Patents by Inventor Tadamitsu Miyazaki

Tadamitsu Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7494597
    Abstract: Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: February 24, 2009
    Assignee: Sumco Techxiv Corporation
    Inventors: Tadamitsu Miyazaki, Kazuya Hirayama, Hisaya Fukunaga, Hiroyasu Futamura
  • Publication number: 20070017901
    Abstract: Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).
    Type: Application
    Filed: July 29, 2004
    Publication date: January 25, 2007
    Applicant: KOMATSU DENSHI KINZOKU KABUSHIKI KAISHA
    Inventors: Tadamitsu Miyazaki, Kazuya Hirayama, Hisaya Fukunaga, Hiroyasu Futamura