Patents by Inventor Tadashi Nagasawa
Tadashi Nagasawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230209708Abstract: An organic insulator is produced by cured resin product containing a cyclic olefin copolymer as a main component and has a cumulative luminescence amount measured by chemiluminescence measurement method of 3.7×105 cpm or less. The glass transition temperature of the cured product is from 134° C. to 140° C. The cumulative luminescence amount is from 2.8×105 cpm to 3.2×105 cpm. A wiring board includes an insulation layer and an electrical conductor layer disposed on a surface of the insulation layer, and the insulation layer is the organic insulator described above.Type: ApplicationFiled: May 24, 2021Publication date: June 29, 2023Applicant: KYOCERA CorporationInventors: Chie CHIKARA, Tadashi NAGASAWA, Satoshi YOSHIURA, Satoshi KAJITA, Kouji FUJIKAWA
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Patent number: 11426970Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.Type: GrantFiled: June 20, 2019Date of Patent: August 30, 2022Assignee: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Satoshi Yoshiura, Chie Chikara, Satoshi Kajita, Yasuhide Tami
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Publication number: 20210400809Abstract: A wiring board includes an insulating layer comprising organic resin with inorganic particles, a first metal layer on a first surface, and a second metal layer disposed on a second surface. The insulating layer has a thickness of 75-1000 ?m and a storage modulus of 4 GPa-7 GPa. The first metal layer has a thickness of 1.5-10 ?m and a coverage of 5%-25%. The second metal layer has a thickness of 3-10 ?m or 25-100 ?m and a coverage of 85% or more. A surface part of the insulating layer on the first metal layer side has a higher ratio of organic resin than a surface part of the insulating layer on the second metal layer side.Type: ApplicationFiled: October 23, 2019Publication date: December 23, 2021Applicant: KYOCERA CorporationInventors: Tadashi NAGASAWA, Satoshi YOSHIURA
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Publication number: 20210260847Abstract: A laminated uncured sheet of the present disclosure has a structure in which resin sheet layers and resin layers are alternately laminated and a through hole penetrating in the laminating direction is formed, wherein the resin sheet layers are formed with a thermosetting resin composition containing a thermosetting resin as a main component, the resin layers are formed with a thermoplastic resin composition containing a thermoplastic resin, and the thermoplastic resin composition is adhered to the inner wall surface of the resin sheet layer part in the through hole.Type: ApplicationFiled: June 20, 2019Publication date: August 26, 2021Applicant: KYOCERA CorporationInventors: Tadashi NAGASAWA, Satoshi YOSHIURA, Chie CHIKARA, Satoshi KAJITA, Yasuhide TAMI
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Patent number: 10806031Abstract: There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120° C. or higher in a dynamic mechanical analysis.Type: GrantFiled: July 19, 2017Date of Patent: October 13, 2020Assignee: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Chie Chikara, Satoshi Kajita
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Patent number: 10772198Abstract: An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers.Type: GrantFiled: June 26, 2018Date of Patent: September 8, 2020Assignee: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Satoshi Yoshiura, Chie Chikara
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Publication number: 20200128667Abstract: An organic insulator is composed an organic resin phase as a main component. The organic resin phase includes a weather-resistant stabilizer. The organic resin phase includes an inner region and a surface region formed in at least one surface of the inner region. The surface region has a higher content ratio of the weather-resistance stabilizer than the inner region. A metal-clad laminate includes the organic insulator and a metallic foil laminated on at least one surface of the organic insulator. A wiring board includes a plurality of insulating layers composed of the organic insulator, and a metallic foil disposed between the insulating layers.Type: ApplicationFiled: June 26, 2018Publication date: April 23, 2020Applicant: KYOCERA CorporationInventors: Tadashi NAGASAWA, Satoshi YOSHIURA, Chie CHIKARA
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Publication number: 20200077514Abstract: There is provided an organic insulating body which contains a cyclic olefin copolymer as a main component and a peroxide having a benzene ring, and has such a property that a loss tangent peak appears at 120° C. or higher in a dynamic mechanical analysis.Type: ApplicationFiled: July 19, 2017Publication date: March 5, 2020Applicant: KYOCERA CorporationInventors: Tadashi NAGASAWA, Chie CHIKARA, Satoshi KAJITA
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Patent number: 9693451Abstract: A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).Type: GrantFiled: February 20, 2013Date of Patent: June 27, 2017Assignee: KYOCERA CorporationInventors: Tadashi Nagasawa, Katsura Hayashi
