Patents by Inventor Tadao Fukatani

Tadao Fukatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having a base metal lead frame
    Patent number: 6853056
    Abstract: Disclosed is a semiconductor device which has a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad, copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires; wherein an initial detachment area of said resin molded member at the bottom side of the die pad is 20% or less to the whole die pad area.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: February 8, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tadao Fukatani, Hiroshi Masuda, Koji Motonami
  • Semiconductor device and manufacturing method thereof
    Publication number: 20040212049
    Abstract: A semiconductor device comprises: a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires.
    Type: Application
    Filed: May 26, 2004
    Publication date: October 28, 2004
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Tadao Fukatani, Hiroshi Masuda, Koji Motonami
  • Semiconductor device and manufacturing method thereof
    Patent number: 6664136
    Abstract: A semiconductor device comprises: a semiconductor chip; a copper series lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires, wherein a water soluble rustproof agent is applied over outer lead segments, protruding from said resin molded member, of said plurality of leads.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: December 16, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Koji Motonami, Hiroshi Masuda, Tadao Fukatani
  • Semiconductor device and manufacturing method thereof
    Publication number: 20030116842
    Abstract: A semiconductor device comprises: a semiconductor chip; a copper series lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires, wherein a water soluble rustproof agent is applied over outer lead segments, protruding from said resin molded member, of said plurality of leads.
    Type: Application
    Filed: July 15, 2002
    Publication date: June 26, 2003
    Inventors: Koji Motonami, Hiroshi Masuda, Tadao Fukatani
  • Semiconductor device and manufacturing method thereof
    Publication number: 20030116837
    Abstract: A semiconductor device comprises: a semiconductor chip; a base metal lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of leads disposed so that inner ends of said leads are positioned along the periphery of said die pad; copper wires to directly connect electrodes on said semiconductor chip to the inner ends of said plurality of leads; and a resin molded member to hermetically seal said semiconductor chip, a large proportion of said lead frame and said copper wires.
    Type: Application
    Filed: July 15, 2002
    Publication date: June 26, 2003
    Inventors: Tadao Fukatani, Hiroshi Masuda, Koji Motonami