Abstract: An abrasive liquid for CMP process characterized by comprising an abrasive material, an aqueous solvent and an addition agent, and containing abrasive particles having a particle diameter of 20 to 80 nm by 15 weight % or more on the basis of the weight of the abrasive liquid; and a method of polishing by using the abrasive liquid are appropriate for the processing of flattening the surface of a device wafer on which at least a silicon oxide film is formed, and take effect of being capable of stably performing superior abrasive properties such as flattening properties, low flaw properties and high washing properties, and then are the most appropriate for the processing of flattening the surface of a semiconductor device comprising a layer insulation film or an element separation film, a magnetic head and a substrate for a liquid crystal display in the semiconductor industry.

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone chain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sub.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sub.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone clain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sup.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sup.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: A photosensitive resin having at least one group as shown below in Chemical Formula (1) in a molecule. ##STR1## wherein n represents an integer from 1 to 10. Since the photosensitive resin has an azido group in a molecule having an adsorption region higher than 300 nm, the resin is highly sensitive. Therefore, an emulsion coating photo mask or a soda glass photo mask, which allows light permeation within the abosorption region of the azido group and is cheap in industry, can be used as the photo mask for the photosensitive resin of the invention. The photosensitive resin is particularly useful as a photo resist.