Patents by Inventor Tadashi Nishioka
Tadashi Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220393119Abstract: A plurality of terminal portions provided in a frame region include first and second terminal electrodes sequentially arranged from a display region side and electrically connected to each other, COFs provided corresponding to the plurality of terminal portions, respectively, include first and second counter electrodes sequentially arranged from the display region side to be opposed to the first and second terminal electrodes, respectively, and electrically connected to each other, and in at least one terminal portion of the plurality of terminal portions, the second terminal electrode and the second counter electrode are electrically connected to each other through an anisotropic conductive film.Type: ApplicationFiled: October 29, 2019Publication date: December 8, 2022Inventors: KEIJI AOTA, TOSHIO ETOH, Tadashi NISHIOKA, TSUGIO NAKAZONO
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Publication number: 20220158145Abstract: A method for manufacturing a display device includes a mounting process in which a frame terminal of a flexible display panel and a counter terminal of a flexible printed circuit substrate are electrically connected by thermocompression bonding. In the mounting process, the thermocompression bonding is performed in a state in which the flexible display panel is folded so that the flexible display panel includes an abutting portion abutting on a mounting stage and a folding portion where the flexible display panel is to be folded over the abutting portion in plan view.Type: ApplicationFiled: April 19, 2019Publication date: May 19, 2022Inventors: KATSUHIRO YAMAGUCHI, Tadashi NISHIOKA, KEIJI AOTA
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Publication number: 20190358945Abstract: A film applying apparatus includes a stage configured to receive a cover glass on the stage, the cover glass having curved portions at opposite ends of the cover glass, and a pressing member positioned in transverse to the cover glass. The pressing member includes a curved plane portion having a curvature radius less than a curvature radius of the curved portion, and a bend preventing portion with a cross section configured to prevent bending of the curved plane portion.Type: ApplicationFiled: March 16, 2017Publication date: November 28, 2019Inventor: Tadashi NISHIOKA
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Publication number: 20190280208Abstract: A base member is placed on a stage, and bonding is performed by bringing the base member and a film into pressure contact with each other with the stage and a roller. Then, the stage moves to perform the pressure contact throughout a whole area of the film.Type: ApplicationFiled: July 27, 2017Publication date: September 12, 2019Inventors: Katsuhiro YAMAGUCHI, Tadashi NISHIOKA
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Publication number: 20190207170Abstract: Disclosed is a panel transport tool including a plate member and an adhesive layer provided on the plate member and allowing a transported panel to be attached to and detached from the adhesive layer. The plate member includes a high floor portion holding the transported panel on a surface of the plate member via the adhesive layer, and a low floor portion having a surface below the surface of the high floor portion.Type: ApplicationFiled: August 30, 2017Publication date: July 4, 2019Inventors: Katsuhiro YAMAGUCHI, Tadashi NISHIOKA, Yuhji TANIGUCHI
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Publication number: 20120067500Abstract: A liquid crystal panel P is positioned and held by a plurality of first locating pins 5 of a first holder 3 with a diagonal line of the liquid crystal panel P oriented in a vertical direction by making use of a weight of the liquid crystal panel P. A backlight B is positioned and held by a plurality of second locating pins 6 of a second holder 4 with a diagonal line of the backlight B corresponding to the diagonal line of the liquid crystal panel P extending in the vertical direction by making use of a weight of the backlight B. A bonding mechanism 13 horizontally moves the second holder 4 to bring the first and second holders 3 and 4 relatively close to each other to bond the liquid crystal panel P and the backlight B. This allows easy and precise positioning and bonding of the objects.Type: ApplicationFiled: February 24, 2010Publication date: March 22, 2012Inventor: Tadashi Nishioka
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Patent number: 5792314Abstract: A photosensitive resin removing method is capable of completely removing a photosensitive resin employed as a photoresist in an etching process for etching an aluminum film, and its derivatives and of improving the durability of a photosensitive resin removing apparatus for carrying out the method. A mixed gas is produced by mixing fluorine compound gas and steam, the mixed gas is excited with microwaves, and the photosensitive resin is exposed to the excited mixed gas to gasify the photosensitive resin.Type: GrantFiled: April 27, 1995Date of Patent: August 11, 1998Assignees: Ryoden Semiconductor System Engineering Corporation, Mitsubishi Denki Kabushiki KaishaInventors: Hiroyuki Shima, Tadashi Nishioka
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Patent number: 5736745Abstract: A sample placement portion is fixed to a frame. A stage and a cylindrical piezoelectric element are attached to the sample placement portion, and on this piezoelectric element, a sample (i.e., a semiconductor wafer) is positioned. A light collecting portion and a light receiving portion integrated together are attached slidably to frame for detecting the number and locations of contaminants. In addition, an analyzing portion for analyzing the types of the contaminants is slidably attached to the frame. Accordingly, it is made possible to reduce the size of the apparatus and to perform a highly reliable evaluation of the contamination.Type: GrantFiled: April 4, 1996Date of Patent: April 7, 1998Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Makiko Nagashima, Tadashi Nishioka
