Patents by Inventor Tadao Hosaka

Tadao Hosaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10215456
    Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: February 26, 2019
    Assignees: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Arihiro Matsunaga, Masaki Chiba, Minoru Yoshikawa, Tadao Hosaka, Shunsuke Fujii, Akira Shoujiguchi, Kenichi Inaba, Masanori Sato
  • Patent number: 10149412
    Abstract: A refrigerant supply device with a small lateral width and a capacity to supply refrigerant evenly among heat receivers disposed in multiple tiers needs to be provided. A refrigerant supply device for distributing, by force of gravity, liquid phase refrigerant to heat receivers disposed in a plurality of tiers includes: a first conduit for supplying the refrigerant to the heat receivers; a second conduit provided in parallel with the first conduit; a first aperture provided in the first conduit for supplying the refrigerant to one of the heat receivers; a first blocking means provided below the first aperture for blocking the first conduit; a first communication opening provided above the first aperture and communicating the first conduit and the second conduit; a second communication opening provided below the first blocking means and communicating the first conduit and the second conduit; and a second blocking means provided below the second communication opening for blocking the second conduit.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: December 4, 2018
    Assignee: NEC PLATFORMS, LTD
    Inventor: Tadao Hosaka
  • Publication number: 20170311489
    Abstract: [Problem] A refrigerant supply device with a small lateral width and a capacity to supply refrigerant evenly among heat receivers disposed in multiple tiers needs to be provided.
    Type: Application
    Filed: October 14, 2015
    Publication date: October 26, 2017
    Applicant: NEC Platforms, Ltd.
    Inventor: Tadao HOSAKA
  • Publication number: 20160290691
    Abstract: It is difficult to avoid a decrease in cooling capacity without causing an increase in power consumption if a cooling device including a piping structure grows in size, therefore, a piping structure according to an exemplary aspect of the present invention includes a tubular part including a first flow passage through which a refrigerant flowing and a shell region surrounding the first flow passage; an introduction part composing a part of the shell region and including a second flow passage connected to the first flow passage; and a connection located at an end, between ends of the introduction part, on the side opposite to an end on a side where the second flow passage being connected to the first flow passage.
    Type: Application
    Filed: November 10, 2014
    Publication date: October 6, 2016
    Inventors: Masaki CHIBA, Minoru YOSHIKAWA, Akira SHOUJIGUCHI, Kenichi INABA, Arihiro MATSUNAGA, Masanori SATO, Tadao HOSAKA, Yasuhito NAKAMURA
  • Publication number: 20160282023
    Abstract: In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.
    Type: Application
    Filed: December 5, 2014
    Publication date: September 29, 2016
    Applicants: NEC Corporation, NEC Platforms, Ltd.
    Inventors: Arihiro MATSUNAGA, Masaki CHIBA, Minoru YOSHIKAWA, Tadao HOSAKA, Shunsuke FUJII, Akira SHOUJIGUCHI, Kenichi INABA, Masanori SATO
  • Patent number: 5123478
    Abstract: A cooling apparatus for cooling a given device which is incorporated in a computer or similar electronic equipment and generates heat by circulating a liquid coolant through the device of interest. A secondary cooling liquid exchanges heat with a primary cooling liquid in a heat exchanger and then flows into the device of the equipment. When the difference in temperature between the secondary cooling liquid and the interior of the equipment decreases beyond a predetermined value, a heat exchanging mechanism is caused to stop operating. On the increase of the difference in temperature beyond the predetermined value, the heat exchanging mechanism is caused to begin operating again. Alternatively, the operation of a secondary cooling liquid feeding mechanism may be interrupted and then set up again on the basis for the above-mentioned difference in temperature.
    Type: Grant
    Filed: April 26, 1991
    Date of Patent: June 23, 1992
    Assignee: NEC Corporation
    Inventor: Tadao Hosaka
  • Patent number: D519996
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: May 2, 2006
    Assignee: NEC Corporation
    Inventors: Hiroyuki Tsuzuki, Tadao Hosaka, Tetsuya Nagata
  • Patent number: D523427
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: June 20, 2006
    Assignee: NEC Corporation
    Inventors: Hiroyuki Tsuzuki, Tadao Hosaka, Tetsuya Nagata
  • Patent number: D535989
    Type: Grant
    Filed: February 10, 2005
    Date of Patent: January 30, 2007
    Assignee: NEC Corporation
    Inventors: Hiroyuki Tsuzuki, Tadao Hosaka, Tetsuya Nagata
  • Patent number: D469087
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: January 21, 2003
    Assignee: NEC Corporation
    Inventors: Hideo Sue, Shinya Akamatsu, Shinji Mine, Tadao Hosaka, Tetsuya Nagata
  • Patent number: D469430
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: January 28, 2003
    Assignee: NEC Corporation
    Inventors: Hideo Sue, Shinya Akamatsu, Shinji Mine, Tadao Hosaka, Tetsuya Nagata