Patents by Inventor Tadashi SHOJO
Tadashi SHOJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12172198Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: GrantFiled: January 26, 2022Date of Patent: December 24, 2024Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Kazuya Dobashi, Takehiko Orii, Yukimasa Saito, Kunihiko Koike, Takehiko Senoo, Koichi Izumi, Yu Yoshino, Tadashi Shojo, Keita Kanehira
-
Patent number: 11482455Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.Type: GrantFiled: July 18, 2018Date of Patent: October 25, 2022Assignees: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki Manabe, Takehiko Senoo, Koichi Izumi, Tadashi Shojo, Takafumi Ogiwara, Takeshi Sakamoto
-
Patent number: 11380586Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.Type: GrantFiled: July 18, 2018Date of Patent: July 5, 2022Assignees: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki Manabe, Takehiko Senoo, Koichi Izumi, Tadashi Shojo, Takafumi Ogiwara, Takeshi Sakamoto
-
Publication number: 20220143655Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
-
Patent number: 11267021Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: GrantFiled: February 9, 2018Date of Patent: March 8, 2022Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Kazuya Dobashi, Takehiko Orii, Yukimasa Saito, Kunihiko Koike, Takehiko Senoo, Koichi Izumi, Yu Yoshino, Tadashi Shojo, Keita Kanehira
-
Publication number: 20210107041Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: February 9, 2018Publication date: April 15, 2021Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
-
Publication number: 20200365460Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.Type: ApplicationFiled: July 18, 2018Publication date: November 19, 2020Applicants: Iwatani Corporation, Hamamatsu Photonics K.K.Inventors: Toshiki MANABE, Takehiko SENOO, Koichi IZUMI, Tadashi SHOJO, Takafumi OGIWARA, Takeshi SAKAMOTO
-
Publication number: 20200365461Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.Type: ApplicationFiled: July 18, 2018Publication date: November 19, 2020Applicants: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki MANABE, Takehiko SENOO, Koichi IZUMI, Tadashi SHOJO, Takafumi OGIWARA, Takeshi SAKAMOTO