Patents by Inventor Tadao Tanaka

Tadao Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180185293
    Abstract: Provided is a bacterium-containing oral rapidly disintegrating tablet excellent in long-term stability of viable bacteria. It has been found that a disintegration time can be shortened and stability of viable bacteria can be improved by using a spray-drying method in a process of granulating viable bacteria.
    Type: Application
    Filed: July 5, 2016
    Publication date: July 5, 2018
    Inventors: Daisuke Koshiishi, Tadao Tanaka
  • Patent number: 9108289
    Abstract: A wafer polishing apparatus configured to polish simultaneously both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, the wafer polishing apparatus can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: August 18, 2015
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Publication number: 20150031271
    Abstract: A wafer polishing apparatus configured to polish simultaneously both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding bole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, the wafer polishing apparatus can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Application
    Filed: July 30, 2014
    Publication date: January 29, 2015
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Daisuke FURUKAWA, Kazumasa ASAI, Takahiro KIDA, Tadao TANAKA
  • Patent number: 8834230
    Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: September 16, 2014
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Publication number: 20110130073
    Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.
    Type: Application
    Filed: June 30, 2009
    Publication date: June 2, 2011
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
  • Patent number: 6764392
    Abstract: A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer.
    Type: Grant
    Filed: August 16, 2001
    Date of Patent: July 20, 2004
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Takashi Nihonmatsu, Takahiro Kida, Tadao Tanaka
  • Publication number: 20030209891
    Abstract: A structure of arranging an vehicle occupant protecting apparatus for an automotive vehicle, which can prevent a pillar garnish from scattering when an air bag installed in a front pillar portion is expanded, is provided. An air bag 16 is housed within a space formed by a front pillar main body 38 and a pillar garnish 40 in a front pillar portion 20. When the air bag 16 expands, the pillar garnish 40 is pressed by an expanding pressure of the air bag 16, so that an opening for expanding the air bag 16 is formed between the front pillar main body 38 and the pillar garnish 40, and the air bag 16 expands into a vehicle cabin through the opening. Since a non-expanding portion is formed at the air bag 16 and a hinge portion 46 is formed at the pillar garnish 40, the expanding pressure applied to the pillar garnish 40 when the air bag 16 expand is low, so that the pillar garnish 40 can be easily opened through the hinge portion 46.
    Type: Application
    Filed: May 19, 2003
    Publication date: November 13, 2003
    Inventors: Yasushi Kubota, Masamichi Aono, Goro Takahashi, Takuya Ohtsuka, Minoru Shibata, Yutaka Nagai, Hiroyuki Tajima, Fumitake Kobayashi, Hiroki Nakajima, Chiharu Totani, Tadao Tanaka, Katsunori Noto
  • Patent number: 6565117
    Abstract: A structure of arranging an vehicle occupant protecting apparatus for an automotive vehicle, which can prevent a pillar garnish from scattering when an air bag installed in a front pillar portion is expanded, is provided. An air bag 16 is housed within a space formed by a front pillar main body 38 and a pillar garnish 40 in a front pillar portion 20. When the air bag 16 expands, the pillar garnish 40 is pressed by an expanding pressure of the air bag 16, so that an opening for expanding the air bag 16 is formed between the front pillar main body 38 and the pillar garnish 40, and the air bag 16 expands into a vehicle cabin through the opening. Since a non-expanding portion is formed at the air bag 16 and a hinge portion 46 is formed at the pillar garnish 40, the expanding pressure applied to the pillar garnish 40 when the air bag 16 expand is low, so that the pillar garnish 40 can be easily opened through the hinge portion 46.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: May 20, 2003
    Assignees: Toyota Jidosha Kabushiki Kaisha, Toyoda Gosei Co., Ltd.
    Inventors: Yasushi Kubota, Masamichi Aono, Goro Takahashi, Takuya Ohtsuka, Minoru Shibata, Yutaka Nagai, Hiroyuki Tajima, Fumitake Kobayashi, Hiroki Nakajima, Chiharu Totani, Tadao Tanaka, Katsunori Noto
  • Publication number: 20020160693
    Abstract: A polishing method and polishing apparatus capable of improving the flatness of a wafer are provided. When a wafer is adhered to a wafer holding plate for polishing a surface to be polished of the wafer by pressing and rubbing the surface to be polished against a polishing pad on a polishing turn table, the wafer is held by vacuum-chucking the surface to be polished of the wafer such that a surface to be adhered of the wafer forms a convex surface in a vicinity including an arbitrary point in the surface to be adhered within a region surrounding a center of the surface to be adhered of the wafer, and the region being at least not less than 50% of an entire adhesion area; and the wafer is adhered to the wafer holding plate from a central portion of the surface to be adhered of the wafer.
