Abstract: A photoelectric converter includes a plurality of substrates, which are located adjacent to each other and on which a plurality of photoelectric conversion devices are two-dimensionally arranged, either scan circuits or detection circuits, at least, that are arranged on two opposing sides of the photoelectric converter, whereby scanning directions either from the scan circuits or from the detection circuits, which are arranged on the two opposing sides, are capable of being set so as to be performed in like directions.

Abstract: Provided is an industrially advantageous process for producing allylamine polymers from various allylamines in an organic solvent with ease and at high yields, and the process comprises polymerizing allylamines in a medium containing an organic solvent in the presence of an azo compound selected from azo compounds of the formulae (I) and (II), wherein symbols are as defined in the specification.

Abstract: A radiation detecting device having a wavelength converter for converting radiation into photoelectrically convertible light and a plurality of pixels arranged in the form of a matrix which pixel comprises a sensor element for converting the light into an electric signal and a thin film transistor (TFT) for transfer connected to the sensor element to successively transfer a signal from the pixel, the detecting device comprises a means for turning on the TFT to be turned on first among the TFTs for transfer after the delay of at least (n×&tgr;1), wherein &tgr;1 is a time constant of a characteristic of the wavelength converter, and n is ln(SN) in which SN is a desired signal to noise ratio, after the irradiation is stopped, thereby transferring a signal stored in its corresponding pixel.

Abstract: An X-ray image pickup device has a two-dimensional image reading device which is constituted by two-dimensionally forming a plurality of photoelectric conversion elements on an insulating substrate, and has switching elements in the vicinities of these photoelectric conversion elements, a phosphor which is formed on the two-dimensional image reading device and serves as a wavelength converter for converting X-ray radiation into visible light, and a grid plate which is formed on the phosphor and guides only X-rays from a specific direction toward the phosphor and the two-dimensional image reading device, whereby a next-generation X-ray image pickup device which can improve diagnostic efficiency that cannot be attained by the conventional film method, and has a high space factor and a high S/N ratio that cannot be attained by the CCD method can be provided.

Abstract: An electromagnetic-wave detector having an electromagnetic-wave detection unit having the structure that M (M.gtoreq.1) contiguous pairs of a metallic layer and an insulating layer are provided at the side of incidence of an electromagnetic-wave, such as X-rays.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: A photoelectric conversion apparatus comprises a plurality of photoelectric conversion elements arranged two-dimensionally on a substrate wherein the X-ray or light incidence side of some proper one or ones of the photoelectric conversion elements S13 is covered with a shielding member whose transmittance to an X-ray or light is equal to zero or substantially zero so that the photoelectric conversion elements covered with the shielding member act as correction photoelectric conversion elements thereby achieving an improvement in production yield, a reduction in cost, and a reduction in the time required to read the correction output signals, and also high performance capable of obtaining a moving picture.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: According to the present invention, a photoelectric converter comprises a plurality of substrates, which are located adjacent to each other and on which a plurality of photoelectric conversion devices are two-dimensionally arranged, either scan circuits or detection circuits, at least, that are arranged on two opposing sides of the photoelectric converter, whereby scanning directions either from the scan circuits or from the detection circuits, which are arranged on the two opposing sides, are capable of being set so as to be performed in like directions.

Abstract: According to the present invention, provided is a photoelectric converter wherein mounted on substrate are a photoelectric conversion device array portion, which is so formed as to contact two adjacent sides, and a driving circuit portion, which is formed along the other two adjacent sides and that is connected to the photoelectric conversion device array portion, wherein four of the substrates are bonded together with two each being positioned vertically and horizontally, so that the photoelectric conversion device array portions lie adjacent to each other in a plane, and wherein the number, or the shape in a plane, of the photoelectric converter device arrays mounted on at least one of the four substrates differs from the number, or the shape in a plane, of the photoelectric conversion device arrays mounted on at least one of the other three substrates.

Abstract: In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrate, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.

Abstract: In a photoelectric conversion device including peripheral ICs, the peripheral ICs are in thermal contact with a substrate having photoelectric conversion elements and a chassis, which covers the peripheral ICs and has high thermal conductivity, via a thermal conductive member, so as to eliminate adverse influences of heat produced by the peripheral ICs such as a low S/N ratio.

