Abstract: An optical unit includes: a reflection portion which reflects an incident light flux from an incident direction on the outside in a reflection direction toward an imaging element; a movable body including the reflection portion; a fixed body; a movable mechanism which allows the movable body to move relative to the fixed body; and a gimbal mechanism including a first support portion which supports the movable body swingably about a first axis, and including a second support portion which is swingably supported by the fixed body about a second axis intersecting the first axis direction.

Abstract: A film formation method comprising: placing a substrate on a substrate table provided in a treatment container, discharging air inside the treatment container to reduce pressure therein; producing plasma by applying a combination of a high-frequency power and a direct-current pulsed voltage to the substrate table while supplying a treatment gas containing a carbon-containing gas into the pressure-reduced treatment container, to form a carbon film on the substrate.

Abstract: An isolation amplifier of an embodiment includes: a primary circuit including an encoder configured to encode an input signal and output the encoded input signal and an anomaly detection circuit configured to detect anomaly having occurred to the input signal and generate a detection signal; an isolation unit configured to insulate the primary circuit from a secondary circuit; an output circuit configured to generate an output signal corresponding to the input signal; and an anomaly-input sensing-output circuit configured to generate an output signal from the secondary circuit by changing the output signal from the output circuit based on the detection signal.

Abstract: A novel disc brake shim and disc brake that can effectively suppress occurrence of vibration and squeal, are easy to manufacture and have excellent quality stability are provided. The disc brake shim includes a base material layer formed of a metal sheet, and a rubber layer that is laminated and disposed on at least a part of a main surface on one side of the base material layer and contains pores derived from a plurality of hollow microcapsules inside, and the disc brake includes pad materials on both sides in an axial direction of a disc rotor, and shims on opposite sides from the disc rotor, of the pad materials adjacently, wherein each of the shims is the disc brake shim of the present invention.

Abstract: A semiconductor device includes: a first semiconductor chip including a first coil that generates a magnetic field signal; a wiring board including a second coil, a third coil, and a twisted pair wiring, the second coil being disposed to face the first coil and receiving the magnetic field signal generated by the first coil, the twisted pair wiring connecting the second coil with the third coil; and a second semiconductor chip including a fourth coil disposed to face the third coil and receiving a magnetic field signal generated by the third coil.

Abstract: A novel disc brake shim and a disc brake that can effectively suppress vibration and squeal are provided. The disc brake shim that is formed of a multilayer structure with three layers or more including at least a base material layer formed of a metal sheet, and a foamed rubber layer that is laminated on a main surface on one side of the base material layer, wherein the foamed rubber layer is an intermediate layer of the multilayer structure, and the disc brake including pad materials on both sides in an axial direction of a disc rotor, and shims on opposite sides from the disc rotor, of the pad materials adjacently, wherein each of the shims is the disc brake shim according to the present invention.

Abstract: An isolation amplifier of an embodiment includes: a primary circuit including an encoder configured to encode an input signal and output the encoded input signal and an anomaly detection circuit configured to detect anomaly having occurred to the input signal and generate a detection signal; an isolation unit configured to insulate the primary circuit from a secondary circuit; an output circuit configured to generate an output signal corresponding to the input signal; and an anomaly-input sensing-output circuit configured to generate an output signal from the secondary circuit by changing the output signal from the output circuit based on the detection signal.

Abstract: A novel disc brake shim and disc brake that can effectively suppress vibration and squeal are provided. The disc brake shim includes a base material layer formed of a metal sheet, and a foamed rubber layer that is laminated on at least a part of a main surface on one side of the base material layer, the foamed rubber layer being an outermost layer once arranged, and the disc brake includes pad materials on both sides in an axial direction of a disc rotor, and shims on opposite sides from the disc rotor, of the pad materials adjacently, wherein each of the shims is the disc brake shim of the present invention.

Abstract: An object is to provide a super-conducting coil and a magnetic resonance imaging device that are quench-free by reducing Joule heat generated upon occurrence of separation of members even in a high magnetic field. The super-conducting coil in accordance with the present invention includes a spool and a super-conducting wire wound around the spool. The coil further includes, between the spool and the super-conducting wire, a first resin layer containing thermoplastic resin, a second resin layer containing thermosetting resin, and a mixed layer, the mixed layer being positioned between the first resin layer and the second resin layer and containing a mixture of the thermoplastic resin and the thermosetting resin.

