Patents by Inventor Tadao Torii

Tadao Torii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8226398
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: July 24, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Kooki Ooyama, Shinsuke Ikishima, Naoto Hayashi, Tadao Torii, Toshihisa Yamane, Yuuki Katou
  • Publication number: 20120112380
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, including: one or a plurality of extruders; a die into which one or a plurality of resin materials are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and the stabilizers rotate in one direction around the central axis of the cylindrically-shaped resin materials.
    Type: Application
    Filed: November 15, 2011
    Publication date: May 10, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kooki OOYAMA, Shinsuke IKISHIMA, Naoto HAYASHI, Tadao TORII, Toshihisa YAMANE, Yuuki KATOU
  • Publication number: 20120070658
    Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a heat-resistant layer; a base layer; and a pressure-sensitive adhesive layer in this order, wherein: the pressure-sensitive adhesive tape has an elastic modulus, i.e., Young's modulus at 25° C. of 150 MPa or less; and the heat-resistant layer contains a polypropylene-based resin polymerized by using a metallocene catalyst, the polypropylene-based resin having a melting point of 110° C. to 200° C. and a molecular weight distribution “Mw/Mn” of 3 or less.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinsuke IKISHIMA, Takashi HABU, Fumiteru ASAI, Kooki OOYAMA, Tadao TORII, Katsutoshi KAMEI, Yuuki KATOU, Tomokazu TAKAHASHI
  • Publication number: 20120070661
    Abstract: A pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a pressure-sensitive adhesive layer; and a base layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene- (1-butene) copolymer polymerized by using a metallocene catalyst, the amorphous propylene-(1-butene) copolymer having a weight-average molecular weight (Mw) of 200,000 or more and a molecular weight distribution (Mw/Mn) of 2 or less; and the base layer contains an ethylene-vinyl acetate copolymer.
    Type: Application
    Filed: September 14, 2011
    Publication date: March 22, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinsuke IKISHIMA, Takashi HABU, Fumiteru ASAI, Kooki OOYAMA, Tadao TORII, Katsutoshi KAMEI, Yuuki KATOU, Tomokazu TAKAHASHI
  • Patent number: 8092204
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, the apparatus including: one or a plurality of extruders; a die into which one or a plurality of resin materials including at least a resin material for forming a pressure-sensitive adhesive layer and extruded respectively from the extruders are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: January 10, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Kooki Ooyama, Shinsuke Ikishima, Naoto Hayashi, Tadao Torii, Toshihisa Yamane, Yuuki Katou
  • Publication number: 20110233827
    Abstract: The present invention provides an apparatus for inflation extrusion molding of pressure-sensitive adhesive sheet, the apparatus including: one or a plurality of extruders; a die into which one or a plurality of resin materials including at least a resin material for forming a pressure-sensitive adhesive layer and extruded respectively from the extruders are respectively introduced and which extrudes from an ejection opening the resin materials into an inflated cylindrical shape having a predetermined diameter in accordance with an inflation method; and two stabilizers facing each other at a predetermined angle so as to upwardly approach each other, and defining a space therebetween through which the cylindrically-shaped resin materials extruded from the die are passed to be deformed into a pressure-sensitive adhesive sheet in a flattened elliptical shape having a predetermined width, in which the stabilizers each have a plurality of air floating portions each of which blows air toward the resin materials; and
    Type: Application
    Filed: July 8, 2010
    Publication date: September 29, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Kooki OOYAMA, Shinsuke IKISHIMA, Naoto HAYASHI, Tadao TORII, Toshihisa YAMANE, Yuuki KATOU
  • Patent number: 7556762
    Abstract: The invention provides a method of inflation extrusion molding, comprising: introducing one or more resin materials extruded from one or more extruders into a die; subsequently extruding the resin material(s) from the die and inflating the extrudate into a cylindrical shape having a predetermined diameter by blown-film extrusion; and then passing the cylindrical inflated resin material through a space between stabilizers which face each other at a predetermined angle, to deform the cylindrical resin material into a flat tube shape having an elongated elliptic section, thereby producing a film or sheet having a predetermined width, wherein the deformation of the cylindrical inflated resin material into a flat tube shape having an elongated elliptic section is assisted by a guide device to thereby facilitate the deformation.
    Type: Grant
    Filed: September 16, 2004
    Date of Patent: July 7, 2009
    Assignee: Nitto Denko Corporation
    Inventors: Kooki Ooyama, Masayoshi Natsume, Keiji Hayashi, Tadao Torii
  • Publication number: 20050056973
    Abstract: The invention provides a method of inflation extrusion molding, comprising: introducing one or more resin materials extruded from one or more extruders into a die; subsequently extruding the resin material(s) from the die and inflating the extrudate into a cylindrical shape having a predetermined diameter by blown-film extrusion; and then passing the cylindrical inflated resin material through a space between stabilizers which face each other at a predetermined angle, to deform the cylindrical resin material into a flat tube shape having an elongated elliptic section, thereby producing a film or sheet having a predetermined width, wherein the deformation of the cylindrical inflated resin material into a flat tube shape having an elongated elliptic section is assisted by a guide device to thereby facilitate the deformation.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 17, 2005
    Inventors: Kooki Ooyama, Masayoshi Natsume, Keiji Hayashi, Tadao Torii