Abstract: A charging controller includes an internal resistance measurement unit configured to measure an internal resistance of a rechargeable battery multiple times over a charging period of the rechargeable battery; a detection unit configured to detect a peak of the internal resistance based on a change in the internal resistance measured by the internal resistance measurement unit; and an update unit configured to update a full charge capacity of the rechargeable battery referring to the peak of the internal resistance detected by the detection unit.

Abstract: A charging controller includes a current measurement unit configured to measure a charging current of a rechargeable battery, a detection unit configured to detect switching from a constant current charge to a constant voltage charge based on the charging current measured by the current measurement unit, during charge of the rechargeable battery, and an update unit configured to update a full charge capacity of the rechargeable battery based on a charged capacity after the point in time, detected by the detection unit, of switching from the constant current charge to the constant voltage charge.

Abstract: A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 ?m2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 ?m2 and less than or equal to 5 ?m2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

Abstract: For thermoelectric heat transfer, a thermoelectric device includes a planar p-type semiconductor that is planar within a first plane, a planar n-type semiconductor that is coplanar with the planar p-type semiconductor within the first plane, a cold side conductor that is coplanar with the planar p-type semiconductor and the planar n-type semiconductor within the first plane and that connects to the planar p-type semiconductor and to the planar n-type semiconductor, and a hot side conductor that is coplanar with the planar p-type semiconductor and the planar n-type semiconductor within the first plane and that connects to the planar p-type semiconductor and to the planar n-type semiconductor. The thermoelectric device further includes a hot side substrate, a hot side thermal insulator, a cold side substrate, and a cold side thermal insulator. The cold side conductor draws heat from the cold side substrate.

Abstract: A charging controller includes a current measurement unit configured to measure a charging current of a rechargeable battery, a detection unit configured to detect switching from a constant current charge to a constant voltage charge based on the charging current measured by the current measurement unit, during charge of the rechargeable battery, and an update unit configured to update a full charge capacity of the rechargeable battery based on a charged capacity after the point in time, detected by the detection unit, of switching from the constant current charge to the constant voltage charge.

Abstract: A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 ?m2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 ?m2 and less than or equal to 5 ?m2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

Abstract: A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec.

Abstract: A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.

Abstract: A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.

Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.

Abstract: An interposer is capable of efficiently reinforcing the connecting portion between an electronic component and a substrate. The interposer is used for mounting a first electronic component on a substrate and includes a sheet-shaped spacer having at least one through-hole and including a material that does not flow during reflow soldering and a resin portion that covers at least a part of the spacer and is flowable during reflow soldering, and the through-hole is configured to store a bump of the first electronic component.

Abstract: A method of manufacturing an electronic board includes preparing a composite sheet having a composite layer that includes a solder part and a resin part, placing the composite layer on a substrate, placing a first electronic component on the composite layer, and heating the solder part up to a temperature at which the solder part of the composite layer is melted within a reflow furnace.

Abstract: A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.

Abstract: A method of manufacturing an electronic board includes: preparing a substrate in which substrate-side solder parts are provided on electrodes; preparing a mounting sheet having a resin layer in which a plurality of voids is formed in accordance with positions of the electrodes; attaching the resin layer to at least one of a first electronic component and the substrate so that interfaces of the first electronic component or the substrate-side solder parts are located inside the respective voids; causing the interfaces and the substrate-side solder parts to face each other at positions of the respective voids; and melting the substrate-side solder parts by heating to join the interfaces and the electrodes.

Abstract: The present invention relates to a manufacturing method for an electrical connector, comprising the following steps: providing a first strip, a second strip, and a plurality of grounding terminals, power terminals and signal terminals which are located between the first strip and the second strip; forming a first body and a second body onto the grounding terminals, the power terminals and the signal terminals by insert-molding, wherein each grounding terminal comprises an exposed upper contacting portion, an exposed lower contacting portion and a first connecting portion located between the first body and the second body; bending the first connecting portions, assembling a shielding plate into the accommodating space; and forming an insulation block onto the first body and the second body by an insert-molding.

Abstract: A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec.

Abstract: An electronical connector includes an insulation body and first and second conductive terminals. The insulation body includes a basal part, a middle part and a front end part defining a socketing space. The insulation body defines first and second terminal slots, with both communicating with the socketing space. The first terminal slot is positioned in the middle part and on an inner surface of a lower wall of the front end part. The second terminal slot is positioned in the middle part and on an inner surface of an upper wall of the front end part. The first and second conductive terminals are individually positioned in the first and second terminal slots. The first and second conductive terminals each include a contact part, a connection part, and a welding part. The contact part is positioned in the socketing space and the welding part protrudes out of the basal part.

Abstract: An electronical connector includes an insulation body and first and second conductive terminals. The insulation body includes a basal part, a middle part and a front end part defining a socketing space. The insulation body defines first and second terminal slots, with both communicating with the socketing space. The first terminal slot is positioned in the middle part and on an inner surface of a lower wall of the front end part. The second terminal slot is positioned in the middle part and on an inner surface of an upper wall of the front end part. The first and second conductive terminals are individually positioned in the first and second terminal slots. The first and second conductive terminals each include a contact part, a connection part, and a welding part. The contact part is positioned in the socketing space and the welding part protrudes out of the basal part.

Abstract: The present invention provides an indication appending method and an indication appended article that improve identifiability with ease. The indication appending method comprises the step of applying a coating material having a color different from a surface of the article onto the surface in the form of a layer, and the step of partially removing the coating material by irradiation with laser light and thereby forming identification information, which is a letter/character, a symbol, and/or a figure. The coating material may be applied onto a predetermined region, and thereby an indication may be formed by a part from which the coating material is removed.

Abstract: The present invention relates to a manufacturing method for an electrical connector, comprising the following steps: providing a first strip, a second strip, and a plurality of grounding terminals, power terminals and signal terminals which are located between the first strip and the second strip; forming a first body and a second body onto the grounding terminals, the power terminals and the signal terminals by insert-molding, wherein each grounding terminal comprises an exposed upper contacting portion, an exposed lower contacting portion and a first connecting portion located between the first body and the second body; bending the first connecting portions, assembling a shielding plate into the accommodating space; and forming an insulation block onto the first body and the second body by an insert-molding.