Patents by Inventor Tadashi Isono
Tadashi Isono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180054552Abstract: The purpose of the present invention is to provide an imaging device in which an imaging substrate and another substrate are connected by a cable and which is able to satisfactorily suppress the influence of noise caused by the cable while achieving improved manufacturing workability. The present invention is provided with: an imaging substrate provided with an imaging element; a signal processing substrate for processing a signal from the imaging element; and a belt-shaped cable connecting the imaging substrate and the signal processing substrate.Type: ApplicationFiled: March 25, 2016Publication date: February 22, 2018Applicant: Hitachi Automotive Systems, Ltd.Inventors: Fumiaki KOMORI, Tadashi ISONO
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Patent number: 7456790Abstract: A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.Type: GrantFiled: August 19, 2005Date of Patent: November 25, 2008Assignee: Hitachi, Ltd.Inventors: Tadashi Isono, Kazuo Matsuura
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Publication number: 20080062038Abstract: In a radar device, in order to make it simple to attach a connector to a housing and connect a control circuit board to an antenna module, to make it possible to automate assembly, and to achieve downsizing and weight reduction, the radar device comprises a resin housing having upper and lower opening portions, and a control circuit board attached to the resin housing, a metal front cover and a metal rear cover are arranged so as to close the upper and lower opening portions of the resin housing, an opening portion is formed in the metal front cover, and an antenna module is arranged in the opening portion so as to be firmly attached, whereby the radar device can be assembled from one side, it is possible to improve efficiency of assembling work and it is possible to achieve downsizing and cost reduction of the radar device.Type: ApplicationFiled: August 17, 2007Publication date: March 13, 2008Applicant: Hitachi, Ltd.Inventors: Shiro Ouchi, Tadashi Isono, Kazuo Matsuura, Yoshiyuki Sasada
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Publication number: 20060097912Abstract: A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.Type: ApplicationFiled: August 19, 2005Publication date: May 11, 2006Applicant: Hitachi, Ltd.Inventors: Tadashi Isono, Kazuo Matsuura
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Patent number: 7036368Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.Type: GrantFiled: August 6, 2003Date of Patent: May 2, 2006Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
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Patent number: 6727853Abstract: A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and a module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)÷(an original gap size)≦6%.Type: GrantFiled: February 28, 2002Date of Patent: April 27, 2004Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Yoshiyuki Sasada, Tadashi Isono, Shiro Oouchi, Terumi Nakazawa, Mamoru Ooba
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Publication number: 20040025584Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may interfere thermally each other with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.Type: ApplicationFiled: August 6, 2003Publication date: February 12, 2004Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
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Publication number: 20030042144Abstract: A high-frequency circuit device using a plane antenna is provided which has improved reliability of electrical conduction even when subjected to repeated bending stresses. A film structure of a wiring pattern is constituted by forming a Cu-film layer on an organic substrate, and then forming a Ni-plated film and an Au-plated film successively on the Cu-film layer. The Ni-plated film is formed by electrolytic plating. An elongation rate of the Ni-plated film formed by electrolytic plating is 4.9% at minimum. A thermal shock test proves that the wiring pattern is free from cracks and disconnections. Hence, reliability against repeated bending stresses can be improved.Type: ApplicationFiled: February 27, 2002Publication date: March 6, 2003Applicant: Hitachi, Ltd.Inventors: Tadashi Isono, Terumi Nakazawa, Shirou Oouchi, Yoshiyuki Sasada, Mamoru Ohba
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Publication number: 20030016162Abstract: A high frequency tansmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)÷(an original gap size)≦6%.Type: ApplicationFiled: February 28, 2002Publication date: January 23, 2003Applicant: Hitachi, Ltd.Inventors: Yoshiyuki Sasada, Tadashi Isono, Shiro Oouchi, Terumi Nakazawa, Mamoru Ooba
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Patent number: 6435023Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of the heating resistors.Type: GrantFiled: January 17, 1997Date of Patent: August 20, 2002Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Chihiro Kobayashi, Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
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Publication number: 20020056318Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may interfere thermally each other with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.Type: ApplicationFiled: January 7, 2002Publication date: May 16, 2002Applicant: Hitachi, Ltd.Inventors: Chihiro Kobayashi, Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
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Patent number: 5915757Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.Type: GrantFiled: July 25, 1997Date of Patent: June 29, 1999Assignee: Hitachi Chemical Company, Ltd.Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono
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Patent number: 5914649Abstract: A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.Type: GrantFiled: December 16, 1997Date of Patent: June 22, 1999Assignee: Hitachi Chemical Company, Ltd.Inventors: Tadashi Isono, Yoshiyuki Tsuru, Yutaka Taniguchi, Fumio Suzuki
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Patent number: 5892150Abstract: A measuring element for an air flow rate measuring apparatus has upstream and downstream heating resistors and first and second temperature compensating resistors paired with the upstream and downstream heating resistors, respectively. The resistors are mounted on an electrically insulated substrate positioned within an air flow. A substantial part of resistor film of the temperature compensating resistor paired with the upstream heating resistor is positioned upstream on the insulated substrate relative to the resistor film of the compensating resistor paired with the downstream heating resistor.Type: GrantFiled: January 12, 1998Date of Patent: April 6, 1999Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Tadashi Isono, Izumi Watanabe, Akira Takasago
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Patent number: 5714794Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.Type: GrantFiled: April 15, 1996Date of Patent: February 3, 1998Assignee: Hitachi Chemical Company, Ltd.Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono
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Patent number: 5708205Abstract: A measuring element for a mass air flow sensor formed on a substrate for measuring a flow rate of an objective fluid comprises a pair of heated resistors of thin films juxtaposed in the flowing direction of the objective fluid, formed at a thin film heated resistor forming part on the substrate, a pair of non-heated ambient temperature sensing resistors of thin films, formed at a thin film ambient temperature sensing resistor forming part on the substrate, and a plurality of electrode terminals of thin films formed at a supporting part at which the substrate is supported, being a part excluding the heated resistor thin film forming part and the thin film ambient temperature sensing resistor forming part, for taking out electrical signals from the heated resisters and the non-heated ambient temperature sensing resistors, wherein the thin film heated resistor forming part and the thin film ambient temperature sensing resistor forming part are shifted each other and arranged before and after in the flowing direcType: GrantFiled: May 17, 1996Date of Patent: January 13, 1998Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Masamichi Yamada, Kaoru Uchiyama, Izumi Watanabe, Tadashi Isono, Toshihiko Nakau