Patents by Inventor Tadashi Akiike

Tadashi Akiike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6439496
    Abstract: A spool holder structure used in, for instance, a bonding apparatus and equipped with a spool holder that holds a spool around which a wire is wound, a holder shaft which is fastened to the inner circumference of the spool holder, a holder fastening shaft made of an insulating material and fastened to the inner circumference of the holder shaft, and a motor that has an output shaft fastened to the holder fastening shaft, in which the holder shaft is fastened to an attachment plate of, for instance, the bonding apparatus via a conductive bearing so that the holder shaft is rotatable, and the conductive bearing is grounded.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: August 27, 2002
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Yoshimitsu Terakado, Takatoshi Kawamura, Tadashi Akiike
  • Publication number: 20010002038
    Abstract: A spool holder structure used in, for instance, a bonding apparatus and equipped with a spool holder that holds a spool around which a wire is wound, a holder shaft which is fastened to the inner circumference of the spool holder, a holder fastening shaft made of an insulating material and fastened to the inner circumference of the holder shaft, and a motor that has an output shaft fastened to the holder fastening shaft, in which the holder shaft is fastened to an attachment plate of, for instance, the bonding apparatus via a conductive bearing so that the holder shaft is rotatable, and the conductive bearing is grounded.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 31, 2001
    Applicant: KABUSHIKI KAISHA SHINKAWA
    Inventors: Yoshimitsu Terakado, Takatoshi Kawamura, Tadashi Akiike
  • Patent number: 6135338
    Abstract: An ultrasonic horn that has a capillary attachment hole to hold a capillary therein so as to be used in wire bonding, including a perpendicular slit provided on the opposite side of the capillary attachment hole from the tip end of the ultrasonic horn. An area surrounding the capillary attachment hole is formed thin, and the slit is narrowed and tightened by a bolt so as to insure a stable capillary holding force and prevent deterioration in the holding force over time.
    Type: Grant
    Filed: October 12, 1998
    Date of Patent: October 24, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Minoru Kawagishi, Mitsuaki Sakakura, Tadashi Akiike
  • Patent number: 5904286
    Abstract: An ultrasonic horn used in, for instance, wire bonding having a structure for holding a capillary therein, the capillary holding structure including an external screw section which protrudes from the end surface of the horn and a spacer mount which is larger in diameter than the external screw section and formed on the root portion of the external screw section. A ring-form spacer is mounted on the spacer mount, and the spacer has a shape that prevents the rotation of the spacer on the spacer mount and is formed so that its vertically opposing end portions are positioned above and below the capillary attachment hole, and the length between the horizontally opposing end portions of the spacer is shorter than the length of the vertically opposing end portions.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: May 18, 1999
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Minoru Kawagishi, Mitsuaki Sakakura, Tadashi Akiike
  • Patent number: 5540807
    Abstract: An ultrasonic horn of a bonding apparatus quipped with a bonding tool attached to one end of the horn and a vibration-generating source such as an electrostrictive strain element, magnetostrictor, etc. attached to a bonding arm that supports the bonding horn. The ultrasonic horn is further provided with a vertical vibration adjuster which adjusts the vertical component of the vibration of the ultrasonic horn, and the vertical vibration adjuster includes a projection, recess, etc. provided at the end of the horn.
    Type: Grant
    Filed: November 29, 1994
    Date of Patent: July 30, 1996
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Tadashi Akiike, Minoru Kawagishi, Mitsuaki Sakakura
  • Patent number: 5385288
    Abstract: A bonding apparatus used in manufacturing semiconductor devices, etc. including an ultrasonic horn mounted to a bonding arm of the bonding apparatus via a horn support. The ultrasonic horn is provided with a bonding tool at one end and a vibration-generating source at another end, and respective values of vibrational wavelengths on both sides of the horn support are set so that the value on the bonding tool side of the horn support is 7 or greater relative to a value of 3 on the opposite side of the horn support from the capillary. In other words, the distance from the horn support to the end of the vibration-generating source is set to be 1/4 of the wavelength, and the distance from the horn support to the end of the horn where the bonding tool is attached is set to be 3/4 of the wavelength.
    Type: Grant
    Filed: December 22, 1993
    Date of Patent: January 31, 1995
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Ryuichi Kyomasu, Mitsuaki Sakakura, Minoru Kawagishi, Tadashi Akiike