Abstract: A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.

Abstract: A solder paste for soldering micro components which suppress electro-migration is provided. The solder paste comprising: a powdered Pb-free soldering alloy comprising Cu of 0.1˜3.0 wt. % and In of 0.5˜8.0 wt. % simultaneously in addition to Sn; and a pasty or liquid flux; the powdered Pb-free soldering alloy and the pasty or liquid flux being mixed; whereby effectively suppressing electro-migration occurring at a solder bonding portion. It is possible to add Ag, Sb, Ni, Co, Fe, Mn and Cr as a strength improvement element, Bi and Zn as a melting point drop element and P, Ga and Ge as an anti-oxidant element to the powdered Pb-free soldering alloy.

Abstract: There is disclosed a soldering alloy which prevents an iron tip of a soldering iron from being deteriorated. The soldering alloy comprises: 0.3 to 3% by weight of Cu; 0.01 to 0.1% by weight of Fe; 0.001 to 0.004% by weight of Ga; and a remainder including Sn and unavoidable impurities.

Abstract: There is disclosed a soldering alloy which prevents an iron tip of a soldering iron from being deteriorated. The soldering alloy comprises: 0.3 to 3% by weight of Cu; 0.01 to 0.1% by weight of Fe; 0.001 to 0.004% by weight of Ga; and a remainder including Sn and unavoidable impurities.

Abstract: A Pb-free soldering alloy that does not include any Pb is provided. The soldering alloy prevents Cu present in a printed-circuit board from combining with Ni in the soldering alloy at the soldered part, prevents Cu from precipitating and diffusing in the soldering alloy, suppresses the generation of fine cracks at the soldered part and increases the mechanical strength of the soldered part. The Pb-free soldering alloy contains 3.5 to 6.0 wt. % Ag, 0.001 to 1.0 wt. % Ni and Sn for the balance.

Abstract: A method of manufacturing radiators by joining a corrugated fin to a base plate, characterized by low costs and prevention of thermal deformation of the corrugated fin due to low-temperature soldering. A first soldering at the lower ends of the corrugated fin is conducted by a first soldering alloy in a recess heated by a heating plate in a mobile solder tank filled with the molten first soldering alloy. A second soldering alloy is heated by a heating plate on a base plate and the molten second soldering alloy is used to conduct a second soldering. When the corrugated fin is placed on the base plate, pressed and heated, the first and second solders are melted to join the corrugated fin to the base plate.

Abstract: The present invention proposes Pb-free soldering alloy which does not contain Pb to prevent the environment from being contaminated by Pb when the soldered product is put on a wasteyard and to enhance the mechanical strength at the soldered joint by the soldering alloy. The Pb-free soldering alloy is characterized in that it contains Cu in 0.05 to 2.0 wt. %, Ni in 0.001 to 2.0 wt. % and Sn in the balance.

Abstract: Pb-free soldering alloy that does not include any amount of Pb is proposed.