Abstract: There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.

Abstract: There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.

Abstract: A load port which can selectively receive plural types of cassette having substrate which are to be processed accommodated therein is disclosed. The load port has the following constituents. That is, the load port includes a main body, an opening portion (which has a configuration that opens in the three surfaces) formed in one side surface of the main body, a placement table formed in the opening portion and used to place the cassette thereon, a first sensor mechanism (which identifies the type of the cassette) provided on the placement table, plural types of clamp mechanism (each type of the clamp mechanism clamping the corresponding type of cassette) provided on the placement table, and an up-down-type cover mechanism (which is vertically moved) which covers the opening portion of the main body.

Abstract: A load port which can selectively receive plural types of cassette having substrate which are to be processed accommodated therein is disclosed. The load port has the following constituents. That is, the load port includes a main body, an opening portion (which has a configuration that opens in the three surfaces) formed in one side surface of the main body, a placement table formed in the opening portion and used to place the cassette thereon, a first sensor mechanism (which identifies the type of the cassette) provided on the placement table, plural types of clamp mechanism (each type of the clamp mechanism clamping the corresponding type of cassette) provided on the placement table, and an up-down-type cover mechanism (which is vertically moved) which covers the opening portion of the main body.

Abstract: A head plate opening/closing force-reducing mechanism includes a head plate (13) one end of which is rotatably attached (13B) to a main body so as to open/close an opening (31) formed in the main body (10), and at least one push-up mechanism (16, 17, 18) attached to at least one edge (36) of the head plate, the push-up mechanism being located in a position close to an opposite end of the head plate.

Abstract: A probing apparatus has an apparatus body and a test head detachable from the apparatus body. A probe card having a plurality of probe needles to be brought into contact with a semiconductor wafer is supported by the test head. Three engaging rods are disposed on the test head around the probe card to receive the load of the test head in a distributed manner. A vertically movable work table is disposed on the apparatus body to place a substrate thereon. Two first support mechanisms and one second support mechanism are disposed on the apparatus body around the work table to support the test head such that the probe card opposes the work table. The support mechanisms detachably engage with the engaging rods and support the test head through the engaging rods. The first support mechanisms have elevating mechanisms for moving the test head in the vertical direction through the engaging rods.

Abstract: A probe apparatus having a measuring section with a first system for electrically measuring an object. A loader section has a second system for carrying objects to the measuring section and a marking section has a third system for marking objects. These sections are independent of each other so that a vibration occurring in one section is not transmitted to the other sections.

Abstract: An electric probing test machine including a test stage unit which is constructed as an independent component of at least one system and used to test the electrical characteristics of a wafer by having the wafer on the stage contacted by a multitude of probes and a loading/unloading unit which is constructed as an independent component of at least one system and used to bring a wafer from a wafer cassette to the stage of the test stage unit or from the stage of the test stage unit to the wafer cassette. The loading/unloading unit is combined with the test stage unit in such a way that the loading/unloading unit can be separated and moved away from the test stage unit.