Patents by Inventor Tadashi Kawanobe

Tadashi Kawanobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame, method of making the same and light receiving/emitting device
    Patent number: 7888697
    Abstract: A lead frame includes a base material, a reflection layer formed on a part of the base material, and a characteristic sustaining layer formed at least on the reflection layer to cover the reflection layer for sustaining a characteristic of the reflection layer by isolating the reflection layer from an outside. The reflection layer includes the characteristic to exhibit a predetermined reflectivity to light with a predetermined wavelength, and the characteristic sustaining layer prevents a decrease in the reflectivity of the reflection layer and transmits light reflected by the reflection layer.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: February 15, 2011
    Assignees: Hitachi Cable Precision Co., Ltd.
    Inventors: Tadashi Kawanobe, Yuichi Ohnuma, Mamoru Mita
  • LEAD FRAME, METHOD OF MAKING THE SAME AND LIGHT RECEIVING/EMITTING DEVICE
    Publication number: 20090141498
    Abstract: A lead frame includes a base material, a reflection layer formed on a part of the base material, and a characteristic sustaining layer formed at least on the reflection layer to cover the reflection layer for sustaining a characteristic of the reflection layer by isolating the reflection layer from an outside. The reflection layer includes the characteristic to exhibit a predetermined reflectivity to light with a predetermined wavelength, and the characteristic sustaining layer prevents a decrease in the reflectivity of the reflection layer and transmits light reflected by the reflection layer.
    Type: Application
    Filed: December 2, 2008
    Publication date: June 4, 2009
    Inventors: Tadashi KAWANOBE, Yuichi Ohnuma, Mamoru Mita
  • Semiconductor device and process for producing the same
    Patent number: 6940161
    Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.
    Type: Grant
    Filed: May 22, 2002
    Date of Patent: September 6, 2005
    Assignee: Hitachi Cable, Ltd.
    Inventors: Tadashi Kawanobe, Yasuharu Kameyama, Masayuki Hosono, Kazumoto Komiya, Akiji Shibata
  • Semiconductor device and process for producing the same
    Publication number: 20020185661
    Abstract: In a semiconductor device comprising: a wiring board comprising a conductor wiring having a predetermined pattern provided on the surface of an insulating substrate; an elastomer provided on the wiring board; a semiconductor chip bonded onto the wiring board through the elastomer; and an insulator for sealing the periphery of the semiconductor chip and the elastomer, the semiconductor chip in its external terminal being electrically connected to the conductor wiring, a part of the elastomer is exposed onto the surface of the insulator. By virtue of the above construction, a lowering in device reliability can be prevented.
    Type: Application
    Filed: May 22, 2002
    Publication date: December 12, 2002
    Applicant: HITACHI CABLE,LTD.
    Inventors: Tadashi Kawanobe, Yasuharu Kameyama, Masayuki Hosono, Kazumoto Komiya, Akiji Shibata