Patents by Inventor Tadashi Okawa

Tadashi Okawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12129379
    Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: October 29, 2024
    Assignee: Dow Toray Co., Ltd.
    Inventors: Michitaka Suto, Tadashi Okawa, Satoshi Onodera, Hidefumi Tanaka, Haruhiko Furukawa
  • Patent number: 12037525
    Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. Also provided is a release film, laminate, and method of manufacture.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: July 16, 2024
    Assignee: DOW TORAY CO., LTD.
    Inventors: Michitaka Suto, Tadashi Okawa, Satoshi Onodera, Hidefumi Tanaka, Haruhiko Furukawa
  • Patent number: 12024535
    Abstract: An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): YaR1bSiO(4-a-b)/2 wherein R1 is an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0<a?2, 0<b?3, and a?b. The organosilicon compound is compatible with organopolysiloxanes and is useful as a photo-initiator for various types of photo-curable compositions.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 2, 2024
    Assignees: DOW TORAY CO., LTD., DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Eun Sil Jang, Takuya Ogawa, Tadashi Okawa
  • Publication number: 20240158673
    Abstract: Provided is an organopolysiloxane compound serving as a raw material of an organopolysiloxane pressure-sensitive adhesive which has necessary and sufficient pressure-sensitive adhesive strength in a step such as temporary fixing or the like and can be easily peeled off from a substrate in a subsequent step; an organopolysiloxane pressure-sensitive adhesive composition containing the same; and a method for using the same. A chain co-modified organopolysiloxane containing a silicon-bonded functional group (RA) that contains a specific (meth)acrylic group and at least one aliphatic unsaturated carbon-carbon bond (RVi) (but excluding the functional group serving as RA above); a curable organopolysiloxane composition containing the same, further containing a crosslinking agent, a hydrosilylation reaction catalyst, and a photo-radical polymerization initiator, and having both heat curability and photo-curability.
    Type: Application
    Filed: February 28, 2022
    Publication date: May 16, 2024
    Inventors: Yuki YOKOUCHI, Tomohiro IIMURA, Tadashi OKAWA
  • Publication number: 20240150526
    Abstract: Provided is an organopolysiloxane compound serving as a raw material of an organopolysiloxane pressure-sensitive adhesive which has necessary and sufficient pressure-sensitive adhesive strength in a step such as temporary fixing or the like and can be easily peeled off from a substrate in a subsequent step; an organopolysiloxane pressure-sensitive adhesive composition containing the same; and a method for using the same. A chain co-modified organopolysiloxane containing a specific functional group having a (meth)acryl group (RA) and a functional group having an alcoholic hydroxyl group (ROH), wherein the amount of RA is in the range of 0.10 to 10.0 mol % with regard to all silicon atom-bonded functional groups in the molecule, and the average amount of ROH is in a range of 0.1 to 1.0 moles per mole of RA.
    Type: Application
    Filed: February 28, 2022
    Publication date: May 9, 2024
    Inventors: Yuki YOKOUCHI, Tomohiro IIMURA, Tadashi OKAWA
  • Publication number: 20220073749
    Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film and laminate are also provided. The curable silicone composition comprises: (A) a fluorine-containing organopolysiloxane mixture obtained by mixing the following components (A1) and (A2) at a mass ratio of 1/99 to 45/55: (A1) a fluoro(poly)ether modified organopolysiloxane having at least two alkenyl groups per molecule along with a fluoro(poly)ether-containing organic group; (A2) a fluoroalkyl group-containing organopolysiloxane having at least two alkenyl groups per molecule along with a fluoroalkyl group having 1 to 12 carbon atoms; (B) an organopolysiloxane having at least three silicon atom-bonded hydrogen atoms per molecule; (C) a hydrosilylation reaction catalyst; and (D) an organic solvent.
