Patents by Inventor Tadashi Kurosawa

Tadashi Kurosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11786991
    Abstract: A laser machine having less constraints on the dimension and shape of a machining object than a laser machine in the related art. The laser machine includes: a flying body capable of floating and moving in a space; a machining head mounted on the flying body and configured to radiate a laser beam; a position/posture detector configured to detect the position and posture of the machining head with respect to a workpiece; a radiation position changer capable of changing the radiation position of the laser beam radiated from the machining head on the basis of the position and posture of the machining head detected by the position/posture detector; and a laser oscillator configured to supply the laser beam to the machining head.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: October 17, 2023
    Assignee: Fanuc Corporation
    Inventor: Tadashi Kurosawa
  • Patent number: 11433478
    Abstract: The laser machining system includes a laser device configured to output a laser beam, and a machining head configured to emit the laser beam emitted by a laser oscillator of the laser device and propagated through an optical fiber, to a workpiece in order to perform laser machining. The machining head includes at least one wavelength selective mirror having wavelength selectivity with various values of reflectivity and transmittance according to wavelengths, and at least one image capturing device. The laser machining system monitors abnormality in a laser optical system leading from the laser oscillator to the machining head, during the laser machining, by reflecting light propagated from a side of introduction of the laser beam into the machining head by the wavelength selective mirror, making the light incident on an image capturing surface of the image capturing device, and detecting incident light illuminance distribution appearing on the image capturing surface of the image capturing device.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: September 6, 2022
    Assignee: FANUC CORPORATION
    Inventors: Hiroshi Takigawa, Tadashi Kurosawa, Hisatada Machida
  • Patent number: 11133643
    Abstract: A laser apparatus includes: a cooling capacity control means which controls the cooling capacity of a heat receiving/cooling unit; a surrounding member which surrounds a dew condensation prevention target unit including a heat generating unit and which reaches a surrounding member equilibrium temperature higher than the maximum dew point temperature within a housing as the temperature of the heat generating unit is increased; and a temperature detection means which detects the temperature of the surrounding member, a control unit compares, while a current output command is being output to a laser power supply unit, a surrounding member temperature with a switching temperature previously set lower than the surrounding member equilibrium temperature and when the surrounding member temperature is lower than the switching temperature, the control unit controls the cooling capacity control means such that the cooling capacity of the heat receiving/cooling unit is a low level whereas when the surrounding member tem
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: September 28, 2021
    Assignee: FANUC CORPORATION
    Inventors: Hiroshi Takigawa, Yuji Nishikawa, Hiroyuki Yoshida, Tadashi Kurosawa, Atsushi Mori, Toshiyasu Shiomi, Michinori Maeda, Akihiko Nishio
  • Publication number: 20200387131
    Abstract: The laser machining system includes a laser device configured to output a laser beam, and a machining head configured to emit the laser beam emitted by a laser oscillator of the laser device and propagated through an optical fiber, to a workpiece in order to perform laser machining. The machining head includes at least one wavelength selective mirror having wavelength selectivity with various values of reflectivity and transmittance according to wavelengths, and at least one image capturing device. The laser machining system monitors abnormality in a laser optical system leading from the laser oscillator to the machining head, during the laser machining, by reflecting light propagated from a side of introduction of the laser beam into the machining head by the wavelength selective mirror, making the light incident on an image capturing surface of the image capturing device, and detecting incident light illuminance distribution appearing on the image capturing surface of the image capturing device.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 10, 2020
    Applicant: FANUC CORPORATION
    Inventors: Hiroshi TAKIGAWA, Tadashi KUROSAWA, Hisatada MACHIDA
  • Patent number: 10705504
    Abstract: A server for storing a machining result of a machine tool and one or a plurality of first terminals connected to the server via a network are included. The server includes an information disclosure part for disclosing the machining result, a request acceptance part for accepting from each of the first terminals a request for the machining result disclosed by the information disclosure part, and a machining condition provision part for providing each of the first terminals with a machining condition corresponding to the machining result in response to the request accepted by the request acceptance part. Each of the first terminals includes a request transmission part for transmitting the request for the machining result disclosed by the information disclosure part, and a machining condition acquisition part for acquiring the machining condition provided by the machining condition provision part in response to the request.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: July 7, 2020
    Assignee: FANUC CORPORATION
    Inventor: Tadashi Kurosawa
  • Publication number: 20190160591
    Abstract: A laser machine having less constraints on the dimension and shape of a machining object than a laser machine in the related art. The laser machine includes: a flying body capable of floating and moving in a space; a machining head mounted on the flying body and configured to radiate a laser beam; a position/posture detector configured to detect the position and posture of the machining head with respect to a workpiece; a radiation position changer capable of changing the radiation position of the laser beam radiated from the machining head on the basis of the position and posture of the machining head detected by the position/posture detector; and a laser oscillator configured to supply the laser beam to the machining head.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 30, 2019