Abstract: An X-ray image pickup device has a two-dimensional image reading device which is constituted by two-dimensionally forming a plurality of photoelectric conversion elements on an insulating substrate, and has switching elements in the vicinities of these photoelectric conversion elements, a phosphor which is formed on the two-dimensional image reading device and serves as a wavelength converter for converting X-ray radiation into visible light, and a grid plate which is formed on the phosphor and guides only X-rays from a specific direction toward the phosphor and the two-dimensional image reading device, whereby a next-generation X-ray image pickup device which can improve diagnostic efficiency that cannot be attained by the conventional film method, and has a high space factor and a high S/N ratio that cannot be attained by the CCD method can be provided.

Abstract: A photoelectric conversion apparatus comprises a plurality of transparent substrates. Each of the substrates has a a plurality of photoelectric conversion elements on a front surface thereof on a base. A light-absorbing member is provided on at least one of a rear surface and end faces of the substrate.

Abstract: An imaging apparatus whose substrate or base stand is arranged to be a member to absorb or shield radiation in order to prevent semiconductor element, such as ICs, provided for driving photoelectric elements from making any malfunction or from being deteriorated by the irradiation of radiation, such as X-rays or .gamma.-rays, transmitted from the photoelectric conversion element substrate or base stand or in order to prevent radiation from being scattered.

Abstract: To eliminate non-read time in a photoelectric converting device, a photoelectric converting section is provided in which a plurality of photoelectric conversion elements, switching elements, matrix signal wirings, and gate drive wirings are arranged on the same substrate such that the photoelectric converting section generates parallel signals. A drive switching section is provided for applying drive signals to the gate drive wirings. A read switching section is provided for converting the parallel signals which are transferred from the matrix signal wirings into a serial signal, and for outputting the serial signal. The read switching section comprises a plurality of transfer switches respectively connected to the matrix signal wirings. The transfer switches are preferably activated together, simultaneously. A plurality of read capacitors are also provided in the read switching section to store the charges transferred through the matrix signal wirings.

Abstract: The present invention relates to a method of driving a thin film transistor type optical sensor, having a gate electrode, a gate insulating layer, a thin film semiconductor layer, an ohmic contact layer, a source electrode and a drain electrode.The thin film transistor type optical sensor is driven by providing the gate electrode with a threshold voltage for a thin film transistor provided adjacent to the thin film transistor type optical sensor or a voltage based on the threshold voltage.

Abstract: An image reading device includes a plurality of photoelectric converting elements, a plurality of accumulating elements corresponding to each of the photoelectric converting elements, and switching circuitry for reading out the signals accumulated in the accumulating elements. Each of the photoelectric converting elements comprises a switching portion and a sensor portion. Driving circuitry is provided for driving the photoelectric converting elements by activating the switching portions to release the charges accumulated in the accumulating elements through the photoelectric converting elements in order to reset the accumulated elements.

Abstract: A photosensor with improved correction of image signals has a first photosensor portion including a plurality of photoelectric converting devices for reading an object and providing image signals thereof. A second photosensor portion includes a plurality of photoelectric converting devices and provides reference signals from light reflected from a reference member, or light received directly from a light source. Correction circuitry corrects the image signals from the first photosensor portion in accordance with the reference signals output from the second photosensor portion. Preferably, the photoelectric converting devices of the first and second photosensor portions are arranged in adjacent, parallel lines on the same substrate. Preferably, reference signals from the converting devices of the second photosensor are used by the correction circuitry to correct the electrical signals from substantially adjacent converting devices of the first photosensor portion.

Abstract: A photosensor with improved correction of image signals has a first photosensor portion including a plurality of photoelectric converting devices for reading an object and providing image signals thereof. A second photosensor portion includes a plurality of photoelectric converting devices and provides reference signals from light reflected from a reference number, or light received directly from a light source. Correction circuitry corrects the image signals from the first photosensor portion in accordance with the reference signals output from the second photosensor portion. Preferably, the photoelectric converting devices of the first and second photosensor portions are arranged in adjacent, parallel lines on the same substrate. Preferably, reference signals from the converting devices of the second photosensor are used by the correction circuitry to correct the electrical signals from substantially adjacent converting devices of the first photosensor portion.