    Type: Application
    Filed: December 27, 2019
    Publication date: March 10, 2022
    Inventors: Michitaka SUTO, Tadashi OKAWA, Satoshi ONODERA, Hidefumi TANAKA, Haruhiko FURUKAWA
  • Publication number: 20220064497
    Abstract: Provided is a curable silicone composition for a release agent which can form a release film having a silicone adhesive with a low release force even when thin and which does not reduce the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. Also provided is a release film, laminate, and method of manufacture.
    Type: Application
    Filed: December 27, 2019
    Publication date: March 3, 2022
    Inventors: Michitaka SUTO, Tadashi OKAWA, Satoshi ONODERA, Hidefumi TANAKA, Haruhiko FURUKAWA
  • Publication number: 20220056322
    Abstract: Provided is a curable silicone composition for a release agent which can release a release film from a silicone adhesive with low release force without reducing the adhesive strength of the silicone adhesive to other substrates upon releasing the release film. A release film or laminate having the small release force of the silicone adhesive is also provided. The curable silicone composition comprises: (A) a mixture of two or more fluoroalkyl group-containing organopolysiloxanes having a fluoroalkyl group and at least two alkenyl groups per molecule, wherein the contents of the fluoroalkyl groups differ from each other, and the two or more fluoroalkyl group-containing organopolysiloxanes are a combination of those which are not completely compatibilized at 25° C. when mixed in the absence of a solvent; (B) an organopolysiloxane having at least three silicon-bonded hydrogen atoms per molecule; (C) an effective amount of a hydrosilylation reaction catalyst; and (D) an organic solvent.
    Type: Application
    Filed: December 27, 2019
    Publication date: February 24, 2022
    Inventors: Michitaka SUTO, Satoshi ONODERA, Tadashi OKAWA, Hidefumi TANAKA, Haruhiko FURUKAWA
  • Publication number: 20220017547
    Abstract: An organosilicon compound having not more than 200 silicon atoms per molecule is provided. The organosilicon compound is represented by the following average compositional formula (I): YaR1bSiO(4-a-b)/2 wherein R1 is an alkyl group having 1 to 12 carbon atoms, alkenyl group having 2 to 12 carbon atoms, aryl group having 6 to 20 carbon atoms, alkoxy group having 1 to 6 carbon atoms, or a hydroxyl group; Y is a specific acylphosphinate residue; and subscripts a and b are numbers satisfying the following conditions: 0<a?2, 0<b?3, and a?b. The organosilicon compound is compatible with organopolysiloxanes and is useful as a photo-initiator for various types of photo-curable compositions.
    Type: Application
    Filed: September 26, 2019
    Publication date: January 20, 2022
    Inventors: Eun Sil JANG, Takuya OGAWA, Tadashi OKAWA
  • Publication number: 20220002546
    Abstract: A photo-curable organopolysiloxane composition is provided. The photo-curable organopolysiloxane composition comprises: (A) 100 parts by mass of a photo-curable organopolysiloxane; and (B) about 0.01 to about 5.0 parts by mass of an organosilicon compound having at least one photo-active organic group and having at most about 200 silicon atoms per molecule, wherein the organosilicon compound is activated when it is exposed to light of a wavelength of from 300 to 420 nm. The photo-curable organopolysiloxane composition exhibits good storage ability and can be cured by exposing light of a wavelength of from 300 to 420 nm, and can form a cured product exhibiting good transparency.
    Type: Application
    Filed: September 26, 2019
    Publication date: January 6, 2022
    Inventors: Eun Sil JANG, Takuya OGAWA, Tadashi OKAWA
  • Patent number: 10940105
    Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: March 9, 2021
    Assignees: Dow Silicones Corporation, Dow Toray Co., Ltd.
    Inventors: Haruhiko Furukawa, John Bernard Horstman, Tomohiro Iimura, Tadashi Okawa, Steven Swier
  • Patent number: 10874604
    Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: December 29, 2020
    Assignees: DOW TORAY CO., LTD., DOW SILICONES CORPORATION
    Inventors: Haruhiko Furukawa, John Bernard Horstman, Tomohiro Iimura, Tadashi Okawa, Steven Swier
  • Publication number: 20200253855
    Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.