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Publication number: 20150037611Abstract: A wiring board (3) according to an embodiment of the present invention includes an inorganic insulating layer (11A); a first resin layer (12A) on one main surface of the inorganic insulating layer (11A); a second resin layer (13A) on another main surface of the inorganic insulating layer (11A); and a conductive layer (8) partially on one main surface of the second resin layer (13A), the one main surface being on an opposite side to the inorganic insulating layer (11A). The inorganic insulating layer (11A) includes a plurality of first inorganic insulating particles (14) which are bound to each other at a part of each of the first inorganic insulating particles and gaps (G) surrounded by the plurality of first inorganic insulating particles (14). A part of the first resin layer (12A) and a part of the second resin layer (13A) are located inside the gaps (G).Type: ApplicationFiled: February 20, 2013Publication date: February 5, 2015Applicant: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Katsura Hayashi
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Patent number: 8431832Abstract: A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than an upper portion; and a second conductor portion (10b) which is formed immediately below the first conductor portion (10a), connected to the first conductor portion (10a), and has a maximum width greater than the upper end width of the first conductor portion (10a). The insulation layer (7) has a plurality of indentations (T1a, T1b) on the surface in contact with the via conductor (10). Convex portions (T2a, T2b) of the via conductor are arranged in the indentations (T1a, T1b).Type: GrantFiled: November 28, 2008Date of Patent: April 30, 2013Assignee: Kyocera CorporationInventors: Tadashi Nagasawa, Katsura Hayashi
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Patent number: 8338717Abstract: A circuit substrate includes a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.Type: GrantFiled: July 28, 2010Date of Patent: December 25, 2012Assignee: Kyocera CorporationInventor: Tadashi Nagasawa
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Patent number: 8129623Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).Type: GrantFiled: January 29, 2007Date of Patent: March 6, 2012Assignee: Kyocera CorporationInventors: Tadashi Nagasawa, Masaharu Shirai, Kenji Kume, Yutaka Tsukada
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Publication number: 20110051386Abstract: A circuit board (2) includes an insulation layer (7) where a via conductor (10) is embedded. The via conductor (10) includes: a first conductor portion (10a) having an lower portion narrower than an upper portion; and a second conductor portion (10b) which is formed immediately below the first conductor portion (10a), connected to the first conductor portion (10a), and has a maximum width greater than the upper end width of the first conductor portion (10a). The insulation layer (7) has a plurality of indentations (T1a, T1b) on the surface in contact with the via conductor (10). Convex portions (T2a, T2b) of the via conductor are arranged in the indentations (T1a, T1b).Type: ApplicationFiled: November 28, 2008Publication date: March 3, 2011Applicant: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Katsura Hayashi
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Publication number: 20110024170Abstract: A circuit substrate comprises a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.Type: ApplicationFiled: July 28, 2010Publication date: February 3, 2011Applicant: KYOCERA CORPORATIONInventor: Tadashi NAGASAWA
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Publication number: 20100065318Abstract: A circuit board according to an embodiment of the present invention relates to a circuit board 2 including an insulating layer 7 and a via conductor 8 embedded in the insulating layer 7. The via conductor 8 has a narrowed portion 80 inclined with respect to a horizontal direction X.Type: ApplicationFiled: November 27, 2007Publication date: March 18, 2010Applicant: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Kiyomi Hagihara, Katsura Hayashi
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Publication number: 20090314526Abstract: The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film (1) includes a plurality of projected portions (10) each having a filler (9) in an apex portion (10a) and a resin material. The projected portions (10) are formed on at least one surface of a sheet portion (16).Type: ApplicationFiled: January 29, 2007Publication date: December 24, 2009Applicant: KYOCERA CORPORATIONInventors: Tadashi Nagasawa, Masaharu Shirai, Kenji Kume, Yutaka Tsukada
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Patent number: 6663946Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.Type: GrantFiled: February 28, 2002Date of Patent: December 16, 2003Assignee: Kyocera CorporationInventors: Takuji Seri, Katsura Hayashi, Tadashi Nagasawa, Kenji Kume, Takahiro Matsunaga, Isao Miyatani
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Publication number: 20020172021Abstract: An object of the invention is to satisfy all of a high-density wiring package, soldering thermal resistance, an insulating property and high-frequency transmission characteristics. The invention is a multi-layer wiring substrate having a lamination of a plurality of dielectric layers which are each provided with a wiring conductor made of a metallic foil on at least one of upper and bottom surfaces of the dielectric layer, the wiring conductors between which the dielectric layer is disposed being electrically connected with each other via a through conductor formed in the dielectric layer; on this occasion, the dielectric layers each individually are composed of a liquid crystal polymer layer and cladding layers made of a polyphenyleneether-type organic substance and formed on upper and bottom surfaces of the liquid crystal polymer layer.Type: ApplicationFiled: February 28, 2002Publication date: November 21, 2002Inventors: Takuji Seri, Katsura Hayashi, Tadashi Nagasawa, Kenji Kume, Takahiro Matsunaga, Isao Miyatani