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Patent number: 5723982Abstract: A method and apparatus for measuring electrical characteristics of a thin surface layer of a sample such as a semiconductor element. A triangular pulse wave of is applied between the sample and a probe needle on a cantilever. By measuring current that flows through the thin surface layer of the sample using the probe needle, I/V characteristics are obtained. A control circuit keep constant the clearance between the probe needle and the thin surface layer of the sample by applying a voltage to a piezoelectric element that supports the sample. I/V characteristics are then measured at a plurality of test points on the thin surface layer of the sample.Type: GrantFiled: July 25, 1995Date of Patent: March 3, 1998Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Takao Yasue, Tadashi Nishioka
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Patent number: 5720814Abstract: A supporting plate is disposed above a rotating stage to drive rotatively a semiconductor wafer mounted thereon, and a nozzle fitting rotating disk is secured to the supporting plate rotatively. The rotating center of the nozzle fitting rotating disk is disposed at a position eccentric from a central axis line of the rotating stage. At least one nozzle group in rows composed of a plurality of nozzles for ejecting a photoresist on the semiconductor wafer is fitted to the nozzle fitting rotating disk at intervals in a radial direction of the disk. At least one fitting position of the plurality of nozzles composing nozzle groups is adjustable.Type: GrantFiled: February 21, 1996Date of Patent: February 24, 1998Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Motoshi Takagi, Tadashi Nishioka
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Patent number: 5710066Abstract: Sidewalls of patterned resist are reformed using a reforming agent selected from the group consisting of (a) a carbon trichloride radical, (b) a mixture of silicon ion and oxygen ion, (c) a mixture of carbon ion and carbon monoxide ion, (d) a chlorine radical, (e) aluminum trichloride liquid and (f) dibutyl magnesium liquid, and sidewall reformed portions are thus formed on the sidewalls of pattern resist. The not reformed portion of the patterned resist is removed away, and sidewall reformed portions are left on an object layer. The portion of object layer excluding the portion immediately below sidewall reformed portions is etched away, and fine patterns of object layer are formed as a result.Type: GrantFiled: October 4, 1996Date of Patent: January 20, 1998Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Chikayuki Okamoto, Tadashi Nishioka, Satoru Kawazu
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Patent number: 5702849Abstract: A mask for transferring a pattern in which durability can be improved and a very fine circuit pattern of a light-shielding film can be formed, and a manufacturing method thereof are obtained. In the mask for transferring a pattern, a silicon monocrystalline film 2, an aluminum monocrystalline film 3 and an aluminum oxide film 4 are formed on a mask substrate 1 so as to have a prescribed pattern feature. Silicon monocrystalline film 2 and aluminum monocrystalline film 3 serve as the light-shielding film. Aluminum oxide film 4 serves as an anti reflection and protection film.Type: GrantFiled: September 26, 1996Date of Patent: December 30, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Hirofumi Sakata, Tadashi Nishioka
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Patent number: 5688723Abstract: Sidewalls of patterned resist are reformed using a reforming agent selected from the group consisting of (a) a carbon trichloride radical, (b) a mixture of silicon ion and oxygen ion, (c) a mixture of carbon ion and carbon monoxide ion, (d) a chlorine radical, (e) aluminum trichloride liquid and (f) dibutyl magnesium liquid, and sidewall reformed portions are thus formed on the sidewalls of pattern resist. The not reformed portion of the patterned resist is removed away, and sidewall reformed portions are left on an object layer. The portion of object layer excluding the portion immediately below sidewall reformed portions is etched away, and fine patterns of object layer are formed as a result.Type: GrantFiled: October 4, 1996Date of Patent: November 18, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Chikayuki Okamoto, Tadashi Nishioka, Satoru Kawazu
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Patent number: 5656809Abstract: It is an object to realize a measuring head capable of maintaining high Z direction accuracy even with a measured sample having fine, complicated and very uneven pattern configuration, in an atomic force microscope. A light beam (141) of non-linear polarization is incident upon an end portion (110a) of an upper main surface of a cantilever body (110) having a probe (2). The cantilever body (110) is a polarizing plate, and its refractive index is given by tan (a Brewster's angle of the light beam (141)). Accordingly, a reflected light beam (142) reflected at the end portion (110a) becomes light of linear polarization. A light position detector (150) including an analyzing window (150a) including a polaroid thin film as an analyzing material transmits only the light oscillating in the same direction as the electric vector of the linearly polarized reflected light beam (142) to detect its positional change.Type: GrantFiled: January 17, 1996Date of Patent: August 12, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Norihisa Miyashita, Tadashi Nishioka
