Patents by Inventor Tadao Hirakawa

Tadao Hirakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a package-type semiconductor assembly
    Patent number: 5151118
    Abstract: In production of a closed package-type semiconductor assembly provided with a built-in semiconductor element and conductive leads for connection to outside devices, a conductive island, the conductive leads and other accessories are united together by one stage moulding of molten glass. Simple process reduces the production cost greatly and no use of dusty ceramic components much raises functional reliability of the product.
    Type: Grant
    Filed: October 4, 1991
    Date of Patent: September 29, 1992
    Assignee: Kabushiki Kaisha Goto Seisakusho
    Inventors: Tadao Hirakawa, Sachio Tamura, Hiromitsu Sasanami