    Type: Application
    Filed: August 16, 2001
    Publication date: October 31, 2002
    Inventors: Takashi Nihonmatsu, Takahiro Kida, Tadao Tanaka
  • Publication number: 20020024202
    Abstract: A structure of arranging an vehicle occupant protecting apparatus for an automotive vehicle, which can prevent a pillar garnish from scattering when an air bag installed in a front pillar portion is expanded, is provided. An air bag 16 is housed within a space formed by a front pillar main body 38 and a pillar garnish 40 in a front pillar portion 20. When the air bag 16 expands, the pillar garnish 40 is pressed by an expanding pressure of the air bag 16, so that an opening for expanding the air bag 16 is formed between the front pillar main body 38 and the pillar garnish 40, and the air bag 16 expands into a vehicle cabin through the opening. Since a non-expanding portion is formed at the air bag 16 and a hinge portion 46 is formed at the pillar garnish 40, the expanding pressure applied to the pillar garnish 40 when the air bag 16 expand is low, so that the pillar garnish 40 can be easily opened through the hinge portion 46.
    Type: Application
    Filed: August 14, 2001
    Publication date: February 28, 2002
    Inventors: Yasushi Kubota, Masamichi Aono, Goro Takahashi, Takuya Ohtsuka, Minoru Shibata, Yutaka Nagai, Hiroyuki Tajima, Fumitake Kobayashi, Hiroki Nakajima, Chiharu Totani, Tadao Tanaka, Katsunori Noto
  • Patent number: 6333515
    Abstract: A structure of arranging an vehicle occupant protecting apparatus for an automotive vehicle, which can prevent a pillar garnish from scattering when an air bag installed in a front pillar portion is expanded, is provided. An air bag 16 is housed within a space formed by a front pillar main body 38 and a pillar garnish 40 in a front pillar portion 20. When the air bag 16 expands, the pillar garnish 40 is pressed by an expanding pressure of the air bag 16, so that an opening for expanding the air bag 16 is formed between the front pillar main body 38 and the pillar garnish 40, and the air bag 16 expands into a vehicle cabin through the opening. since a non-expanding portion is formed at the air bag 16 and a hinge portion 46 is formed at the pillar garnish 40, the expanding pressure applied to the pillar garnish 40 when the air bag 16 expand is low, so that the pillar garnish 40 can be easily opened through the hinge portion 46.
    Type: Grant
    Filed: July 31, 1998
    Date of Patent: December 25, 2001
    Assignees: Toyota Jidosha Kabushiki Kaisha, Toyoda Gosei Co., Ltd.
    Inventors: Yasushi Kubota, Masamichi Aono, Goro Takahashi, Takuya Ohtsuka, Minoru Shibata, Yutaka Nagai, Hiroyuki Tajima, Fumitake Kobayashi, Hiroki Nakajima, Chiharu Totani, Tadao Tanaka, Katsunori Noto
  • Patent number: 6296269
    Abstract: An air bag cover is formed of synthetic resin and is connected to and held by the body of a car in a plurality of discontinuous portions thereof along the peripheral edge of an opening formed on the interior side of the car in such a manner that the air bag cover not only can cover an air bag folded in the peripheral edge of the opening on the car interior side, but also, when an air bag main body of the air bag is developed and expanded, can be so opened and moved as to allow the air bag main body to project toward the opening side. The air bag cover further includes a restricting wall which projects toward the body of the car in such a manner that it can connect together these connecting/holding portions while the restricting wall is disposed on the back surface side of the air bag cover, in more particular, on the side of the folded air bag main body that is distant from the opening and on the opening side of connecting/holding portions.
    Type: Grant
    Filed: May 12, 1999
    Date of Patent: October 2, 2001
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Yutaka Nagai, Chiharu Totani, Fumitake Kobayashi, Tadao Tanaka, Hiroyuki Tajima, Hiroshi Ishiyama
  • Patent number: 5823608
    Abstract: There is disclosed a vehicle window-opening device for quickly opening a vehicle window manually or automatically. If the vehicle should fall into a sea or river, the window-opening device prevents the passengers from being confined within the vehicle. If the vehicle is fitted with an air bag system, any secondary accident can be prevented. More specifically, there is provided a device for opening a window mounted in a door of a vehicle having a window-driving mechanism for causing the window to slide up or down, the device comprising a gas source, a gas-ejecting mechanism for ejecting the gas of the gas source manually or automatically, and an actuator actuated by an ejected gas from the gas-ejecting mechanism. Wherein a driving force of the actuator is transmitted to the window-driving mechanism, thus driving the window open.
    Type: Grant
    Filed: December 17, 1997
    Date of Patent: October 20, 1998
    Assignee: Nippon Pneumatics/Fluidics Systems Co. Ltd.
    Inventors: Tadao Tanaka, Naotsuka Nagai
  • Patent number: 5557525
    Abstract: A wheel alignment control method for a motor vehicle and a control apparatus therefor in which every time a vehicle drive state, steering history, and high-speed steering-hold mode are discriminated by sensor outputs, a processor determines target values of a caster angle, camber angle, and toe angle in accordance with inference outputs computed by fuzzy inference based on fuzzy rules, corresponding individually to a plurality of vehicle drive modes, steering modes, and high-speed steering-hold mode, and discrimination results. Operating sections adjust the camber and the like by means of a driver circuit which responds to the processor outputs. Thus, a fine adjustment for alignment is made, and wheel alignment adaptable to the vehicle drive modes and the like is established.