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Patent number: 5652428Abstract: A method of use of a scanning probe microscope includes the step of mounting a probe to a scanning probe microscope in ambient atmosphere, the step of drawing on a surface of a standard sample by two-dimensionally scanning while keeping constant a tunnel current under feedback control of a distance between a standard sample and the probe, the step of applying pulse voltage between the probe and the standard sample while two-dimensionally scanning, with feedback control stopped at each scanning point, the step for obtaining drawn image of the surface of the standard sample again, comparing the obtained drawn image with the drawn image obtained in the step of drawing on the surface of the standard sample thereby determining cleanness of the probe, the step of repeating the step of pulse application and the step of determination of cleanness until the probe is cleaned, the step for replacing the standard sample by a sample for measurement after cleanness of the probe is confirmed, and the step of drawing.Type: GrantFiled: January 22, 1996Date of Patent: July 29, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Tadashi Nishioka, Takao Yasue
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Patent number: 5622787Abstract: A mask for transferring a pattern in which durability can be improved and a very fine circuit pattern of a light-shielding film can be formed, and a manufacturing method thereof are obtained. In the mask for transferring a pattern, a silicon monocrystalline film 2, an aluminum monocrystalline film 3 and an aluminum oxide film 4 are formed on a mask substrate 1 so as to have a prescribed pattern feature. Silicon monocrystalline film 2 and aluminum monocrystalline film 3 serve as the light-shielding film. Aluminum oxide film 4 serves as an anti reflection and protection film.Type: GrantFiled: September 26, 1994Date of Patent: April 22, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor Systems Engineering CorporationInventors: Hirofumi Sakata, Tadashi Nishioka
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Patent number: 5595941Abstract: Sidewalls of patterned resist are reformed using a reforming agent selected from the group consisting of (a) a carbon trichloride radical, (b) a mixture of silicon ion and oxygen ion, (c) a mixture of carbon ion and carbon monoxide ion, (d) a chlorine radical, (e) aluminum trichloride liquid and (f) dibutyl magnesium liquid, and sidewall reformed portions are thus formed on the sidewalls of pattern resist. The not reformed portion of the patterned resist is removed away, and sidewall reformed portions are left on an object layer. The portion of object layer excluding the portion immediately below sidewall reformed portions is etched away, and fine patterns of object layer are formed as a result.Type: GrantFiled: February 27, 1995Date of Patent: January 21, 1997Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Chikayuki Okamoto, Tadashi Nishioka, Satoru Kawazu
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Patent number: 5530253Abstract: A sample stage of a scanning probe microscope head is capable of changing the direction of a sample plane stably over a wide range in a simple operation. Fixtures fix both ends of an outer flexible tube of a flexible shaft. A displacement lead-in portion displaces one end of an inner flexible tube of the flexible shaft relative to the outer flexible tube, and a displacement lead-out portion and a coupling portion transmit the displacement led in the inner flexible tube of the flexible shaft to a sample carrier portion to turn the sample carrier portion about a turn axis, thereby getting a sample plane to change direction.Type: GrantFiled: October 6, 1994Date of Patent: June 25, 1996Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Tadashi Nishioka, Takao Yasue
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Patent number: 5477732Abstract: An adhesion measuring apparatus includes a measuring device for measuring a Force-Curve at each of multiple measuring points on a sample surface using a cantilever provided at its distal end with a probe which is made of a material to be formed on the sample surface, and a distribution image forming device for calculating adhesion between a material making up the sample surface and the material to be formed on the sample surface from an output of the measuring device, and forming an image of adhesion distribution on the sample surface.Type: GrantFiled: September 29, 1994Date of Patent: December 26, 1995Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Takao Yasue, Tadashi Nishioka
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Patent number: 5469733Abstract: A cantilever for an atomic force microscope includes a probe and a cantilever body supporting the probe, the probe deflecting in response to an atomic force between said probe and a sample, at least the surface of the probe including one of a resist film and a sputtered film. One method of manufacturing the cantilever includes selectively etching the surface of a silicon substrate to form an etch pit, forming a resist film in at least the etch pit, forming a nitride film on the resist film, forming a glass base plate on the nitride film in a predetermined area not including the etch pit, and removing the silicon substrate. An atomic force microscope is also provided in which the cantilever is used to measure an atomic force between a sample and the probe having a desired film on a surface.Type: GrantFiled: February 9, 1994Date of Patent: November 28, 1995Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takao Yasue, Tadashi Nishioka