kudo, Tadakazu Miyashita, Atsushi Kajikura, Yoshinobu Nishimoto
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Publication number: 20120184190Abstract: In the double-side polishing apparatus, one end part of a slurry supply hole has a female-tapered face whose inner diameter is gradually increased toward a polishing face of a polishing plate. A pad hole, which corresponds to the slurry supply hole, is formed in a polishing pad covering the slurry supply hole. An edge of the pad hole is located in the slurry supply hole. A fixation pipe, in which a flange section facing the female-tapered face is formed at one end part, is fixed in the slurry supply hole. The edge of the pad hole is sandwiched and held between the female-tapered face of the slurry supply hole and the flange section of the fixation pipe.Type: ApplicationFiled: November 7, 2011Publication date: July 19, 2012Inventors: Tadakazu Miyashita, Shogo Koyama
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Publication number: 20100144249Abstract: Provided is a polishing apparatus comprising a lower stool (12), a motor (18a) and a speed reducer (19a) for driving the lower stool, and a box (17) for covering at least the portion of the lower stool below the working action face. The polishing apparatus polishes a wafer by forcing the wafer to contact the lower stool and by rotating the lower stool. The box has its inside separated by partitions (31a and 31b) into a plurality of regions, and the motor for driving the lower stool is arranged in a region other than the region containing the lower stool. The polishing apparatus can manufacture a wafer of a stable shape, irrespective of the time elapsed from the running start and the presence/absence of the stop of the polishing apparatus.Type: ApplicationFiled: January 29, 2008Publication date: June 10, 2010Applicants: Shin-Etsu Handotai Co., Ltd., Fujikoshi Machinery CorporationInventors: Koji Kitagawa, Junichi Ueno, Syuichi Kobayashi, Hideo Kudo, Tadakazu Miyashita, Atsushi Kajikura, Yoshinobu Nishimoto
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Patent number: 7524232Abstract: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.Type: GrantFiled: May 25, 2007Date of Patent: April 28, 2009Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Yosuke Kanai
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Publication number: 20070275639Abstract: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.Type: ApplicationFiled: May 25, 2007Publication date: November 29, 2007Inventors: Tadakazu Miyashita, Yosuke Kanai
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Patent number: 7255635Abstract: In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engaged with the inner gear section of the outer pin gear and the outer gear section of the inner pin gear so as to rotate and move the carrier around the inner pin gear. At least one of the inner gear section and the outer gear section includes gear teeth, each of which comprises: a pin proper being fixed to a pin ring and extended upward therefrom; a cylindrical collar rotatably covering and fitting the pin proper at a fitting section.Type: GrantFiled: February 2, 2006Date of Patent: August 14, 2007Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Harumichi Koyama, Mitsuhiro Nakamura
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Patent number: 7247083Abstract: The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing means for introducing a pressurized fluid into a second fluid chamber and pressing a press plate downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber and pressing the workpiece downward. With this structure, the workpiece is held on the lower side of an elastic sheet member, and the lower face of the workpiece can be polished by a polishing plate.Type: GrantFiled: March 23, 2005Date of Patent: July 24, 2007Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Hiromi Kishida
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Patent number: 7235001Abstract: The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises: a guide member having a receiving section, which centers the work piece; a mounting table vertically moving with respect to the guide member, the mounting table having a mounting section, which receives the centered work piece; and a supporting mechanism supporting the mounting table and allowing the mounting table to move downward. The mounting table is relatively moved close to the top ring and presses the work piece onto the top ring so as to transfer the work piece to the top ring.Type: GrantFiled: March 30, 2006Date of Patent: June 26, 2007Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Yoshikazu Nakamura, Yoshiyuki Nomura
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Publication number: 20060223421Abstract: The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises: a guide member having a receiving section, which centers the work piece; a mounting table vertically moving with respect to the guide member, the mounting table having a mounting section, which receives the centered work piece; and a supporting mechanism supporting the mounting table and allowing the mounting table to move downward. The mounting table is relatively moved close to the top ring and presses the work piece onto the top ring so as to transfer the work piece to the top ring.Type: ApplicationFiled: March 30, 2006Publication date: October 5, 2006Inventors: Tadakazu Miyashita, Yoshikazu Nakamura, Yoshiyuki Nomura
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Patent number: 7115026Abstract: An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.Type: GrantFiled: August 11, 2005Date of Patent: October 3, 2006Assignee: Fujikoshi Machinery Corp.Inventors: Makoto Nakajima, Yoshio Nakamura, Tadakazu Miyashita
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Publication number: 20060178094Abstract: In polishing apparatus of the present invention, collars can be easily exchange. The polishing apparatus comprises: an outer pin gear having an inner gear section; an inner pin gear having an outer gear section; and a carrier having outer gear teeth, which are engaged with the inner gear section of the outer pin gear and the outer gear section of the inner pin gear so as to rotate and move the carrier around the inner pin gear. At least one of the inner gear section and the outer gear section includes gear teeth, each of which comprises: a pin proper being fixed to a pin ring and extended upward therefrom; a cylindrical collar rotatably covering and fitting the pin proper at a fitting section.Type: ApplicationFiled: February 2, 2006Publication date: August 10, 2006Inventors: Tadakazu Miyashita, Harumichi Koyama, Mitsuhiro Nakamura
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Publication number: 20060035571Abstract: An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.Type: ApplicationFiled: August 11, 2005Publication date: February 16, 2006Inventors: Makoto Nakajima, Yoshio Nakamura, Tadakazu Miyashita
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Publication number: 20050221733Abstract: The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing means for introducing a pressurized fluid into a second fluid chamber and pressing a press plate downward; and third pressing means for introducing a pressurized fluid into a third fluid chamber and pressing the workpiece downward. With this structure, the workpiece is held on the lower side of an elastic sheet member, and the lower face of the workpiece can be polished by a polishing plate.Type: ApplicationFiled: March 23, 2005Publication date: October 6, 2005Applicant: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Hiromi Kishida
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Patent number: 6648735Abstract: Method for abrading a work piece with a fixed load including a first abrading process in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted in order to apply first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate and a second abrading process in which the pressure of the cylinder chamber is readjusted in order to to apply second pressure which is higher than the first pressure to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.Type: GrantFiled: November 9, 2001Date of Patent: November 18, 2003Assignee: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Tsuyoshi Hasegawa, Atsushi Kajikura, Norihiko Moriya
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Publication number: 20020058465Abstract: The method of the present invention is capable of abrading a work piece with fixed load. The method comprises: a first abrading process, in which pressure of a cylinder chamber of a cylinder unit suspending an upper abrasive plate is adjusted so as to apply first pressure to the work piece via the upper abrasive plate without applying full weight of the upper abrasive plate; and a second abrading process, in which the pressure of the cylinder chamber is readjusted so as to apply second pressure, which is higher than the first pressure, to the work piece via the upper abrasive plate without applying the full weight of the upper abrasive plate.Type: ApplicationFiled: November 9, 2001Publication date: May 16, 2002Applicant: Fujikoshi Machinery Corp.Inventors: Tadakazu Miyashita, Tsuyoshi Hasegawa, Atsushi Kajikura, Norihiko Moriya