    Type: Grant
    Filed: September 27, 1995
    Date of Patent: September 17, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Yoshiki Miichi, Tadao Tanaka, Mitsuhiko Harara
  • Patent number: 5519614
    Abstract: An electronically controlled power steering apparatus responsive to a running condition of a vehicle includes a vehicle speed sensor for detecting a running speed of the vehicle, a detector for detecting a lateral acceleration of the vehicle, and a control unit for setting an aimed assist amount setting based upon the running speed detected by the vehicle speed sensor and the lateral acceleration detected by the lateral acceleration detector in accordance with a fuzzy rule.
    Type: Grant
    Filed: September 22, 1993
    Date of Patent: May 21, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Yoshinori Miichi, Mitsuhiko Harara, Tadao Tanaka
  • Patent number: 5513720
    Abstract: A power steering apparatus for a vehicle including a steering mechanism having a torsion bar, a rotary valve connected to an oil pump and disposed between an input shaft and an output shaft, a valve driving mechanism having a pressed portion projected on either the input shaft or the output shaft and a plunger on the one shaft of the input shaft or output shaft on which the pressed portion is not projected for pressing the pressed portion, setting a target assist force of an assist force of an assist force obtained by rotating the rotary valve in the torsion direction of the torsion bar and an assist force obtained by rotating the rotary valve in the reverse direction to the torsion direction, a plunger driving mechanism for driving the plunger so that the preset assist force is obtained, controlling the pressure itself of the rotary valve to the operation angle of the rotary valve, whereby varying the steering force of the steering wheel over a wide range of steering condition with a reduced burden to the dr
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: May 7, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Youichi Yamamoto, Mitsuhiko Harara, Hiroaki Yoshida, Nobuo Momose, Tadao Tanaka, Tsuyoshi Takeo
  • Patent number: 5508919
    Abstract: A control system and control method for a power steering apparatus includes a vehicle speed sensor for detecting a running speed V of a vehicle and a steering angle sensor for detecting a steering angle ha of the vehicle. It further includes a steering holding degree calculation unit to determine a steering holding coefficient K.sub.S from a steering angular velocity ha', a steering angle changing amount H, and a lateral acceleration G.sub.Y. Finally, a fuzzy logic calculation unit is included for setting a target steering assist amount in accordance with a fuzzy logic rule using the vehicle speed V and a product V.multidot.G.sub.Y of the vehicle speed V and the lateral acceleration G.sub.Y as input conditions (membership functions).
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: April 16, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Hidekazu Suzuki, Mitsuhiko Harara, Tadao Tanaka
  • Patent number: 5487007
    Abstract: In a control system for a power steering apparatus, in which a steering assist amount in a steering mechanism of a vehicle is controlled to a target assist amount, a vehicle speed sensor 41 for detecting a running speed V of the vehicle and a steering angle sensor 52 for detecting a steering angle ha of the vehicle are provided. A lateral acceleration calculation unit calculates a lateral acceleration GY from the vehicle speed V and the steering angle ha and further determines the product V.GY of the vehicle speed V and the lateral acceleration GY. A fuzzy logic calculation unit then sets the target assist amount in accordance with a fuzzy logic rule using the vehicle speed V and the product V.GY as input conditions (membership functions). This thereby provides a control system and control method for controlling a power steering apparatus which presents an optimum steering characteristic in response to the running condition of the vehicle.
    Type: Grant
    Filed: June 1, 1994
    Date of Patent: January 23, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Hidekazu Suzuki, Mitsuhiko Harara, Tadao Tanaka
  • Patent number: 5481458
    Abstract: Operation amounts of actuators are controlled in response to a steering wheel angle .theta.h, a steering wheel angular velocity .theta.hs, and a road surface .mu., in addition to a vehicle speed Vel, to change a caster angle. The caster angle is increased to increase a righting moment of vehicle wheels during steering. The caster angle is increased according to the vehicle speed Vel in non-steering and initial steering conditions, to stabilize the vehicle. This thereby improves the vehicle stability in normal and transitional conditions.
    Type: Grant
    Filed: June 15, 1994
    Date of Patent: January 2, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Mitsuhiko Harara, Yoshiki Miichi, Tsuyoshi Takeo, Tadao Tanaka
  • Patent number: 5480221
    Abstract: A control method and an apparatus therefor, in which the braking force distribution to rear wheels is increased in a normal state, while the braking force distribution to the rear wheels is reduced to prevent the rear wheels from being locked in an early stage when the road surface is slippery. There are provided a pressure sensor (74) for detecting a master cylinder pressure, proportioning valves (57.sub.1, 57.sub.2) arranged in passages which connect a master cylinder and rear wheel cylinders and adapted to operate so that the ratios of the wheel cylinder pressures to the master cylinder pressure are low in a region where the master cylinder pressure is not lower than a predetermined pressure, normally-open switching valves (62, 63) by-passing the two valves, and a controller (71).
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: January 2, 1996
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Takao Morita, Tsutomu Matsukawa, Hiromichi Yasunaga, Tadao Tanaka, Akihiko Togashi, Yasutaka Taniguchi, Masanori Tani