    Applicant: FANUC CORPORATION
    Inventor: Tadashi Kurosawa
  • Publication number: 20190109433
    Abstract: A laser apparatus includes: a cooling capacity control means which controls the cooling capacity of a heat receiving/cooling unit; a surrounding member which surrounds a dew condensation prevention target unit including a heat generating unit and which reaches a surrounding member equilibrium temperature higher than the maximum dew point temperature within a housing as the temperature of the heat generating unit is increased; and a temperature detection means which detects the temperature of the surrounding member, a control unit compares, while a current output command is being output to a laser power supply unit, a surrounding member temperature with a switching temperature previously set lower than the surrounding member equilibrium temperature and when the surrounding member temperature is lower than the switching temperature, the control unit controls the cooling capacity control means such that the cooling capacity of the heat receiving/cooling unit is a low level whereas when the surrounding member tem
    Type: Application
    Filed: September 26, 2018
    Publication date: April 11, 2019
    Applicant: FANUC CORPORATION
    Inventors: Hiroshi TAKIGAWA, Yuji NISHIKAWA, Hiroyuki YOSHIDA, Tadashi KUROSAWA, Atsushi MORI, Toshiyasu SHIOMI, Michinori MAEDA, Akihiko NISHIO
  • Patent number: 10226836
    Abstract: A controller of a laser machining device according to the present invention includes a positioning completion determining part for determining whether or not positioning of the nozzle is completed, a completion expectation determining part for determining whether or not the completion of the positioning of the nozzle can be expected, and a subsequent process determining part for determining whether or not a subsequent process can be carried out in the state where the completion of the positioning of the nozzle is expected. If the subsequent process can be carried out when the completion of the positioning of the nozzle is only expected, the subsequent process is carried out immediately when it is determined that the completion of the positioning of the nozzle can be expected. If the subsequent process cannot be carried out, the subsequent process is carried out only after the positioning of the nozzle is completed.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: March 12, 2019
    Assignee: FANUC CORPORATION
    Inventor: Tadashi Kurosawa
  • Publication number: 20180217577
    Abstract: A server for storing a machining result of a machine tool and one or a plurality of first terminals connected to the server via a network are included. The server includes an information disclosure part for disclosing the machining result, a request acceptance part for accepting from each of the first terminals a request for the machining result disclosed by the information disclosure part, and a machining condition provision part for providing each of the first terminals with a machining condition corresponding to the machining result in response to the request accepted by the request acceptance part. Each of the first terminals includes a request transmission part for transmitting the request for the machining result disclosed by the information disclosure part, and a machining condition acquisition part for acquiring the machining condition provided by the machining condition provision part in response to the request.
    Type: Application
    Filed: January 22, 2018
    Publication date: August 2, 2018
    Applicant: FANUC CORPORATION
    Inventor: Tadashi KUROSAWA
  • Patent number: 9248524
    Abstract: A laser processing method including a first step of irradiating a surface of a workpiece with a laser beam with a focal point spaced from the surface, and forming a bottomed hole on the workpiece, which is defined with a tubular inner circumferential face opening at the surface and a bottom face; and a second step of irradiating the bottom face with a laser beam while an assist gas is blown into an opening of the bottomed hole but not blown onto an area surrounding the opening, and forming a through hole penetrating through the workpiece. A laser processing system includes a processing head focusing a laser beam emitted from a laser oscillator so as to irradiate a workpiece with the laser beam and blowing an assist gas onto the workpiece; and a control section controlling the first and second steps as an operation of the processing head.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: February 2, 2016
    Assignee: FANUC CORPORATION
    Inventors: Tadashi Kurosawa, Atsushi Mori, Yuji Nishikawa
  • Publication number: 20150151381
    Abstract: A controller of a laser machining device according to the present invention includes a positioning completion determining part for determining whether or not positioning of the nozzle is completed, a completion expectation determining part for determining whether or not the completion of the positioning of the nozzle can be expected, and a subsequent process determining part for determining whether or not a subsequent process can be carried out in the state where the completion of the positioning of the nozzle is expected. If the subsequent process can be carried out when the completion of the positioning of the nozzle is only expected, the subsequent process is carried out immediately when it is determined that the completion of the positioning of the nozzle can be expected. If the subsequent process cannot be carried out, the subsequent process is carried out only after the positioning of the nozzle is completed.
    Type: Application
    Filed: November 20, 2014
    Publication date: June 4, 2015
    Inventor: Tadashi KUROSAWA
  • Publication number: 20130026144
    Abstract: A laser processing method including a first step of irradiating a surface of a workpiece with a laser beam with a focal point spaced from the surface, and forming a bottomed hole on the workpiece, which is defined with a tubular inner circumferential face opening at the surface and a bottom face; and a second step of irradiating the bottom face with a laser beam while an assist gas is blown into an opening of the bottomed hole but not blown onto an area surrounding the opening, and forming a through hole penetrating through the workpiece. A laser processing system includes a processing head focusing a laser beam emitted from a laser oscillator so as to irradiate a workpiece with the laser beam and blowing an assist gas onto the workpiece; and a control section controlling the first and second steps as an operation of the processing head.
