Abstract: This component mounting apparatus includes a head portion capable of mounting a component suctioned by a nozzle on a board, a board imaging portion provided on the head portion to be movable relative to the head portion so as to image the board, and an imaging position correction mark provided in the head portion to be capable of being imaged by the board imaging portion and is configured to correct the displacement of the board imaging portion relative to the head portion on the basis of an image of the imaging position correction mark imaged by the board imaging portion.

Abstract: A component mounter comprises a mounting head that holds a plurality of nozzles. Two imaging positions are provided for the circumferential orbit along which the nozzles of the mounting head are arranged. While the nozzles are rotated continuously about the rotation axis, an operation of imaging the nozzles located at the imaging positions is performed for each of the imaging positions. Therefore, in a period when the nozzles rotate by an angle not larger than a predetermined angle around the rotation axis formed by the interval between the two imaging positions adjacent to each other along the circumferential orbit, imaging of the nozzles can be completed by locating each of the nozzles at one of the two imaging positions. As a result, it becomes possible to image the plurality of nozzles of the mounting head efficiently.

Abstract: A component imaging device has: a head unit that has a first head row and a second head row; an imaging unit that images components held by heads; a moving device for moving the head unit; and an imaging control device. The imaging unit includes an image sensor and an optical system. The optical system includes a first light-guiding portion that guides light from a component of the first head row to the image sensor, and a second light-guiding portion that guides light from a component of the second head row to the image sensor. An optical path length of the first light-guiding portion is set so as to obtain a focused image, and an optical path length of the second light-guiding portion is set so as to obtain a focused image. The imaging control device controls the positions of the heads and the exposure timing.

Abstract: Provided is a susceptor capable of achieving improved thermal uniformity while suppressing reduction in its temperature increase rate and heat utilization efficiency. A susceptor includes a plate-shaped first member including a wafer placement surface on which to place a wafer, and a second member supporting the first member and laid on the first member in the direction perpendicular to the wafer placement surface. The thermal conductivity of the first member is higher than the thermal conductivity of the second member.

Abstract: A component imaging device has: a head unit that has a first head row and a second head row; an imaging unit that images components held by heads; a moving device for moving the head unit; and an imaging control device. The imaging unit includes an image sensor and an optical system. The optical system includes a first light-guiding portion that guides light from a component of the first head row to the image sensor, and a second light-guiding portion that guides light from a component of the second head row to the image sensor. An optical path length of the first light-guiding portion is set so as to obtain a focused image, and an optical path length of the second light-guiding portion is set so as to obtain a focused image. The imaging control device controls the positions of the heads and the exposure timing.

Abstract: This component mounting apparatus includes a head portion capable of mounting a component suctioned by a nozzle on a board, a board imaging portion provided on the head portion to be movable relative to the head portion so as to image the board, and an imaging position correction mark provided in the head portion to be capable of being imaged by the board imaging portion and is configured to correct the displacement of the board imaging portion relative to the head portion on the basis of an image of the imaging position correction mark imaged by the board imaging portion.

Abstract: An attraction state inspection device includes a diffusion member that is disposed inside a nozzle group in which a plurality of nozzles that attract parts are disposed, and transmits incident light while diffusing the light, an image pickup is disposed on a side of the nozzle group apart from the diffusion member in a first direction, picks up an image of a part attracted by one nozzle positioned in the first direction with respect to the diffusion member, from among the plurality of nozzles, against a background of the diffusion member, and obtains an image of the part, an irradiation unit that is disposed opposite the image pickup unit with the diffusion member interposed therebetween, and radiates light toward the nozzle group, and an inspection unit that inspects an attraction state of the part on the basis of the image of the picked up part.

Abstract: An attraction state inspection device includes a diffusion member that is disposed inside a nozzle group in which a plurality of nozzles that attract parts are disposed, and transmits incident light while diffusing the light, an image pickup is disposed on a side of the nozzle group apart from the diffusion member in a first direction, picks up an image of a part attracted by one nozzle positioned in the first direction with respect to the diffusion member, from among the plurality of nozzles, against a background of the diffusion member, and obtains an image of the part, an irradiation unit that is disposed opposite the image pickup unit with the diffusion member interposed therebetween, and radiates light toward the nozzle group, and an inspection unit that inspects an attraction state of the part on the basis of the image of the picked up part.

Abstract: A substrate processing apparatus includes: a gas supply mechanism supplying gas containing a halogen element and basic gas into a process chamber; and a first temperature adjusting member and a second temperature adjusting member adjusting a temperature of the substrate in the process chamber, wherein the second temperature adjusting member adjusts the temperature of the substrate to a higher temperature than the first temperature adjusting member.

