Patents by Inventor Tadashi Kiyokawa

Tadashi Kiyokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020164096
    Abstract: A problem of the invention resides in that in a hydrodynamic bearing apparatus for rotatably supporting a rotor by a hydrodynamic bearing, wear of the apparatus caused by sliding contact of dynamic pressure bearing faces in starting and stopping thereof is prevented to thereby promote durability, working of a dynamic pressure generating groove is facilitated and the bearing faces are prevented from being adsorbed to each other.
    Type: Application
    Filed: July 3, 2002
    Publication date: November 7, 2002
    Applicant: SEIKO INSTRUMENTS INC.
    Inventors: Tsuyoshi Kashiwada, Katsushige Konno, Kaoru Kaneko, Tadashi Kiyokawa, Hajime Kiyokawa
  • Patent number: 6447167
    Abstract: In a hydrodynamic bearing apparatus for rotatably supporting a rotor by a hydrodynamic bearing, wear of the apparatus caused by sliding contact of dynamic pressure bearing faces in starting and stopping thereof is prevented to thereby promote durability, working of a dynamic pressure generating groove is facilitated and the bearing faces are prevented from being adsorbed to each other. By providing a low friction metal layer having water repellency at dynamic pressure bearing portions of a hydrodynamic bearing apparatus, friction can be reduced, wear or dust formation can effectively be restrained and the bearing faces can be prevented from being adsorbed to each other by dew condensation.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: September 10, 2002
    Assignees: Seiko Instruments Inc., Kiyokawa Plating Industry Co., Ltd.
    Inventors: Tsuyoshi Kashiwada, Katsushige Konno, Kaoru Kaneko, Tadashi Kiyokawa, Hajime Kiyokawa
  • Patent number: 6306339
    Abstract: A hydrogen storage material is disclosed with no collapse due to pulverization of hydrogen storage alloy particles by repeated hydrogen absorption and desorption thereby permitting repeated use while manifesting excellent electric and thermal conductivities. Pressure molding of hydrogen storage alloy particles, each being covered with a plated metal film having microgranules of a thermoplastic resin, at a temperature higher than a glass transition temperature or a melting point of and below a thermal decomposition temperature of the thermoplastic resin can produce a porous hydrogen storage material of hydrogen storage alloy particles being bonded to each other via the thermoplastic resin. The hydrogen storage material can become firm and strong because the plated metal films covering the hydrogen storage alloy particles are clasped with each other complexly.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 23, 2001
    Assignee: Kiyokawa Plating Industries, Co., Ltd.
    Inventors: Tadashi Kiyokawa, Hajime Kiyokawa, Masayuki Takashima
  • Patent number: 6143052
    Abstract: A hydrogen storage material is disclosed with no collapse due to pulverization of hydrogen storage alloy particles by repeated hydrogen absorption and desorption thereby permitting repeated use while manifesting excellent electric and thermal conductivities. Pressure molding of hydrogen storage alloy particles, each being covered with a plated metal film having microgranules of a thermoplastic resin, at a temperature higher than a glass transition temperature or a melting point of and below a thermal decomposition temperature of the thermoplastic resin can produce a porous hydrogen storage material of hydrogen storage alloy particles being bonded to each other via the thermoplastic resin. The hydrogen storage material can become firm and strong because the plated metal films covering the hydrogen storage alloy particles are clasped with each other complexly.
    Type: Grant
    Filed: June 29, 1998
    Date of Patent: November 7, 2000
    Assignee: Kiyokawa Plating Industries, Co., Ltd.
    Inventors: Tadashi Kiyokawa, Hajime Kiyokawa, Masayuki Takashima
  • Patent number: 5961808
    Abstract: The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulating substrate such as ceramics by sequentially performing an etching treatment, an activating treatment and an electroless plating treatment to the electrical insulating substrate, an alloy film containing mainly nickel and phosphorus is formed by not an electroless plating process but an electrolytic plating process. By adopting the electrolytic plating process, a film thickness of the formed alloy film of the middle part on the surface of the insulating substrate is thinner than that of the alloy film of the corner or ridge parts on the surface of the insulating substrate, and the thin part of the film thickness serves as a suitable fusing start part when applying an overload.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: October 5, 1999
    Assignee: Kiyokawa Mekki Kougyo Co., Ltd.
    Inventor: Tadashi Kiyokawa
  • Patent number: 5863407
    Abstract: The present invention relates to an alloy film resistor containing mainly nickel and phosphorus having an excellent fuse function and a method for producing the alloy film resistor. After the conductivity is given to the surface of an electrical insulating substrate such as ceramics by sequentially performing an etching treatment, an activating treatment and an electroless plating treatment to the electrical insulating substrate, an alloy film containing mainly nickel and phosphorus is formed by not an electroless plating process but an electrolytic plating process. By adopting the electrolytic plating process, a film thickness of the formed alloy film of the middle part on the surface of the insulating substrate is thinner than that of the alloy film of the corner or ridge parts on the surface of the insulating substrate, and the thin part of the film thickness serves as a suitable fusing start part when applying an overload.
    Type: Grant
    Filed: March 4, 1997
    Date of Patent: January 26, 1999
    Assignee: Kiyokawa Mekki Kougyo Co., Ltd.
    Inventor: Tadashi Kiyokawa