Patents by Inventor Tadashi Isono

Tadashi Isono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180054552
    Abstract: The purpose of the present invention is to provide an imaging device in which an imaging substrate and another substrate are connected by a cable and which is able to satisfactorily suppress the influence of noise caused by the cable while achieving improved manufacturing workability. The present invention is provided with: an imaging substrate provided with an imaging element; a signal processing substrate for processing a signal from the imaging element; and a belt-shaped cable connecting the imaging substrate and the signal processing substrate.
    Type: Application
    Filed: March 25, 2016
    Publication date: February 22, 2018
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Fumiaki KOMORI, Tadashi ISONO
  • Patent number: 7456790
    Abstract: A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.
    Type: Grant
    Filed: August 19, 2005
    Date of Patent: November 25, 2008
    Assignee: Hitachi, Ltd.
    Inventors: Tadashi Isono, Kazuo Matsuura
  • Publication number: 20080062038
    Abstract: In a radar device, in order to make it simple to attach a connector to a housing and connect a control circuit board to an antenna module, to make it possible to automate assembly, and to achieve downsizing and weight reduction, the radar device comprises a resin housing having upper and lower opening portions, and a control circuit board attached to the resin housing, a metal front cover and a metal rear cover are arranged so as to close the upper and lower opening portions of the resin housing, an opening portion is formed in the metal front cover, and an antenna module is arranged in the opening portion so as to be firmly attached, whereby the radar device can be assembled from one side, it is possible to improve efficiency of assembling work and it is possible to achieve downsizing and cost reduction of the radar device.
    Type: Application
    Filed: August 17, 2007
    Publication date: March 13, 2008
    Applicant: Hitachi, Ltd.
    Inventors: Shiro Ouchi, Tadashi Isono, Kazuo Matsuura, Yoshiyuki Sasada
  • Publication number: 20060097912
    Abstract: A high frequency antenna device is provided which includes: a high frequency antenna wiring board having a film antenna formed on one surface of a dielectric substrate made up of multiple, laminated ceramic layers and a high frequency circuit formed on the other surface of the dielectric substrate to generate a high frequency signal; a plate-like metal base having a square opening cut therethrough; and a cover to package a surface of the high frequency circuit on the high frequency antenna wiring board after the high frequency antenna wiring board has been fitted in the opening of the metal base; wherein a periphery of the high frequency antenna wiring board is airtightly sealed and joined to the metal base with glass or brazing metal.
    Type: Application
    Filed: August 19, 2005
    Publication date: May 11, 2006
    Applicant: Hitachi, Ltd.
    Inventors: Tadashi Isono, Kazuo Matsuura
  • Patent number: 7036368
    Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: May 2, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
  • Patent number: 6727853
    Abstract: A high frequency transmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and a module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)÷(an original gap size)≦6%.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: April 27, 2004
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Yoshiyuki Sasada, Tadashi Isono, Shiro Oouchi, Terumi Nakazawa, Mamoru Ooba
  • Publication number: 20040025584
    Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may interfere thermally each other with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.
    Type: Application
    Filed: August 6, 2003
    Publication date: February 12, 2004
    Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
  • Publication number: 20030042144
    Abstract: A high-frequency circuit device using a plane antenna is provided which has improved reliability of electrical conduction even when subjected to repeated bending stresses. A film structure of a wiring pattern is constituted by forming a Cu-film layer on an organic substrate, and then forming a Ni-plated film and an Au-plated film successively on the Cu-film layer. The Ni-plated film is formed by electrolytic plating. An elongation rate of the Ni-plated film formed by electrolytic plating is 4.9% at minimum. A thermal shock test proves that the wiring pattern is free from cracks and disconnections. Hence, reliability against repeated bending stresses can be improved.
    Type: Application
    Filed: February 27, 2002
    Publication date: March 6, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Tadashi Isono, Terumi Nakazawa, Shirou Oouchi, Yoshiyuki Sasada, Mamoru Ohba
  • Publication number: 20030016162
    Abstract: A high frequency tansmitter-receiver which can prevent an antenna pattern from being broken. A radar apparatus is provided with a high frequency antenna, a base plate and module. The antenna is comprised of an organic substrate and a metal pattern formed on the organic substrate. The high frequency antenna is adhered to the base plate astride the module. Here, the gap between the base plate and the module where the antenna is adhered is configured to satisfy the expression (an amount of change in gap size with respect to a change in use temperature)÷(an original gap size)≦6%.
