Abstract: An electrostatic chuck device is characterized in the provision of a ceramic layer, which serves as an adsorption surface, via an electricity insulating elastic layer, and an electrode that is formed between the ceramic layer and the electricity insulating elastic layer. The electricity insulating elastic layer consists of an adhesive that contains a rubber component and a phenol-type antioxidant. This electrostatic chuck device does not easily experience wear or deformation, and has extremely high durability. The electricity insulating elastic layer relieves stress caused by differences in coefficients of thermal expansion during heating, or by slight volume changes in the resin material. As a result, the stress applied on the ceramic layer can be reduced, making it possible to limit a reduction in the degree of flatness and the like.

Abstract: The invention provides a semiconductor acceleration sensor which is small in size, light in weight, simple in manufacture, low in manufacturing cost, and high in accuracy, and which, with a switch-on time set to a predetermined value, is stable in operation. In a semiconductor acceleration sensor in which a central board 1 having a central contact section 11, and outside boards 2 at least one of which has an outside contact section 21 are stacked; the central board 1 has a weight 12 near the central contact section 11, and the outside board 2 having the outside contact section 21 has a weight confronting section 11 which confronts with the weight 12, for squeezed damping effect.

Abstract: The static chuck apparatus includes a metal substrate, a first adhesive layer provided on the metal substrate, a ceramic insulating plate provided on the first adhesive layer, a second adhesive layer provided on the ceramic insulating plate, an insulating film provided on the second adhesive layer, and an electrode provided between the second adhesive layer and the insulating film.

Abstract: A semiconductor acceleration sensor including a central board having a movable electrode section, an outside board having a stationary electrode section, and a sealing insulating section for joining the central board and the outside board which are laminated on each other, wherein the sealing insulating section has a conductive layer, and the conductive layer is a sealing member or an anodic bonding electrode.

Abstract: An acceleration sensor includes a first substrate, a second substrate and a third substrate. The second substrate has a through-hole, a first contact formed on an inner surface of the through-hole, and a first bonding pad connected to the first contact. An electrically conductive ball is accommodated in the through-hole. The third substrate has a recess, a second contact formed in the recess contacting the bottom of the electrically conductive ball, and a second bonding pad connected to the second contact.

Abstract: A semiconductor acceleration sensor comprising a rectangular semiconductor substrate on the moving electrode side and a rectangular semiconductor substrate on the fixed electrode side laminated on each other, the moving electrode side substrate being formed with a heavy weight and a thin cantilever, a moving electrode being provided on the heavy weight, a first electrostatic attraction electrode being provided on the cantilever, the fixed electrode side substrate being formed with a fixed electrode at a position opposed to the moving electrode and a second electrostatic attraction electrode at a position opposed to the electrostatic attraction electrode. The first and second electrostatic attraction electrodes are placed facing each other. A predetermined spacing is provided between the electrostatic attraction electrodes and a predetermined voltage is applied therebetween.

Abstract: In a semiconductor acceleration sensor, a weight and thin beam parts adjacent to the weight are formed on a substrate, a moving electrode is formed on the weight, and a fixed electrode is formed at a position of the other substrate opposed to the moving electrode. Both the electrodes come in contact with each other and conduct as a result of acceleration on the weight, whereby the semiconductor acceleration sensor operates. The fixed electrode or the moving electrode is formed with a projection toward the opposed electrode and the projection and the electrode come in contact with each other and conduct by action of acceleration with a predetermined spacing held between both the electrodes for preventing occurrence of chattering caused by the electrostatic attraction force between both the electrodes.

Abstract: The present invention is to provide an electrostatic chucking device having improved heat conductivity and at the same time increased adsorption area and improved adsorptity as well as having no uneveness on the wafer-provided face. The electrostatic chucking device of the present invention comprises a metal base, an adhesive layer, an electrode layer comprising a metal-deposited or metal-plated layer, and an electrically insulating layer possessing a face for providing a substance to be adhered by suction, laminated thereon in this order.

Abstract: An acceleration sensor is based on a semiconductor technique which is suitable for mass production. The resulting acceleration sensor is small in size and high in precision. The acceleration sensor includes a stationary section, an acting section to which a force is applied in response to acceleration, a flexible section through which the stationary section is coupled to the acting section, a plurality of distortion sensing elements coupled to the flexible section, a first weight having a bottomed hole which is gradually smaller in width towards the bottom of the hole, the first weight being coupled to the acting section and a second weight, greater in specific gravity than the first weight, coupled to the bottom of the hole of the first weight.

Abstract: The present invention is to provide an electrostatic chucking device having improved heat conductivity and at the same time increased adsorption area and improved adsorptity as well as having no uneveness on the wafer-provided face. The electrostatic chucking device of the present invention comprises a metal base, an adhesive layer, an electrode layer comprising a metal-deposited or metal-plated layer, and an electrically insulating layer possessing a face for providing a substance to be adhered by suction, laminated thereon in this order.