Patents by Inventor Tadao FUKUTA

Tadao FUKUTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240091851
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 21, 2024
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Patent number: 11878345
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: January 23, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Shunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
  • Patent number: 11865609
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 9, 2024
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Makoto Kato
  • Patent number: 11548066
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 10, 2023
    Assignee: Seiko Epson Corporation
    Inventors: Koichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Hidefumi Nakamura
  • Publication number: 20220316070
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains Si particles containing Si as a main component. An average particle diameter of the Si particles is 1 ?m or more and 100 ?m or less, and a mass fraction of the Si particles in a total mass of the metal body and the Si particles is 1.0 mass % or more and 30.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314314
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains C particles containing C as a main component. A mass fraction of the C particles in a total mass of the metal body and the C particles is 5.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. The C particles may be graphite particles.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Yasutoshi HIDESHIMA, Setsuya IWASHITA, Fumiya MAEDA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220316035
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiO2 particles containing SiO2 as a main component. An average particle diameter of the SiO2 particles is less than 20.0 ?m, and a mass fraction of the SiO2 particles in a total mass of the metal body and the SiO2 particles is 1.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Fumiya MAEDA, Yasutoshi HIDESHIMA, Setsuya IWASHITA, Shunsuke UCHIZONO, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20220314315
    Abstract: A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
    Type: Application
    Filed: March 25, 2022
    Publication date: October 6, 2022
    Inventors: Shunsuke UCHIZONO, Setsuya IWASHITA, Yasutoshi HIDESHIMA, Fumiya MAEDA, Koichi OZAKI, Tadao FUKUTA
  • Publication number: 20210291266
    Abstract: A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Makoto KATO
  • Publication number: 20210291262
    Abstract: An injection molding material for magnesium thixomolding includes: a powder containing Mg as a main component; and a chip containing Mg as a main component, in which a proportion of the powder in the injection molding material for magnesium thixomolding is 5 mass % or more and 45 mass % or less, and a tap density of the powder is 0.15 g/cm3 or more.
    Type: Application
    Filed: March 22, 2021
    Publication date: September 23, 2021
    Inventors: Koichi OZAKI, Tadao FUKUTA, Yasutoshi HIDESHIMA, Hidefumi NAKAMURA