    Type: Application
    Filed: February 28, 2002
    Publication date: January 23, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Yoshiyuki Sasada, Tadashi Isono, Shiro Oouchi, Terumi Nakazawa, Mamoru Ooba
  • Patent number: 6435023
    Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may each interfere thermally with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of the heating resistors.
    Type: Grant
    Filed: January 17, 1997
    Date of Patent: August 20, 2002
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Chihiro Kobayashi, Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
  • Publication number: 20020056318
    Abstract: A heating resistor type air flow rate measuring apparatus is provided with a couple of heating resistors placed at the positions where those resistors may interfere thermally each other with respect to an air flow, and a couple of driving circuits for driving those heating resistors. The air flow rate signal is obtained by calculating the difference between the output signals of a couple of heating resistors in terms of heat radiation rate effected by an air flow, and adding the difference value onto the output signal of one of heating resistors.
    Type: Application
    Filed: January 7, 2002
    Publication date: May 16, 2002
    Applicant: Hitachi, Ltd.
    Inventors: Chihiro Kobayashi, Masuo Akamatsu, Shinya Igarashi, Izumi Watanabe, Kaoru Uchiyama, Tadashi Isono
  • Patent number: 5915757
    Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.
    Type: Grant
    Filed: July 25, 1997
    Date of Patent: June 29, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono
  • Patent number: 5914649
    Abstract: A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.
    Type: Grant
    Filed: December 16, 1997
    Date of Patent: June 22, 1999
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Tadashi Isono, Yoshiyuki Tsuru, Yutaka Taniguchi, Fumio Suzuki
  • Patent number: 5892150
    Abstract: A measuring element for an air flow rate measuring apparatus has upstream and downstream heating resistors and first and second temperature compensating resistors paired with the upstream and downstream heating resistors, respectively. The resistors are mounted on an electrically insulated substrate positioned within an air flow. A substantial part of resistor film of the temperature compensating resistor paired with the upstream heating resistor is positioned upstream on the insulated substrate relative to the resistor film of the compensating resistor paired with the downstream heating resistor.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: April 6, 1999
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Tadashi Isono, Izumi Watanabe, Akira Takasago
  • Patent number: 5714794
    Abstract: Provided is an electrostatic protective device which is highly effective in protecting relatively vulnerable devices such as IC's and LSI's from electrostatic damages, and a method for fabricating an electrostatic protective device which can simplify the structure as compared with the conventional devices sealed in a glass container, and can reduce the size and cost of the device. The chip type electrostatic protective device comprises an inner insulating layer made of organic resin material and provided with a plurality of holes for defining air gaps, a pair of outer insulating layers placed on both sides of the inner insulating layer, and circuit segments defining a discharge gap in each of the air gaps. Holes for interconnection are formed in the laminated assembly, and the interior of each of the holes is turned electroconductive.
    Type: Grant
    Filed: April 15, 1996
    Date of Patent: February 3, 1998
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Kouichi Tsuyama, Atsushi Suzunaga, Atsushi Nishimura, Tadashi Isono
  • Patent number: 5708205
    Abstract: A measuring element for a mass air flow sensor formed on a substrate for measuring a flow rate of an objective fluid comprises a pair of heated resistors of thin films juxtaposed in the flowing direction of the objective fluid, formed at a thin film heated resistor forming part on the substrate, a pair of non-heated ambient temperature sensing resistors of thin films, formed at a thin film ambient temperature sensing resistor forming part on the substrate, and a plurality of electrode terminals of thin films formed at a supporting part at which the substrate is supported, being a part excluding the heated resistor thin film forming part and the thin film ambient temperature sensing resistor forming part, for taking out electrical signals from the heated resisters and the non-heated ambient temperature sensing resistors, wherein the thin film heated resistor forming part and the thin film ambient temperature sensing resistor forming part are shifted each other and arranged before and after in the flowing direc
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: January 13, 1998
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Masamichi Yamada, Kaoru Uchiyama, Izumi Watanabe, Tadashi Isono, Toshihiko Nakau