Patents by Inventor Tadanari Anpo

Tadanari Anpo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Free access floor structure, and manufacturing apparatus and carrier apparatus adapted for floor structure
    Patent number: 10240350
    Abstract: A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure. An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: March 26, 2019
    Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, SANYO CO., LTD.
    Inventors: Tadanari Anpo, Shiro Hara
  • FREE ACCESS FLOOR STRUCTURE, AND MANUFACTURING APPARATUS AND CARRIER APPARATUS ADAPTED FOR FLOOR STRUCTURE
    Publication number: 20160318535
    Abstract: A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.
    Type: Application
    Filed: December 2, 2014
    Publication date: November 3, 2016
    Applicants: SANYO CO., LTD., NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
    Inventors: Tadanari Anpo, Shiro Hara