Patents by Inventor Tadaomi Fujieda

Tadaomi Fujieda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9307682
    Abstract: An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: April 5, 2016
    Assignee: Sony Corporation
    Inventors: Tadaomi Fujieda, Tatsuhito Aono
  • Publication number: 20140321058
    Abstract: An apparatus includes a display. The display may include a frame disposed at a bottom surface of the display. The apparatus may include a semiconductor chip. A heat pipe constructed of a thermally conductive material may be affixed to the frame. A surface of the heat pipe may oppose the semiconductor chip at a predetermined distance from the semiconductor chip.
    Type: Application
    Filed: April 30, 2013
    Publication date: October 30, 2014
    Applicant: SONY CORPORATION
    Inventors: Tadaomi FUJIEDA, Tatsuhito Aono
  • Publication number: 20130223025
    Abstract: Provided is an electronic device including a housing, at least a part of which has conductive properties; a substrate on which a heating element is mounted and which has a ground pattern; and a spacer which is located between the housing and the ground pattern and which includes a main body portion having heat insulating properties and a conductive portion which is in contact with the ground pattern and the housing and which conducts current between the ground pattern and the housing.
    Type: Application
    Filed: August 17, 2012
    Publication date: August 29, 2013
    Applicant: SONY CORPORATION
    Inventors: Tadaomi Fujieda, Takashi Nakamura
  • Publication number: 20100084123
    Abstract: Disclosed is a cooling apparatus including a heat sink, a blower mechanism, an opening member, and a movement mechanism. The blower mechanism has a blower opening that has a predetermined area and is opposed to the heat sink. The opening member has a first opening that has an area smaller than the area of the blower opening. The movement mechanism moves the opening member so that switching between a first state and a second state is performed. The first state is a state in which the first opening is disposed between the blower opening and the heat sink, and the second state is a state in which the first opening is removed from between the blower opening and the heat sink.
    Type: Application
    Filed: September 25, 2009
    Publication date: April 8, 2010
    Applicant: SONY CORPORATION
    Inventors: Yuji Shishido, Takashi Mochida, Toru Kimura, Tadaomi Fujieda
  • Publication number: 20080226446
    Abstract: There is provided a centrifugal impeller that includes a boss portion, a plurality of first centrifugal blades, a plurality of second centrifugal blades, and a coupling portion. The boss portion is capable of rotating. The plurality of first centrifugal blades are provided to the boss portion such that the plurality of first centrifugal blades extend from the boss portion. The plurality of second centrifugal blades are provided around the boss portion such that the plurality of second centrifugal blades are spaced apart from the boss portion. The coupling portion couples the plurality of first centrifugal blades and the plurality of second centrifugal blades.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 18, 2008
    Applicant: SONY CORPORATION
    Inventor: Tadaomi Fujieda