Patents by Inventor Tadao Furuta
Tadao Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9393785Abstract: A flexible cable includes a portion that is covered by a solder resist and an exposed portion that is not covered by the solder resist, in which the exposed portion contains a wiring terminal and at least continues to a position closer to an outside than an opening of a wiring member insertion side of a wiring vacant portion in a state in which the wiring terminal portion is connected to an element terminal of a piezoelectric element side and in which the wiring vacant portion is filled with an electrically insulating filling material in a state of covering a joining portion between the element terminal and the wiring terminal within the wiring vacant portion, and in a state in which a protective substrate, which forms the wiring vacant portion by partitioning, and the exposed portion of the flexible cable are not in contact with one another.Type: GrantFiled: March 13, 2014Date of Patent: July 19, 2016Assignee: Seiko Epson CorporationInventors: Ryota Kinoshita, Hiroaki Okui, Shunsuke Watanabe, Hitoshi Yamada, Tadao Furuta
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Patent number: 9259928Abstract: A liquid ejecting head includes a pressure element that applies a pressure to a pressure chamber which communicates with a nozzle which ejects a liquid, and a lead electrode that is joined to a wiring substrate which supplies a driving signal which drives the piezoelectric element, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.Type: GrantFiled: March 19, 2015Date of Patent: February 16, 2016Assignee: Seiko Epson CorporationInventors: Tatsuro Torimoto, Kazushige Hakeda, Tadao Furuta, Motoki Takabe
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Publication number: 20150217567Abstract: A liquid ejecting head includes a pressure element that applies a pressure to a pressure chamber which communicates with a nozzle which ejects a liquid, and a lead electrode that is joined to a wiring substrate which supplies a driving signal which drives the piezoelectric element, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.Type: ApplicationFiled: March 19, 2015Publication date: August 6, 2015Inventors: Tatsuro TORIMOTO, Kazushige HAKEDA, Tadao FURUTA, Motoki TAKABE
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Patent number: 9022527Abstract: A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.Type: GrantFiled: March 24, 2014Date of Patent: May 5, 2015Assignee: Seiko Epson CorporationInventors: Tatsuro Torimoto, Kazushige Hakeda, Tadao Furuta, Motoki Takabe
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Publication number: 20140292936Abstract: A flexible cable includes a portion that is covered by a solder resist and an exposed portion that is not covered by the solder resist, in which the exposed portion contains a wiring terminal and at least continues to a position closer to an outside than an opening of a wiring member insertion side of a wiring vacant portion in a state in which the wiring terminal portion is connected to an element terminal of a piezoelectric element side and in which the wiring vacant portion is filled with an electrically insulating filling material in a state of covering a joining portion between the element terminal and the wiring terminal within the wiring vacant portion, and in a state in which a protective substrate, which forms the wiring vacant portion by partitioning, and the exposed portion of the flexible cable are not in contact with one another.Type: ApplicationFiled: March 13, 2014Publication date: October 2, 2014Applicant: SEIKO EPSON CORPORATIONInventors: Ryota KINOSHITA, Hiroaki OKUI, Shunsuke WATANABE, Hitoshi YAMADA, Tadao FURUTA
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Publication number: 20140292942Abstract: A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.Type: ApplicationFiled: March 24, 2014Publication date: October 2, 2014Applicant: Seiko Epson CorporationInventors: Tatsuro TORIMOTO, Kazushige HAKEDA, Tadao FURUTA, Motoki TAKABE
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Patent number: 6076244Abstract: A method of manufacturing an actuator including an ink pump section made by forming a spacer plate with a plurality of window portions formed therein, a closure plate stacked on one side of the spacer plate for covering the window portions and a connection plate stacked on the other side of the spacer plate for covering the above window portions. These plates are formed as laminated ceramic green sheets that are later fired to form an integrated body. A piezoelectric/electrostrictive operating section composed of electrodes and a piezoelectric/electrostrictive layer is then formed on the outer surface of the closure plate. Thereafter, the actuator is pasted to a holding adhesive film and the holding adhesive film is stripped from the actuator after subjecting the actuator to a given inspection, if necessary, or to cutting into a given shape, if necessary. Subsequently, the actuator is heat-treated. Then, onto this actuator, an ink nozzle member with a plurality of nozzle holes is stacked and joined.Type: GrantFiled: November 12, 1998Date of Patent: June 20, 2000Assignees: Seiko Epson Corporation, NGK Insulators, Ltd.Inventors: Motonori Okumura, Takaichi Wada, Tadao Furuta, Shinsuke Yano, Tomohiro Yamada, Nobuo Takahashi