Abstract: A moving device includes a first linear guide, a second linear guide to extend in parallel with the first linear guide, a first structure movable along the first linear guide, a second structure movable along the second linear guide, a slide member of which a first end is fixed to the first structure and a second end is fixed to the second structure so that the slide member is bridged between the first structure and the second structure, a first linear motor having a first stator installed to extend along the first linear guide and a first movable element fixed to the first structure to face the first stator at a predetermined interval, and a second linear motor having a second stator installed to extend along the second linear guide and a second movable element fixed to the second structure to face the second stator at a predetermined interval.

Abstract: A flexible substrate to be used for assemblage of a semiconductor chip having connecting points to be electrically connected to an external side, comprises a base film unit made of a flexible synthetic resin and including a mounting portion for mounting thereon a semiconductor chip, groups of conductive leads formed on a surface of the base film unit, each lead group including a plurality of the leads formed so as to extend from respective positions in the mounting portion corresponding to the connecting points of the semiconductor chip as mounted in the mounting portion to selected positions on the base film unit, and a plurality of projections each formed at an area between adjacent two of the lead groups on the surface of the base film unit and having a height substantially equal to the height of the leads of the lead group.

Abstract: A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprises a plurality of square frames, each including a substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, the square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends. At least two substantially rectangular first openings are formed within the mold area at a space between the square opening and an outer periphery of the mold area. A plurality of lead groups, extend from an inside of the square opening to positions adjacent to a periphery of the frame by crossing one of the first openings.

Abstract: A lead structure for packaging a semiconductor chip is provided which includes a plurality of electroconductive leads. At least one lead of an adjacent pair of electroconductive leads has at least one projecting portion which projects towards the other lead of the pair so that a tortuous path is defined between the electroconductive leads. The tortuous path minimizes outflow of molten plastic between the electroconductive leads.