Abstract: The present invention has an object to provide a cold cathode field-emission electron gun with low aberration, to thereby provide a high-brightness electron gun even in the case of a large current. The present invention provides a field-emission electron gun which extracts an electron beam from a cathode and converges the extracted electron beam, the field-emission electron gun including: a magnetic field lens which is provided such that the cathode is disposed inside of a magnetic field of the lens; and an extraction electrode for extracting electrons from the cathode, the extraction electrode being formed into a cylindrical shape without an aperture structure. The present invention can provide an electron gun having a function of converging an electron beam using a magnetic field, the electron gun which is capable of reducing an incidental electrostatic lens action and has small aberration and high brightness.

Abstract: A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate.

Abstract: In a double glazing where a pair of transparent glass sheets are arranged at an interval by having a spacer at the circumferential end portion and where a hollow layer sealed between the pair of glass sheets is formed, there is provided an electromagnetic absorption board used for wireless LAN, which is characterized in that the thickness of the glass sheet is in a range of 2.5-20 mm, that the thickness of the hollow layer is in a range of 2.5-15 mm, that at least one glass sheet of the pair of glass sheets is formed with a resistive film having a surface resistance (surface resistivity) in a range of 20?/? to 2 k?/?, and that the resistive film is formed on a glass sheet side on the hollow layer side.

Abstract: A heat treatment apparatus for heat-treating a silicon substrate includes a mounting table for mounting and heating the silicon substrate thereon, wherein a cover made of any of silicon, silicon carbide, and aluminum nitride is placed on an upper surface of the mounting table. By covering the upper surface of the mounting table by the cover made of silicon or the like, metal contamination of the lower surface of the silicon substrate is suppressed.

Abstract: A processing method according to the present invention coats a polar liquid film or forms an inorganic film on a surface of an organic film formed on a substrate as a protective film. The processing method comprises a modifying step of curing an organic film by irradiating the organic film with electron beams by means of an electron-beam irradiation device in a rare gas atmosphere, and an applying step of applying a polar liquid to the modified surface of the organic film or a film forming step of forming an inorganic film on the organic film. The organic film is cured and affinity for the polar liquid or the inorganic film is imparted to the organic film.

Abstract: In a double glazing where a pair of transparent glass sheets are arranged at an interval by having a spacer at the circumferential end portion and where a hollow layer sealed between the pair of glass sheets is formed, there is provided an electromagnetic absorption board used for wireless LAN, which is characterized in that the thickness of the glass sheet is in a range of 2.5-20 mm, that the thickness of the hollow layer is in a range of 2.5-15 mm, that at least one glass sheet of the pair of glass sheets is formed with a resistive film having a surface resistance (surface resistivity) in a range of 20-2K?/?, and that the resistive film is formed on a glass sheet side on the hollow layer side.

Abstract: The present invention relates to a laminated glass having an interlayer film between at least two transparent glass platy bodies. Functional ultra-fine particles of a particle diameter of not greater than 0.2 ?m are dispersed in the interlayer film. The functional ultra-fine particles comprise a single substance of metal, oxide, nitride, sulfide or Sb- or F-doped substance of Sn, Ti, Si, Zn, Zr, Fe, Al, Cr, Co, Ce, In, Ni, Ag, Cu, Pt, Mn, Ta, W, V and Mo, or a composite selected from at least two of these, or a mixture containing an organic resin substance in the single substance or composite, or a coated substance coated with the single substance or composite, or an antimony-doped tin oxide and/or tin-doped indium oxide. An infrared-reflective film that selectively reflects a near-infrared ray and has a sheet resistivity ranging from 1 k?/? to 10 G?/? is formed on at least one surface of the interlayer film or at least one transparent glass platy body.

Abstract: In a front surface mirror used for a rear projection television, in which a metal film and a metal oxide film are formed on a glass substrate in this order, the front surface mirror being characterized in that a surface of the glass substrate is reformed by ion etching and that the metal film is an Al film.

Abstract: A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate.

Abstract: A substrate processing apparatus includes: a mounting table to have the substrate placed thereon in a process chamber; a first temperature adjusting mechanism temperature-adjusting the substrate placed on the mounting table; a lifter mechanism lifting up the substrate from the mounting table in the process chamber; and a second temperature adjusting mechanism temperature-adjusting the substrate lifted up from the mounting table by the lifter mechanism, wherein the first temperature adjusting mechanism and the second temperature adjusting mechanism temperature-adjust the substrate to different temperatures respectively.

Abstract: A substrate processing apparatus includes: a gas supply mechanism supplying gas containing a halogen element and basic gas into a process chamber; and a first temperature adjusting member and a second temperature adjusting member adjusting a temperature of the substrate in the process chamber, wherein the second temperature adjusting member adjusts the temperature of the substrate to a higher temperature than the first temperature adjusting member.