Patents by Inventor Tadami Ito

Tadami Ito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin sealing type semiconductor device having thin portions formed on the leads
    Patent number: 5777380
    Abstract: A resin sealing type semiconductor device includes a radiator, a semiconductor element, a frame lead arranged at a distance around this semiconductor element and displaced from the radiator, and a plurality of leads extending from this frame lead and attached to a mounting surface with a insulating lead support therebetween. The leads are pressed downward by an upper mold so that the radiator is pressed against a lower mold in such a manner that resin cannot seep therebetween. Thin portions are formed in the leads to ensure that the leads do not peel away from the insulating lead support.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: July 7, 1998
    Assignee: Seiko Epson Corporation
    Inventors: Tetsuya Otsuki, Tadami Ito