Patents by Inventor Tadao FUKUTA

Tadao FUKUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240218521
    Abstract: A thixotropically molded product includes: a matrix portion containing Mg as a main component; and a particle portion dispersed in the matrix portion and containing ?-Al2O3 as a main component. In a cross section, a total area fraction of the particle portion in a range of 500 ?m square around a point at a depth of 1 mm from a surface is 0.5% or more and 30.0% or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Setsuya IWASHITA, Tetsuhiko TAKEUCHI, Yasutoshi HIDESHIMA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240216988
    Abstract: A thixotropically molded product includes: a matrix portion containing Mg as a main component; a first particle portion dispersed in the matrix portion and containing SiC as a main component; a second particle portion dispersed in the matrix portion and containing Mg2Si as a main component; and a third particle portion dispersed in the matrix portion and containing MgO as a main component. An area fraction of the first particle portion in a cross section is 0.68 or more and 19.6% or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Shunsuke UCHIZONO, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240218230
    Abstract: A thixotropically molded product includes: a matrix portion containing Mg as a main component; and carbon fibers dispersed in the matrix portion. An area fraction of the carbon fibers in a cross section is 1.0% or more and 30.0% or less. An average fiber length of the carbon fibers may be 15 ?m or more and 150 ?m or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240218484
    Abstract: A thixotropic molding material includes: a metal body containing Mg as a main component; AlN particles adhering to a surface of the metal body and containing AlN as a main component; and silica particles interposed between the metal body and the AlN particles, having an average particle diameter smaller than an average particle diameter of the AlN particles, and containing a silicon oxide as a main component. A mass fraction of the AlN particles in a total mass of the metal body and the AlN particles is 3.0% or more and 30.0% or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Setsuya IWASHITA, Tetsuhiko TAKEUCHI, Yasutoshi HIDESHIMA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240217813
    Abstract: A thixotropically molded product that generates hydrogen by contact with an aqueous solution includes: a matrix portion containing Mg as a main component; and a first particle portion dispersed in the matrix portion and containing, as a main component, any one of Fe, Ni, Co, Cu, and a compound containing at least one of the elements. An average particle diameter of the first particle portion in a cross section is 30.0 ?m or less, and an area fraction of the first particle portion in the cross section is 0.5% or more and 20.0% or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Yasutoshi HIDESHIMA, Shunsuke UCHIZONO, Setsuya IWASHITA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240218522
    Abstract: A thixotropically molded product includes: a matrix portion containing Mg as a main component; and a first particle portion dispersed in the matrix portion and containing c-BN or w-BN as a main component. An average particle diameter of the first particle portion in a cross section is 10.0 ?m or less, and an area fraction of the first particle portion in the cross section is 2.0% or more and 20.0% or less.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20240091851
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Patent number: 11878345
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 23, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
  • Patent number: 11865609
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 9, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Makoto Kato
  • Patent number: 11548066
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Hidefumi Nakamura
  • Publication number: 20220314314
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314315
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316070
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 ?m or more and 100 ?m or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316035
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiO2 particles containing SiO2 as a main component. An average particle diameter of the SiO2 particles is less than 20.0 ?m, and a mass fraction of the SiO2 particles in a total mass of the metal body and the SiO2 particles is 1.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20210291262
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Hidefumi NAKAMURA
  • Publication number: 20210291266
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Makoto KATO