    Type: Application
    Filed: October 3, 2017
    Publication date: August 13, 2020
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20200131410
    Abstract: A release agent composition for a silicone pressure-sensitive adhesive is disclosed. The composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (C) a hydrosilylation reaction catalyst. A release film having a small peeling force with respect to a silicone pressure-sensitive adhesive can be formed with the composition.
    Type: Application
    Filed: June 19, 2018
    Publication date: April 30, 2020
    Inventors: Tadashi OKAWA, Michitaka SUTO, Satoshi ONODERA, Kazuhiro NISHIJIMA, Hidefumi TANAKA, Haruhiko FURUKAWA
  • Patent number: 10604658
    Abstract: An organic silicon compound is disclosed which is represented by a formula: (R13SiO)3SiR2—[SiR32O]y[SiR32]w—R4—R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: March 31, 2020
    Assignee: Dow Toray Co., Ltd.
    Inventors: Haruhiko Furukawa, Makoto Iwai, Kousei Iwakawa, Eiji Kitaura, Kazuhiro Nishijima, Tadashi Okawa
  • Publication number: 20200048416
    Abstract: A silicone resin-linear co-polymer is disclosed. The silicone resin-linear copolymer includes a resinous structure having the general formula (1): (R1R2R3SiO1/2)x(R4SiO3/2)y ??(1) wherein each R1, R2, R3 and R4 is an independently selected substituted or unsubstituted hydrocarbyl group, with the proviso that in one molecular at least two of R1, R2, and R3 are aryl groups; and x and y are each from >0 to <1 such that x+y=1; and a linear structure having the general formula (2): (R5R6SiO2/2) ??(2) wherein R5 and R6 are each independently selected substituted or unsubstituted hydrocarbyl groups. End use applications and related methods of the silicone resin-linear copolymer are also disclosed.
    Type: Application
    Filed: October 4, 2017
    Publication date: February 13, 2020
    Applicants: Dow Silicones Corporation, Dow Corning Toray Co., Ltd.
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20200038312
    Abstract: A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by R1SiO3/2 (where R1 is a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiO4/2 and a linear structure (A2) block represented by (R2SiO2/2)n (where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si—O—Si bond and has an R1SiO3/2 unit.
    Type: Application
    Filed: October 3, 2017
    Publication date: February 6, 2020
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20190233594
    Abstract: A silicone resin-linear copolymer is disclosed which has a resinous structure (A1) including R1SiO3/2 units, and a linear structure (A2) including repeated R22SiO2/2 units, wherein R1 is a propyl group and each R2 is an independently selected substituted or unsubstituted hydrocarbyl group, and wherein the resinous structure (A1) and the linear structure (A2) are bonded together in the silicone resin-linear copolymer via a siloxane bond.
    Type: Application
    Filed: October 4, 2017
    Publication date: August 1, 2019
    Applicants: DOW SILICONES CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20190231674
    Abstract: Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by R1SiO3/2 (wherein R1 represents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO4/2; and a linear structure (A2) block represented by (R2SiO2/2)n (wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si—O—Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiO3/2 unit.
    Type: Application
    Filed: October 3, 2017
    Publication date: August 1, 2019
    Inventors: Haruhiko FURUKAWA, John Bernard HORSTMAN, Tomohiro IIMURA, Tadashi OKAWA, Steven SWIER
  • Publication number: 20180230172
    Abstract: An organic silicon compound is disclosed which is represented by a formula : (R13SiO)3SiR2-[SiR32O]y[SiR32]w-R4-R5, wherein each of R1 and R3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R2 is a divalent hydrocarbon group or an oxygen atom, R4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R5 is a monovalent group represented by (R6O)qR7(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R6 and R7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.
    Type: Application
    Filed: August 11, 2014
    Publication date: August 16, 2018
    Inventors: Haruhiko FURUKAWA, Makoto IWAI, Kousei IWAKAWA, Eiji KITAURA, Kazuhiro NISHIJIMA, Tadashi OKAWA