Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A wired circuit board is provided for controlling characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto. The invention provides improved signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board is adhesively bonded to an insulating base layer of the wired circuit board at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion is formed having a first terminal portion that connects with a read wire of the suspension board and a second terminal portion that connects with a write wire of the suspension board. An opening is provided adjacent to one of the first terminal portion and the second terminal portion and a stiffener board is adhesively bonded to the conductive board via an adhesive layer.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A wired circuit board having improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer. The invention prevents ionic impurities in the plating solution from remaining as residual or ionic contamination, thereby preventing a short circuit from developing when electric current flows through the circuit under a high temperature and high humidity environment. Lower end portions of the terminal portions that are formed on an insulating base layer and lower end portions of side surfaces and metal plating layers that cover the terminal portions are embedded in the insulating base layer in a flexible wired circuit board.

Abstract: A wired circuit board which even when a conductive pattern is formed in the form of fine pitch can provide improved adhesion between the conductive pattern and an insulating layer to prevent a plating solution from remaining between a metal plating layer and the insulating layer, so as to prevent ionic impurities in the plating solution from remaining as residual or ionic contamination, whereby even when electric current flows through the circuit under a high temperature and high humidity environment over a long term, a short circuit from ionic migration can be prevented to suppress insulating failure. Lower end portions of terminal portions 5 formed on an insulating base layer 2 and lower end portions of side surfaces and metal plating layers 6 covering over the terminal portions 5 are embedded in the insulating base layer 2 in a flexible wired circuit board 1 at one longitudinal end portion thereof exposed from an insulating cover layer 4.

Abstract: A wired circuit board that can control characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto with a simple structure, to improve signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board 25 is adhesively bonded to an insulating base layer 18 of the wired circuit board 1 at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion 11 having a first terminal portion 13 to connect with a read wire 6R of a suspension board with circuit 3 and a second terminal portion 14 to connect with a write wire 6W of the suspension board with circuit 3 is formed, in such a relation that an opening 27 can correspond in position to either of the first terminal portion 13 and the second terminal portion 14, and a stiffener board 24 is adhesively bonded to the conductive board 25 via an adhesive layer 28.

Abstract: To provide a suspension board with circuit that enables its terminals to be bonded to the other terminals with sufficient strength with simple structure, to ensure sufficient bonding reliability, the suspension board with circuit 11 includes a suspension board 12, a base layer 13 formed on the suspension board 12, and a conductive layer 14 formed on the base layer 13 and a cover layer 18 with which the conductive layer 14 is covered, wherein external connection terminals 17 to be bonded to terminals 28 of a read/write board 29 are formed without the suspension board 12 and/or the base layer 13 being formed.

Abstract: To provide a circuit board, having a circuit pattern of adequate high-frequency characteristics, for transmitting high-frequency electric signals at high speed, a circuit board, including a base layer formed of insulating material and a conductive layer formed on the base layer in the form of a specified circuit pattern, is so constructed that an air layer is made to lie between lines of wire of the circuit pattern or is so constructed that the lines of wire are covered with the cover layer but land portions of the base layer extending between the lines of wire are not covered with the cover layer. This construction of the invention enables dielectric constant between the lines of wire to be reduced and, as a result of this, the capacitance between the lines of wire can be reduced to provide improved high-frequency characteristics of the circuit pattern.