Patents by Inventor Tadanori Ominato

Tadanori Ominato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8604354
    Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: December 10, 2013
    Assignee: Fujikura Ltd.
    Inventors: Shoji Ito, Tomofumi Kitada, Tadanori Ominato
  • Publication number: 20100163289
    Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.
    Type: Application
    Filed: December 22, 2009
    Publication date: July 1, 2010
    Applicant: FUJIKURA LTD.
    Inventors: Shoji ITO, Tomofumi Kitada, Tadanori Ominato
  • Patent number: 7205491
    Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: April 17, 2007
    Assignee: Fujikura Ltd.
    Inventors: Masahiro Kaizu, Tadanori Ominato, Koji Hirai
  • Patent number: 7157363
    Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: January 2, 2007
    Assignees: Fujikura Ltd., Texas Instruments Japan Limited
    Inventors: Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, Kenji Masumoto
  • Patent number: 7023088
    Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
    Type: Grant
    Filed: May 21, 2003
    Date of Patent: April 4, 2006
    Assignees: Fujikura Ltd., Texas Instruments Japan Limited
    Inventors: Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, Kenji Masumoto
  • Publication number: 20060016679
    Abstract: The present invention provides a key switch diaphragm capable of obtaining a good click feeling and capable of avoiding contact failure and having a high durability. A key switch diaphragm 30 comprises a thin plate having flexibility and conductivity, and the key switch diaphragm 30 includes a truncated pedestal 16, and a spherical domical portion 18 being raised toward an upper portion of the pedestal 16 on the side of the upper portion of the pedestal 16. The domical portion 18 is provided at its substantially central portion with an outwardly raised portion 32 being raised toward an outer surface of the domical portion 18. An edge of the outwardly raised portion 32 on the side of its inner surface forms a contact 34.
    Type: Application
    Filed: September 11, 2003
    Publication date: January 26, 2006
    Inventors: Masahiro Kaizu, Tadanori Ominato, Koji Hirai
  • Publication number: 20050037539
    Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
    Type: Application
    Filed: September 27, 2004
    Publication date: February 17, 2005
    Applicants: FUJIKURA LTD., TEXAS INSTRUMENTS JAPAN LIMITED
    Inventors: Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, Kenji Masumoto
  • Patent number: 6835595
    Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: December 28, 2004
    Assignees: Fujikura Ltd., Texas Instruments Japan Limited
    Inventors: Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, Kenji Masumoto
  • Publication number: 20030207494
    Abstract: An insulating layer (3) having an opening portion (3a) at a position conformable to an electrode pad (2) is formed. Next, a resin projection portion (4) is formed on the insulating layer (3). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (3a), the resin projection portion (4) and the region sandwiched therebetween. A Cu plating layer (6) is formed by electrolytic copper plating, using the resist film as a mask.
    Type: Application
    Filed: May 21, 2003
    Publication date: November 6, 2003
    Applicants: FUJIKURA LTD., TEXAS INSTRUMENTS JAPAN LIMITED
    Inventors: Takanao Suzuki, Masatoshi Inaba, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka, Masatoshi Inaba, Nobuyuki Sadakata, Mutsumi Masumoto, Kenji Masumoto
  • Patent number: 6387734
    Abstract: An insulating layer (3) is formed on a Si wafer (1). An opening portion is made in this insulating layer (3), and subsequently a rerouting layer (2) is formed. Next, a resin layer (4) is formed on the rerouting layer (2). The resin layer (4) is then cured so that the rerouting layer (2) and a Cu foil (5) are bonded to each other through the resin layer (4). Thereafter, a ring-like opening portion (4a) is made in the resin layer (4), and a Cu plating layer (8) is formed inside this opening portion (4a).
    Type: Grant
    Filed: May 24, 2001
    Date of Patent: May 14, 2002
    Assignee: Fujikura Ltd.
    Inventors: Masatoshi Inaba, Takanao Suzuki, Tadanori Ominato, Masahiro Kaizu, Akihito Kurosaka