Abstract: A maskless exposure method of drawing a circuit pattern includes: moving a substrate with respect to a projection optical system; scanning, by the projection optical system, the substrate in a first direction; shifting a scanning region in a second direction; scanning the substrate in the first direction so that an overlapping part is formed. A plurality of marks different from the circuit pattern are exposed in a vicinity of the overlapping part. The plurality of marks are a set of marks at least including two marks disposed on one side of the overlapping part and two marks disposed on another side of the overlapping part. Deviations between the pair of the scanning regions, an inclination of exposing light, and a yawing angle of a stage are analyzed by measuring deviations of distances among the plurality of marks. Calibration data are obtained from a result of the analyzing.

Abstract: A maskless exposure method of drawing a circuit pattern includes: moving a substrate with respect to a projection optical system; scanning, by the projection optical system, the substrate in a first direction; shifting a scanning region in a second direction; scanning the substrate in the first direction so that an overlapping part is formed. A plurality of marks different from the circuit pattern are exposed in a vicinity of the overlapping part. The plurality of marks are a set of marks at least including two marks disposed on one side of the overlapping part and two marks disposed on another side of the overlapping part. Deviations between the pair of the scanning regions, an inclination of exposing light, and a yawing angle of a stage are analyzed by measuring deviations of distances among the plurality of marks. Calibration data are obtained from a result of the analyzing.

Abstract: Direct exposure equipment having a multiple heads generally conducts overlapping exposure at an exposure area boundary between the heads. In such a case, if the heads are misaligned, a flaw will occur in a pattern shape at an area that is subject to overlapping exposure. To overcome this, TEGs are disposed for evaluating line width and resistance at an overlapping exposure area between the exposure heads and at a returning exposure area formed when direct exposure equipment having a multi-head configuration exposes a substrate. By examining measured values from these TEGs, a misalignment in the multiple exposure heads is detected.