Patents by Inventor Tadashi Nishino
Tadashi Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6955287Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.Type: GrantFiled: December 14, 2000Date of Patent: October 18, 2005Assignees: Hitachi, Ltd., Pohang Iron and Steel Co., Ltd., Research Institution of Industrial Science and TechnologyInventors: Kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee Kim
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Patent number: 6616511Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: June 5, 2001Date of Patent: September 9, 2003Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6585558Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: August 18, 1999Date of Patent: July 1, 2003Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6450861Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: July 27, 2001Date of Patent: September 17, 2002Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Publication number: 20020009950Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: ApplicationFiled: July 27, 2001Publication date: January 24, 2002Applicant: Hitachi Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6306007Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: January 26, 1999Date of Patent: October 23, 2001Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Publication number: 20010029153Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: ApplicationFiled: June 5, 2001Publication date: October 11, 2001Applicant: Hitachi Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 6283823Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: August 18, 1999Date of Patent: September 4, 2001Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Publication number: 20010017312Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.Type: ApplicationFiled: December 14, 2000Publication date: August 30, 2001Applicant: HITACHI, LTD., POHANG IRON & STEEL CO., LTD.Inventors: kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee kim
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Patent number: 6213381Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.Type: GrantFiled: December 9, 1998Date of Patent: April 10, 2001Assignee: Hitachi, Ltd.Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
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Patent number: 5954565Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: January 24, 1996Date of Patent: September 21, 1999Assignee: Hitachi Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 5884832Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.Type: GrantFiled: October 25, 1996Date of Patent: March 23, 1999Assignee: Hitachi, Ltd.Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
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Patent number: 5651411Abstract: The apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls, The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion, The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has surface in contact with the molten metal which is substantially uniform in width.Type: GrantFiled: June 5, 1995Date of Patent: July 29, 1997Assignee: Hitachi, Ltd.Inventors: Satoshi Hirano, Yutaka Fukui, Hideyo Kodama, Toshiyuki Kajiwara, Yasutsugu Yoshimura, Tomoaki Kimura, Kenji Horii, Tadashi Nishino
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Patent number: 5634510Abstract: The integrated manufacturing system is formed by the combination of a continuous casting apparatus and hot rolling mills. The continuous casting apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls. The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion. The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has a surface in contact with the molten metal which is substantially uniform in width.Type: GrantFiled: December 27, 1994Date of Patent: June 3, 1997Assignee: Hitachi, Ltd.Inventors: Satoshi Hirano, Yutaka Fukui, Hideyo Kodama, Toshiyuki Kajiwara, Yasutsugu Yoshimura, Tomoaki Kimura, Kenji Horii, Tadashi Nishino
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Patent number: 5634257Abstract: By rolling a slab with a thickness of 80 mm or less in a plant including a continuous casting machine and a hot strip rolling mill directly combined with each other, low-speed rolling can be achieved while suppressing a drop of the strip temperature and the occurrence of scales. After a slab 2 cast by a continuous casting machine 1 and being 80 mm or less thick is heated and descaled, it is rough-rolled into a bar with a thickness of 20 to 60 mm by a roughing mill 7 constructed as a 4H-twin mill. After being heated and descaled again, the bar is finish-rolled by finishing mills 19 to 21, each of which employs small-diameter work rolls having a diameter not larger than 500 mm, into a thin plate with a thickness in the range of 1.6 mm to 15 mm or a thick plate with a thickness in the range of 3 mm to 40 mm.Type: GrantFiled: May 17, 1995Date of Patent: June 3, 1997Assignee: Hitachi, Ltd.Inventors: Toshiyuki Kajiwara, Yasutsugu Yoshimura, Kenji Horii, Koichi Seki, Hironori Shimogama, Tadashi Nishino, Chukichi Hanzawa, Akira Goto
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Patent number: 5632177Abstract: In a system and method for manufacturing thin plate by hot-working, a splicing machine for continuously splicing the front edge of a following plate and the rear edge of a precedent plate is provided in the process precedent to a set of rolling mill stands having non-driven small diameter working rollers. By continuously splicing the plates, most portions of the rolled plates can be rolled under a steady state rolling condition, that is, an after-engaged rolling condition, and the thickness reducing amount of the plates in most portions of the rolled material is substantially increased, which substantially improves the rolling efficiency. Thereby, the diameter of the working rollers can be decreased smaller than the diameter of working roller used in a conventional rolling mill, rolling mill strands can be made small, and it can be realized to attain a small-scale system for manufacturing thin plate by hot working.Type: GrantFiled: March 20, 1995Date of Patent: May 27, 1997Assignee: Hitachi, Ltd.Inventors: Kenjiro Narita, Ken-ichi Yasuda, Yukio Hirama, Kouji Satou, Ken-ichi Yoshimoto, Tadashi Nishino, Shinichi Kaga, Yasutsugu Yoshimura
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Patent number: 5630467Abstract: Guide roller units are made movable back and forth in the direction of thickness of a slab, allowing slab lagging covers to be inserted to and withdrawn from gaps formed between the guide roller units and the slab. Depending on the casting speed, those ones of the guide roller units and the slab lagging covers which are in proper positions are replaced from one to the other for selective use so that the respective lengths of a cooling zone and a heat keeping zone are adjusted to control the cooling rate of the slab in a positive manner. The slab temperature can be kept at a value capable of carrying out rolling regardless of change in the casting speed depending on variations in the amount of molten steel supplied.Type: GrantFiled: September 29, 1995Date of Patent: May 20, 1997Assignee: Hitachi, Ltd.Inventors: Yasutsugu Yoshimura, Mituru Onose, Kenji Horii, Koichi Seki, Tadashi Nishino, Hironori Shimogama, Chukichi Hanzawa
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Patent number: 5562525Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.Type: GrantFiled: June 3, 1993Date of Patent: October 8, 1996Assignee: Hitachi, Ltd.Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
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Patent number: 5554294Abstract: The present invention provides a method for dissolving slightly soluble sludge which is produced during chemical conversion coating of metal, which comprises agitating the sludge in an aqueous suspension containing hydrogen type strongly acidic cation exchange resin; exchanging metallic components in the sludge with the resin and adsorbing the metallic components on the resin; dissolving oxyacid components in the sludge into liquid phase; and recovering the metallic components from the resin and the oxyacid components from the resin and the oxyacid components from the solution. The sludge can be dissolved by simple operation and equipment, and effective components in the sludge can be recovered at high yield. The method contributes to effective re-utilization of resources and to prevention of environmental pollution and makes it possible to use the resin semipermanently by regenerating the used ion exchange resin.Type: GrantFiled: July 18, 1995Date of Patent: September 10, 1996Assignee: Yukiyoshi IwamotoInventor: Tadashi Nishino
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Patent number: 5329798Abstract: A leveling device for correcting defective shape of a strip by repeatedly bending the strip under a tensioned condition of the strip, comprising a tension leveler including a stretching roll unit for correcting local elongations of the strip and a C-warp correcting roll unit for correcting the warp in the crosswise direction of the strip, and at least a tension fluctuation suppressing means for suppressing the tension fluctuation transferred from the bridle rolls and preventing the generation of charter mark. The tension fluctuation suppressing means may be composed of a rotary resistant body of at least two deflector rolls or of a pair of pinch rolls arranged one above the other.Type: GrantFiled: December 23, 1991Date of Patent: July 19, 1994Assignee: Hitachi, Ltd.Inventors: Yoshio Takakura, Tomoaki Kimura, Tadashi Nishino