Abstract: A wiring substrate includes a first substrate and a second substrate stacked on the first substrate. The first substrate includes a first adhesive layer and conductive paste. The first adhesive layer is on a surface of a first insulating layer. The conductive paste is in an opening in the first adhesive layer. The second substrate includes a second adhesive layer and a protruding electrode. The second adhesive layer is on a surface of a second insulating layer facing toward the first substrate, and is bonded to the first adhesive layer. The protruding electrode has an end uncovered by the second adhesive layer, and is electrically connected to the conductive paste.

Abstract: A mask data generation method includes obtaining data of a pattern including a plurality of pattern elements, dividing a region of the pattern into a plurality of sections so that each pattern element is arranged in each section by using the obtained data of the pattern and generating map data including information indicative of presence or absence of the pattern element in each section, setting one piece of mask individual information out of a plurality pieces of mask individual information for each section including the pattern element by using a constraint condition, which inhibits setting of same mask individual information in a constraint region including one section and surrounding sections thereof, and the map data, and generating the data of the plurality of masks corresponding to the plurality pieces of mask individual information by using the set mask individual information.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A semiconductor device includes a wiring substrate, a semiconductor chip, conductive paste, and an adhesive layer. The wiring substrate includes an insulating layer and a wiring layer on a surface of the insulating layer. The semiconductor chip includes a circuit-formation surface in which an electrode pad is provided, and is mounted on the wiring substrate with the circuit-formation surface facing toward the wiring layer. The conductive paste electrically connects the wiring layer and the electrode pad. The adhesive layer is over the entirety of the surface of the insulating layer, and covers the wiring layer and the conductive paste. The adhesive layer fills in a gap between the surface of the insulating layer and the circuit-formation surface, to bond the wiring substrate and the semiconductor chip. The adhesive layer extends onto a side surface of the semiconductor chip to form a fillet.

Abstract: A wiring substrate includes a first substrate and a second substrate stacked on the first substrate. The first substrate includes a first adhesive layer and conductive paste. The first adhesive layer is on a surface of a first insulating layer. The conductive paste is in an opening in the first adhesive layer. The second substrate includes a second adhesive layer and a protruding electrode. The second adhesive layer is on a surface of a second insulating layer facing toward the first substrate, and is bonded to the first adhesive layer. The protruding electrode has an end uncovered by the second adhesive layer, and is electrically connected to the conductive paste.

Abstract: A semiconductor device includes a wiring substrate, a semiconductor chip, conductive paste, and an adhesive layer. The wiring substrate includes an insulating layer and a wiring layer on a surface of the insulating layer. The semiconductor chip includes a circuit-formation surface in which an electrode pad is provided, and is mounted on the wiring substrate with the circuit-formation surface facing toward the wiring layer. The conductive paste electrically connects the wiring layer and the electrode pad. The adhesive layer is over the entirety of the surface of the insulating layer, and covers the wiring layer and the conductive paste. The adhesive layer fills in a gap between the surface of the insulating layer and the circuit-formation surface, to bond the wiring substrate and the semiconductor chip. The adhesive layer extends onto a side surface of the semiconductor chip to form a fillet.

Abstract: A functionally graded material according to the present invention adopts, for example, the following configuration. A functionally graded material is constituted by laminating a plurality of resin compositions. Among the plurality of resin compositions, a first resin composition has a different property from a second resin composition adjacent to the first resin composition. An interface between the first resin composition and the second resin composition is joined by a dynamic covalent bond.

Abstract: A resin produced by a conventional technique has a weak nature in terms of hydrolysis resistance. For example, in a case where the resin produced by a conventional technique is used in an area with a highly humid climate such as Japan for a long period of time, deterioration of the resin due to hydrolysis becomes a concern. A resin composition is described that is optimized in the molecular structure design of the resin and in the catalyst in order to improve the hydrolysis resistance. Specifically, the resin composition contains (1) a copolymer of a vinyl compound having two or more epoxy groups, a carboxylic acid anhydride, and a transesterification reaction catalyst, or (2) a copolymer of a vinyl compound having two or more carboxylic acid anhydride groups, an epoxy, and a transesterification reaction catalyst.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.

Abstract: A method for generating a pattern includes defining a footprint of a main pattern in each cell, arranging a first cell and a second cell which has an auxiliary pattern outside the footprint of the main pattern, side by side in such a manner that the auxiliary pattern outside the footprint of the second cell is present in the footprint of the main pattern of the first cell, and generating the pattern of the mask by removing a pattern element of the auxiliary pattern outside the footprint of the second cell in a portion where the pattern element of the auxiliary pattern outside the footprint of the second cell is close to or overlaps with the main pattern in the first cell of the first cell and the second cell arranged side by side.

Abstract: An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto a first substrate, laminating a second substrate on the first substrate through an electrically connecting member; and filling a space between the first substrate and the second substrate with a sealing member to seal the electronic part.