Patents by Inventor Tadashi Minoda

Tadashi Minoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6464805
    Abstract: An Al—Mg—Si—Cu aluminum alloy plate excelling in strength and formability and exhibiting improved filiform corrosion resistance which is suitably used for automotive body panels. The aluminum alloy plate contains 0.25-0.6% of Mg (mass %, hereinafter the same), 0.9-1.1% of Si, 0.6-1.0% of Cu, and at least one of 0.20% or less of Mn and 0.10% or less of Cr, with the balance consisting of Al and impurities, wherein the number of Q phases (Cu—Mg—Si—Al phases) with a size of 2 &mgr;m or more in diameter present in a matrix is 150 per mm2 or more. The aluminum alloy plate is fabricated by homogenizing an ingot of an aluminum alloy having the above composition at 530° C. or more, cooling the ingot to 450° C. or less at a cooling rate of 30° C./hour or less, hot-rolling the ingot, cold-rolling the hot-rolled product, and providing the cold-rolled product with a solution heat treatment.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: October 15, 2002
    Assignees: Nissan Motor Co., Ltd., Sumitomo Light Metal Industries, Ltd.
    Inventors: Shinji Matsuda, Tsutomu Hattori, Masahito Katsukura, Tadashi Minoda, Hideo Yoshida, Shinichi Matsuda, Mineo Asano, Tsutomu Furuyama
  • Publication number: 20020005232
    Abstract: An Al—Mg—Si—Cu aluminum alloy plate excelling in strength and formability and exhibiting improved filiform corrosion resistance which is suitably used for automotive body panels. The aluminum alloy plate contains 0.25-0.6% of Mg (mass %, hereinafter the same), 0.9-1.1% of Si, 0.6-1.0% of Cu, and at least one of 0.20% or less of Mn and 0.10% or less of Cr, with the balance consisting of Al and impurities, wherein the number of Q phases (Cu—Mg—Si—Al phases) with a size of 2 &mgr;m or more in diameter present in a matrix is 150 per mm2 or more. The aluminum alloy plate is fabricated by homogenizing an ingot of an aluminum alloy having the above composition at 530° C. or more, cooling the ingot to 450° C. or less at a cooling rate of 30° C./hour or less, hot-rolling the ingot, cold-rolling the hot-rolled product, and providing the cold-rolled product with a solution heat treatment.
    Type: Application
    Filed: March 26, 2001
    Publication date: January 17, 2002
    Inventors: Shinji Matsuda, Tsutomu Hattori, Masahito Katsukura, Tadashi Minoda, Hideo Yoshida, Shinichi Matsuda, Mineo Asano, Tsutomu Furuyama