    Type: Application
    Filed: June 19, 2012
    Publication date: January 31, 2013
    Applicant: FANUC CORPORATION
    Inventors: Tadashi KUROSAWA, Atsushi MORI, Yuji NISHIKAWA
  • Patent number: 6608279
    Abstract: A piercing nozzle (2) having a nozzle hole (2a) larger than the diameter of a converged laser beam (10) and smaller than the diameter of a hole (1a) of a cutting nozzle (1) is in use. Further, an underlay (3) having a hole (3a) at a position corresponding to the nozzle hole (2a) is placed under the piercing nozzle (2) through a clearance (5). Piercing is carried out by irradiating the laser beam (10) to a machining target (6) through nozzle holes (1a, 2a) and (3a) on condition that a laser oscillator is set to output high power. The diameter of a hole machined by the piercing is small, and less scattered dross is produced. The scattered dross is cooled down within the clearance (5) and is then dropped down to the underlay (3), so that the adhesion of the scattered dross to the machining target does not occur. Since a small hole is machined with the high power, the machining time for piercing is remarkably shortened.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: August 19, 2003
    Assignee: Fanuc Ltd.
    Inventors: Yoshinori Nakata, Atsushi Mori, Tadashi Kurosawa
  • Publication number: 20020053556
    Abstract: A piercing nozzle (2) having a nozzle hole (2a) larger than the diameter of a converged laser beam (10) and smaller than the diameter of a hole (1a) of a cutting nozzle (1) is in use. Further, an underlay (3) having a hole (3a) at a position corresponding to the nozzle hole (2a) is placed under the piercing nozzle (2) through a clearance (5). Piercing is carried out by irradiating the laser beam (10) to a machining target (6) through nozzle holes (1a, 2a) and (3a) on condition that a laser oscillator is set to output high power. The diameter of a hole machined by the piercing is small, and less scattered dross is produced. The scattered dross is cooled down within the clearance (5) and is then dropped down to the underlay (3), so that the adhesion of the scattered dross to the machining target does not occur. Since a small hole is machined with the high power, the machining time for piercing is remarkably shortened.
    Type: Application
    Filed: November 15, 2001
    Publication date: May 9, 2002
    Applicant: FANUC LTD.
    Inventors: Yoshinori Nakata, Atsushi Mori, Tadashi Kurosawa
  • Patent number: 6335507
    Abstract: A piercing nozzle (2) having a nozzle hole (2a) larger than the diameter of a converged laser beam (10) and smaller than the diameter of a hole (1a) of a cutting nozzle (1) is in use. Further, an underlay (3) having a hole (3a) at a position corresponding to the nozzle hole (2a) is placed under the piercing nozzle (2) through a clearance (5). Piercing is carried out by irradiating the laser beam (10) to a machining target (6) through nozzle holes (1a, 2a) and (3a) on condition that a laser oscillator is set to output high power. The diameter of a hole machined by the piercing is small, and less scattered dross is produced. The scattered dross is cooled down within the clearance (5) and is then dropped down to the underlay (3), so that the adhesion of the scattered dross to the machining target does not occur. Since a small hole is machined with the high power, the machining time for piercing is remarkably shortened.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: January 1, 2002
    Assignee: Fanuc Ltd.
    Inventors: Yoshinori Nakata, Atsushi Mori, Tadashi Kurosawa
  • Patent number: 4620529
    Abstract: This invention relates to a foot bath for recovering from fatigue, easing of neuralgia and muscle-ache, removing stiffness in the neck and shoulders by increasing the circulation of blood, maintaining health, recovering from nervousness and remedying various diseases. The foot bath of the invention comprises a foot bath body which a person's feet enter and in which hot water is contained. It also comprises hot water jets to inject hot water into the foot bath body from a front face thereof, foot vibrators to provide vibration to the whole feet including the soles thereof, calf vibrators to provide vibration to the person's calves, toe stimulators to provide a stimulus to the person's toes, and extreme infrared radiators to provide far infrared rays to the feet.
    Type: Grant
    Filed: February 16, 1984
    Date of Patent: November 4, 1986
    Assignee: Tensho Electric Industrial Co., Ltd.
    Inventor: Tadashi Kurosawa
  • Patent number: 4497313
    Abstract: A foot bath including a bath body for containing hot water, in which a foot is to be inserted, the bath body having a cover having an opening therein. A ceramic layer and a heater are provided in the cover so that the heater heats the ceramic layer to produce far infrared rays to irradiate the foot and hot water in the bath body. A structure is provided beneath the bath body for providing vibration to the foot. A pump is connected to the vibration structure so as to be driven thereby and an air transferring pipe is connected between the pump and the bottom of the bath body to transfer air therethrough while the air is heated by the far infrared radiation. A nozzle is provided in the bath body to mix the heated air and hot water and to eject the mixture of heated air and hot water at the surface of the hot water in a jet water stream.
    Type: Grant
    Filed: December 3, 1982
    Date of Patent: February 5, 1985
    Assignee: Tensho Electric Industrial Co., Ltd.
    Inventor: Tadashi Kurosawa