Patents by Inventor Tadamine Ohashi

Tadamine Ohashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10196514
    Abstract: The present invention provides a thermoplastic polyester elastomer composition which is flexible and exhibits excellent thermal aging resistance and water resistance. According to the present invention, there is provided a thermoplastic polyester elastomer composition wherein, to 100 parts by mass in total of a thermoplastic polyester elastomer (A) and a modified hydrogenated styrene-type elastomer (B), 0.1 to 10 part (s) by mass of a carbodiimide compound (C), 0.01 to 5 part (s) by mass of an antioxidant of a hindered phenol type (D) and 0.
    Type: Grant
    Filed: June 17, 2015
    Date of Patent: February 5, 2019
    Assignee: TOYOBO CO., LTD.
    Inventors: Tadamine Ohashi, Yasuto Fujii, Junichi Nakao
  • Publication number: 20170130046
    Abstract: The present invention provides a thermoplastic polyester elastomer composition which is flexible and exhibits excellent thermal aging resistance and water resistance. According to the present invention, there is provided a thermoplastic polyester elastomer composition wherein, to 100 parts by mass in total of a thermoplastic polyester elastomer (A) and a modified hydrogenated styrene-type elastomer (B), 0.1 to 10 part (s) by mass of a carbodiimide compound (C), 0.01 to 5 part (s) by mass of an antioxidant of a hindered phenol type (D) and 0.
    Type: Application
    Filed: June 17, 2015
    Publication date: May 11, 2017
    Applicant: TOYOBO CO., LTD.
    Inventors: Tadamine OHASHI, Yasuto FUJII, Junichi NAKAO
  • Patent number: 9447575
    Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).
    Type: Grant
    Filed: November 1, 2011
    Date of Patent: September 20, 2016
    Assignee: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange
  • Publication number: 20130209784
    Abstract: Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×106 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A).
    Type: Application
    Filed: November 1, 2011
    Publication date: August 15, 2013
    Applicant: TOYOBO CO., LTD.
    Inventors: Tomohide Nakagawa, Tadamine Ohashi, Yasuto Fujii, Akio Tange