Abstract: A plurality of substrates are stacked on top of each other. A flexible cable serially connects the substrates. Semiconductor packages are mounted on the surfaces of the substrates. An adhesive material bonds adjoining semiconductor packages and holds the semiconductor packages in place with respect to each other. The bottommost substrate is provided with external leads by which the semiconductor module is mounted on the motherboard.

Abstract: A plurality of substrates are stacked on top of each other. A flexible cable serially connects the substrates. Semiconductor packages are mounted on the surfaces of the substrates. An adhesive material bonds adjoining semiconductor packages and holds the semiconductor packages in place with respect to each other. The bottommost substrate is provided with external leads by which the semiconductor module is mounted on the motherboard.

Abstract: The present invention has a purpose to provide a surface-mounting connector for electrically connecting with the terminals of the semiconductor module board by pinching thereof, without soldering. The surface-mounting connector includes a supporting member made of insulating material having a first and second surfaces, and a top-surface connecting lead pin and a bottom-surface connecting lead pin. The lead pins are disposed in parallel with a predetermined gap and supported by the supporting member. The top-surface connecting lead pin and the bottom-surface connecting lead pin have one end portions bent in a predetermined direction at different positions away from the first surface of the supporting member.

Abstract: Cracks in solder connecting terminal leads of an IC to a circuit board are prevented by reducing the stress due to the difference in the coefficients of thermal expansion of a pair of IC packages mounted on opposite surfaces of a circuit board and the circuit board. In this invention, the position of an IC package mounted on the upper surface of a circuit board is spaced from the position of an IC package mounted on the lower surface of the circuit board. Alternatively, the IC packages are mounted on the upper and lower surfaces in directions which are substantially orthogonal. Alternatively, the IC packages are mounted such that the positions of lead portions of one of the upper IC packages are spaced from the positions of the lead portions of the other IC package by a distance which is at least 2.4 times the thickness of the circuit board.