Abstract: A method of manufacturing a semiconductor device is disclosed that includes a semiconductor wafer having a main surface including a device chip area, a peripheral area encompassing the device chip area, and a blank area situated between the device chip area and the peripheral area. The method includes the steps of coating the entire main surface of the semiconductor wafer with a positive photosensitive resist, defining an additional exposure area in the blank area, conducting a first exposure process on the peripheral area and the additional exposure area, conducting a second exposure process on the device chip area, removing resist remaining on predetermined areas of the device chip area, the peripheral area and the blank area after conducting the first and second exposure processes for forming a resist pattern, and dry-etching the main surface of the semiconductor wafer by using the resist pattern as a mask.

Abstract: A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, whereby the plurality of projection patterns have different area ratios R with respect to the corresponding substrates, and performing a flattening process on the interlayer insulating films before linear approximation; a step of obtaining a linear approximation formula R=aT+b expressing a relationship between the area ratio R and a polishing time T, where R1, R2, R3, . . . , Rx represent the area ratio R of each of the projecting patterns with respect to the corresponding substrates, and T1, T2, T3, . . .

Abstract: A disclosed semiconductor wafer includes plural semiconductor chip areas each having a color pattern capable of tracing the positional information of the semiconductor chip with respect to the semiconductor wafer. Each of the plural semiconductor chip areas arranged in a matrix manner on the semiconductor wafer includes an underlying insulation film; a wiring pattern and a frame-shaped wiring dummy pattern formed on the underlying insulation film; and plural insulation films formed on the upper side of the underlying insulation film, the wiring pattern, and the wiring dummy pattern. At least one SOG film is included in the plural insulation films, in which a color pattern in accordance with a distance from the center of the semiconductor wafer based on the SOG film is formed on a surface of the insulator film within the wiring dummy pattern in top view.

Abstract: A chemical mechanical polishing method including a step of forming a plurality of interlayer insulating films so as to coat a plurality of projecting patterns, at least one of the plurality of projecting patterns being formed on each of a plurality of substrates, whereby the plurality of projection patterns have different area ratios R with respect to the corresponding substrates, and performing a flattening process on the interlayer insulating films before linear approximation; a step of obtaining a linear approximation formula R=aT+b expressing a relationship between the area ratio R and a polishing time T, where R1, R2, R3, . . . , Rx represent the area ratio R of each of the projecting patterns with respect to the corresponding substrates, and T1, T2, T3, . . .

Abstract: A disclosed semiconductor wafer includes plural semiconductor chip areas each having a color pattern capable of tracing the positional information of the semiconductor chip with respect to the semiconductor wafer. Each of the plural semiconductor chip areas arranged in a matrix manner on the semiconductor wafer includes an underlying insulation film; a wiring pattern and a frame-shaped wiring dummy pattern formed on the underlying insulation film; and plural insulation films formed on the upper side of the underlying insulation film, the wiring pattern, and the wiring dummy pattern. At least one SOG film is included in the plural insulation films, in which a color pattern in accordance with a distance from the center of the semiconductor wafer based on the SOG film is formed on a surface of the insulator film within the wiring dummy pattern in top view.

Abstract: A method of manufacturing a semiconductor device is disclosed that includes a semiconductor wafer having a main surface including a device chip area, a peripheral area encompassing the device chip area, and a blank area situated between the device chip area and the peripheral area. The method includes the steps of coating the entire main surface of the semiconductor wafer with a positive photosensitive resist, defining an additional exposure area in the blank area, conducting a first exposure process on the peripheral area and the additional exposure area, conducting a second exposure process on the device chip area, removing resist remaining on predetermined areas of the device chip area, the peripheral area and the blank area after conducting the first and second exposure processes for forming a resist pattern, and dry-etching the main surface of the semiconductor wafer by using the resist pattern as a mask.

Abstract: A fixing device for an image forming apparatus includes a heat roller, a fixing roller, an endless belt passed over the heat roller and fixing roller and driven to turn, a press roller pressed against the fixing roller with the intermediary of the endless belt. A recording medium is passed between the belt and the press roller. The fixing device additionally includes at least one contact member contacting the belt. Part of the at least one contact member is formed of at least one of heat-resistant felt or heat-resistant resin. The contact member contacts the surface of part of the belt contacting the heat roller.

Abstract: An image forming apparatus includes an apparatus body, a heat roller, a fixing roller, a press roller pressed against the fixing roller, and endless belt passed over the heat roller and fixing roller, and a tension roller applying tension to the endless belt. The heat roller, fixing roller, endless belt and tension roller are constructed into a unit member, which is removably mounted to the apparatus body.

Abstract: A fixing device having an endless fixing belt configured to convey a sheet-like medium on which a toner image is to be fixed, heating and fixing rollers having the fixing belt wound thereon, and a pressing roller disposed opposite to the fixing roller having fixing belt wound thereon to form a nip portion between the fixing belt and pressing roller. The fixing device also including first to third heaters provided in the heating, pressure and fixing rollers respectively, and first to third voltage applying devices configured to apply voltages to the first to third heaters respectively. The nip portion is configured to perform the fixing only by pressure contact between said fixing and pressing rollers via said fixing belt.

Abstract: An image forming apparatus of the present invention includes a heat roller, a fixing roller, a press roller pressed against the fixing roller, and an endless belt passed over the heat roller and fixing roller. The surface of the press roller and that of the fixing roller have hardness of 70 or above and hardness of 60 or above, respectively, in terms of ASKER-C hardness. This successfully prevents a recording medium from wrapping around the belt and jamming a path or creasing.

Abstract: An image forming apparatus of the present invention includes an apparatus body, a heat roller, a fixing roller, a press roller pressed against the fixing roller, an endless belt passed over the heat roller and fixing roller, and a tension roller applying tension to the endless belt. The heat roller, fixing roller, endless belt and tension roller are constructed into a unit member, which is removably mounted to apparatus body.

Abstract: A fixing device for an image forming apparatus of the present invention includes a heat roller, a fixing roller, an endless belt passed over the heat roller and fixing roller and driven to turn, a press roller pressed against the fixing roller with the intermediary of the endless belt. The recording medium is passed between the belt and the press roller. The device additionally includes at least one contact member contacting the belt. Part of the at least one contact member is formed of at least one of heat-resistant felt and heat-resistant resin. The contact member contacts the surface of part of the belt contacting the heat roller.

Abstract: A fixing device having an endless fixing belt configured to convey a sheet-like medium on which a toner image is to be fixed, heating and fixing rollers having the fixing belt wound thereon, and a pressing roller disposed opposite to the fixing roller having fixing belt wound thereon to form a nip portion between the fixing belt and pressing roller. The fixing device also including first to third heaters provided in the heating, pressure and fixing rollers respectively, and first to third voltage applying devices configured to apply voltages to the first to third heaters respectively. The nip portion is configured to perform the fixing only by pressure contact between said fixing and pressing rollers via said fixing belt.