Patents by Inventor Tadashi Fukui

Tadashi Fukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10396549
    Abstract: Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. A gate width of the second transistor is narrower than a gate width of the first transistor.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: August 27, 2019
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Masashi Arakawa, Tadashi Fukui, Koji Takayanagi
  • Publication number: 20180205225
    Abstract: Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. Agate width of the second transistor is narrower than a gate width of the first transistor.
    Type: Application
    Filed: March 12, 2018
    Publication date: July 19, 2018
    Applicant: Renesas Electronics Corporation
    Inventors: Masashi ARAKAWA, Tadashi FUKUI, Koji TAKAYANAGI
  • Patent number: 9948090
    Abstract: Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. A gate width of the second transistor is narrower than a gate width of the first transistor.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 17, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Masashi Arakawa, Tadashi Fukui, Koji Takayanagi
  • Publication number: 20160094027
    Abstract: Provided is a semiconductor device making it possible to promote area reduction while maintaining ESD resistance. The semiconductor device includes a power wire, a ground wire and a protection circuit provided between the power wire and the ground wire so as to cope with electrostatic discharge. The protection circuit includes a first transistor, a first resistive element, a second transistor, a first capacitive element, a first inverter and a protection transistor. Agate width of the second transistor is narrower than a gate width of the first transistor.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 31, 2016
    Applicant: Renesas Electronics Corporation
    Inventors: Masashi ARAKAWA, Tadashi FUKUI, Koji TAKAYANAGI
  • Publication number: 20100102850
    Abstract: A semiconductor device includes an inductor configured to supply a current to a first node based on a higher voltage region power supply voltage. A first switch is configured to selectively supply a current from the first node into a third node based on a voltage on a second node; a second switch is configured to selectively supply a current from the first node into the second node based on a voltage of the third node; a third switch is configured to supply the current from the third node into a ground terminal based on a lower voltage region input logic level; and a fourth switch is configured to be turned ON/OFF alternately with the third switch to supply the current from the second node to the ground terminal.
    Type: Application
    Filed: October 23, 2009
    Publication date: April 29, 2010
    Applicant: NEC Electronics Corporation
    Inventor: Tadashi FUKUI
  • Patent number: 7439637
    Abstract: A semiconductor circuit according to an embodiment of the invention includes: a terminal resistor circuit including a first Pch transistor; and a control circuit for outputting a control signal to a gate terminal of the first Pch transistor to control a resistance value of the terminal resistor circuit, the control circuit including: a second Pch transistor having a resistance value that is changed in the same direction as a resistance value of the second first transistor with respect to a specific parameter; and a resistor having a resistance value that is less changed than the resistance value of the second transistor with respect to the specific parameter, wherein the control circuit outputting the control signal based on a voltage between the second Pch transistor and the resistor.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: October 21, 2008
    Assignee: NEC Electronics Corporation
    Inventor: Tadashi Fukui
  • Publication number: 20070018503
    Abstract: A semiconductor circuit according to an embodiment of the invention includes: a terminal resistor circuit including a first Pch transistor; and a control circuit for outputting a control signal to a gate terminal of the first Pch transistor to control a resistance value of the terminal resistor circuit, the control circuit including: a second Pch transistor having a resistance value that is changed in the same direction as a resistance value of the second first transistor with respect to a specific parameter; and a resistor having a resistance value that is less changed than the resistance value of the second transistor with respect to the specific parameter, wherein the control circuit outputting the control signal based on a voltage between the second Pch transistor and the resistor.
    Type: Application
    Filed: July 5, 2006
    Publication date: January 25, 2007
    Applicant: NEC ELECTRONICS CORPORATION
    Inventor: Tadashi Fukui
  • Publication number: 20030193351
    Abstract: An output buffer circuit includes a delay circuit for delaying data signal or an inverted version of the data signal by a preset time, a buffer for buffering the data signal with an output impedance of a high value to output the resulting buffered signal, and a three-state buffer, which is controlled responsive to the output of the delay circuit and to the data signal, so that the three-state buffer is activated within the preset time to buffer the data signal and to output the buffered data signal, and is de-activated and turned off outside the preset time.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 16, 2003
    Applicant: NEC Electronics Corporation
    Inventor: Tadashi Fukui
  • Patent number: 5420698
    Abstract: An infrared-rejecting device is positioned in a light path and tilted thereto to reflect infrared radiation and to prevent infrared radiation from being applied to a photodetector or a line sensor for preventing the photodetector or the line sensor from operating in error or from suffering a reduction in its resolution. The infrared-rejecting device may be positioned out of the light path to allow light applied to the photodetector or the line sensor to remain unattenuated, i.e., to prevent the light applied to the photodetector or the line sensor from being reduced in intensity.
    Type: Grant
    Filed: February 18, 1993
    Date of Patent: May 30, 1995
    Assignee: Stanley Electric Co., Ltd.
    Inventors: Kazuhiro Suzuki, Tadashi Fukui
  • Patent number: D1022271
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: April 9, 2024
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Kyusik Moon, Tadashi Katou, Junichi Fukui