Patents by Inventor Tadashi Nishino

Tadashi Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6955287
    Abstract: An upper shearing blade equipped with a protrusion of a triangle-columnar shape and a lower shearing blade equipped with a protrusion of the same shape are applied onto the overlapped portion of metal plates to be bonded, and then pressed into the metal plates in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates are not completely cut off. The operating loci of the upper, shearing blade and the lower shearing blade are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: October 18, 2005
    Assignees: Hitachi, Ltd., Pohang Iron and Steel Co., Ltd., Research Institution of Industrial Science and Technology
    Inventors: Kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee Kim
  • Patent number: 6616511
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: June 5, 2001
    Date of Patent: September 9, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 6585558
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: July 1, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 6450861
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: September 17, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Publication number: 20020009950
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Application
    Filed: July 27, 2001
    Publication date: January 24, 2002
    Applicant: Hitachi Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 6306007
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: January 26, 1999
    Date of Patent: October 23, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Publication number: 20010029153
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Application
    Filed: June 5, 2001
    Publication date: October 11, 2001
    Applicant: Hitachi Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 6283823
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: September 4, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Publication number: 20010017312
    Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.
    Type: Application
    Filed: December 14, 2000
    Publication date: August 30, 2001
    Applicant: HITACHI, LTD., POHANG IRON & STEEL CO., LTD.
    Inventors: kenji Horii, Yasutsugu Yoshimura, Tadashi Nishino, Takashi Kamoshita, Takayoshi Tomino, Fuminori Ishikawa, Takao Funamoto, Takashi Mashiko, Kenjiro Narita, Jong-Keun Kim, Ki-Chol Kim, Jong-Sub Lee, Hwang-Kyu Hwang, Jung-Sik Lee, Jin-Hee kim
  • Patent number: 6213381
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
  • Patent number: 5954565
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: January 24, 1996
    Date of Patent: September 21, 1999
    Assignee: Hitachi Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 5884832
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: March 23, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
  • Patent number: 5651411
    Abstract: The apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls, The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion, The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has surface in contact with the molten metal which is substantially uniform in width.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 29, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Satoshi Hirano, Yutaka Fukui, Hideyo Kodama, Toshiyuki Kajiwara, Yasutsugu Yoshimura, Tomoaki Kimura, Kenji Horii, Tadashi Nishino
  • Patent number: 5634510
    Abstract: The integrated manufacturing system is formed by the combination of a continuous casting apparatus and hot rolling mills. The continuous casting apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls. The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion. The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has a surface in contact with the molten metal which is substantially uniform in width.
    Type: Grant
    Filed: December 27, 1994
    Date of Patent: June 3, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Satoshi Hirano, Yutaka Fukui, Hideyo Kodama, Toshiyuki Kajiwara, Yasutsugu Yoshimura, Tomoaki Kimura, Kenji Horii, Tadashi Nishino
  • Patent number: 5634257
    Abstract: By rolling a slab with a thickness of 80 mm or less in a plant including a continuous casting machine and a hot strip rolling mill directly combined with each other, low-speed rolling can be achieved while suppressing a drop of the strip temperature and the occurrence of scales. After a slab 2 cast by a continuous casting machine 1 and being 80 mm or less thick is heated and descaled, it is rough-rolled into a bar with a thickness of 20 to 60 mm by a roughing mill 7 constructed as a 4H-twin mill. After being heated and descaled again, the bar is finish-rolled by finishing mills 19 to 21, each of which employs small-diameter work rolls having a diameter not larger than 500 mm, into a thin plate with a thickness in the range of 1.6 mm to 15 mm or a thick plate with a thickness in the range of 3 mm to 40 mm.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: June 3, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Toshiyuki Kajiwara, Yasutsugu Yoshimura, Kenji Horii, Koichi Seki, Hironori Shimogama, Tadashi Nishino, Chukichi Hanzawa, Akira Goto
  • Patent number: 5632177
    Abstract: In a system and method for manufacturing thin plate by hot-working, a splicing machine for continuously splicing the front edge of a following plate and the rear edge of a precedent plate is provided in the process precedent to a set of rolling mill stands having non-driven small diameter working rollers. By continuously splicing the plates, most portions of the rolled plates can be rolled under a steady state rolling condition, that is, an after-engaged rolling condition, and the thickness reducing amount of the plates in most portions of the rolled material is substantially increased, which substantially improves the rolling efficiency. Thereby, the diameter of the working rollers can be decreased smaller than the diameter of working roller used in a conventional rolling mill, rolling mill strands can be made small, and it can be realized to attain a small-scale system for manufacturing thin plate by hot working.
    Type: Grant
    Filed: March 20, 1995
    Date of Patent: May 27, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Kenjiro Narita, Ken-ichi Yasuda, Yukio Hirama, Kouji Satou, Ken-ichi Yoshimoto, Tadashi Nishino, Shinichi Kaga, Yasutsugu Yoshimura
  • Patent number: 5630467
    Abstract: Guide roller units are made movable back and forth in the direction of thickness of a slab, allowing slab lagging covers to be inserted to and withdrawn from gaps formed between the guide roller units and the slab. Depending on the casting speed, those ones of the guide roller units and the slab lagging covers which are in proper positions are replaced from one to the other for selective use so that the respective lengths of a cooling zone and a heat keeping zone are adjusted to control the cooling rate of the slab in a positive manner. The slab temperature can be kept at a value capable of carrying out rolling regardless of change in the casting speed depending on variations in the amount of molten steel supplied.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: May 20, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Yasutsugu Yoshimura, Mituru Onose, Kenji Horii, Koichi Seki, Tadashi Nishino, Hironori Shimogama, Chukichi Hanzawa
  • Patent number: 5562525
    Abstract: A grinding head unit is constituted by a grinding wheel, a drive device for rotating the grinding wheel, and a movement device for moving the grinding wheel. When vibration of a mill roll is applied to the grinding wheel, a plain wheel integral with an abrasive layer of the grinding wheel and having an elastically deforming function is deflected to absorb the vibration energy. The contact force between the abrasive layer and the mill roll is measured for determining a profile of the mill roll. The mill roll can be thereby ground into a target profile while absorbing the vibration transmitted from the mill roll and measuring the profile of the mill roll, without causing any chattering marks.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: October 8, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Shigeru Mori, Shigetoshi Kondoh, Tadashi Nishino, Yasutsugu Yoshimura, Yasuharu Imagawa, Hiroyuki Shiraiwa
  • Patent number: 5554294
    Abstract: The present invention provides a method for dissolving slightly soluble sludge which is produced during chemical conversion coating of metal, which comprises agitating the sludge in an aqueous suspension containing hydrogen type strongly acidic cation exchange resin; exchanging metallic components in the sludge with the resin and adsorbing the metallic components on the resin; dissolving oxyacid components in the sludge into liquid phase; and recovering the metallic components from the resin and the oxyacid components from the resin and the oxyacid components from the solution. The sludge can be dissolved by simple operation and equipment, and effective components in the sludge can be recovered at high yield. The method contributes to effective re-utilization of resources and to prevention of environmental pollution and makes it possible to use the resin semipermanently by regenerating the used ion exchange resin.
    Type: Grant
    Filed: July 18, 1995
    Date of Patent: September 10, 1996
    Assignee: Yukiyoshi Iwamoto
    Inventor: Tadashi Nishino
  • Patent number: 5329798
    Abstract: A leveling device for correcting defective shape of a strip by repeatedly bending the strip under a tensioned condition of the strip, comprising a tension leveler including a stretching roll unit for correcting local elongations of the strip and a C-warp correcting roll unit for correcting the warp in the crosswise direction of the strip, and at least a tension fluctuation suppressing means for suppressing the tension fluctuation transferred from the bridle rolls and preventing the generation of charter mark. The tension fluctuation suppressing means may be composed of a rotary resistant body of at least two deflector rolls or of a pair of pinch rolls arranged one above the other.
    Type: Grant
    Filed: December 23, 1991
    Date of Patent: July 19, 1994
    Assignee: Hitachi, Ltd.
    Inventors: Yoshio Takakura, Tomoaki Kimura, Tadashi Nishino