Patents by Inventor Tadashi Takemoto
Tadashi Takemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10518362Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.Type: GrantFiled: July 8, 2016Date of Patent: December 31, 2019Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki Ikeda, Kosuke Inoue, Kazuya Ichikawa, Tadashi Takemoto
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Patent number: 10300562Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.Type: GrantFiled: July 9, 2018Date of Patent: May 28, 2019Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Shunsuke Ishikawa, Kensuke Nakanishi, Yuka Matsushima, Tadashi Takemoto
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Publication number: 20190134759Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, nickel and an additional element, the content ratios of the silver, the copper, the bismuth, the antimony, the indium, the nickel and the additional element, which is at least one of germanium, gallium, iron or phosphorus, are defined, the content ratio of the tin is the remaining ratio, and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less. In a further embodiment, the solder alloy additionally contains a defined amount of cobalt.Type: ApplicationFiled: December 28, 2018Publication date: May 9, 2019Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Shunsuke ISHIKAWA, Kensuke NAKANISHI, Yuka MATSUSHIMA, Tadashi TAKEMOTO
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Patent number: 10213880Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.Type: GrantFiled: February 3, 2016Date of Patent: February 26, 2019Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Shunsuke Ishikawa, Kensuke Nakanishi, Yuka Matsushima, Tadashi Takemoto
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Publication number: 20180311773Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.Type: ApplicationFiled: July 9, 2018Publication date: November 1, 2018Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Shunsuke ISHIKAWA, Kensuke NAKANISHI, Yuka MATSUSHIMA, Tadashi TAKEMOTO
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Publication number: 20180214989Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.Type: ApplicationFiled: July 8, 2016Publication date: August 2, 2018Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki IKEDA, Kosuke INOUE, Kazuya ICHIKAWA, Tadashi TAKEMOTO
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Patent number: 9956649Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A is 4.36 or less wherein A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.82×[Sb content ratio (mass %)].Type: GrantFiled: August 28, 2014Date of Patent: May 1, 2018Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki Ikeda, Kosuke Inoue, Kazuya Ichikawa, Tadashi Takemoto
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Patent number: 9931716Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.Type: GrantFiled: August 28, 2014Date of Patent: April 3, 2018Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki Ikeda, Kosuke Inoue, Kazuya Ichikawa, Tadashi Takemoto
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Publication number: 20180037823Abstract: There is provided a fuel hydrocarbon manufacturing apparatus, including a water treatment tank configured to create activated water; a plurality of quartz tubes configured to contain titanium oxide coated ceramics; a plurality of UV lamp; a water tank configured to receive activated water from the water treatment tank; an oil tank configured to contain original oil; a inline mixer configured to break down water and oil into very small clusters and mix together to form an emulsified mixture; a emulsion tank; a reactor tank configured to produce new oil; a water-oil separator configured to divide new oil from remaining water; and a return conduit configured to supply new oil back to the oil tank.Type: ApplicationFiled: August 2, 2016Publication date: February 8, 2018Applicant: BIO HITECH ENERGY CO.Inventors: JAMES CHUN KOH, TADASHI TAKEMOTO
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Patent number: 9868412Abstract: Provided is an air-bag integrally formed by hollow weaving and including a control seam for restricting expansion. The control seam is extended from the base fabric on one surface of an expansion portion of the air-bag to the base fabric on another surface, and the base fabrics are joined. The control seam extending from the base fabric on the one surface to the base fabric on the other surface, and the control seam extending symmetrically from the base fabric on the other surface to the base fabric on the one surface constitute a pair of control seams One or more pairs of the restriction yarns are arranged in a block shape, forming a restriction yarn block. Adjacent restriction yarn blocks are disposed in a parallelly staggered manner with respect to the direction in which the restriction yarns extend.Type: GrantFiled: July 8, 2014Date of Patent: January 16, 2018Assignee: SUMISHO AIRBAG SYSTEMS CO., LTD.Inventors: Masatoshi Yoshida, Tadashi Takemoto
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Publication number: 20170355043Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt. Relative to a total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the copper content is 0.3 mass % or more and 1 mass % or less, the bismuth content is more than 4.8 mass % and 10 mass % or less, the antimony content is 3 mass % or more and 10 mass % or less, the cobalt content is 0.001 mass % or more and 0.3 mass % or less, and the tin content is the remaining portion.Type: ApplicationFiled: February 24, 2015Publication date: December 14, 2017Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki IKEDA, Kosuke INOUE, Kazuya ICHIKAWA, Tadashi TAKEMOTO
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Publication number: 20170327434Abstract: A method for synthesizing a hydrocarbon by reducing carbon dioxide in water, said method comprising supplying oxygen to water containing carbon dioxide to generate oxygen nanobubbles, irradiating the water containing the oxygen nanobubbles with ultraviolet light in the presence of a photocatalyst to generate active oxygen, and reducing carbon dioxide in the presence of the active oxygen.Type: ApplicationFiled: June 10, 2015Publication date: November 16, 2017Applicant: SI Energy Company LimitedInventors: Tadayuki Imanaka, Tadashi Takemoto
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Publication number: 20170274480Abstract: In a solder alloy consisting essentially of tin, silver, copper, bismuth, antimony, indium, and nickel, the content ratio of the silver is 0.05 mass % or more and below 0.2 mass %; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is above 4.0 mass % and 10 mass % or less; the content ratio of the antimony is 0.005 mass % or more and 8 mass % or less; the content ratio of the indium is 0.005 mass % or more and 2 mass % or less; the content ratio of the nickel is 0.003 mass % or more and 0.4 mass % or less; and the content ratio of the tin is the remaining ratio and the mass ratio (Bi/Ni) of the bismuth content with respect to the nickel content is 35 or more and 1500 or less.Type: ApplicationFiled: February 3, 2016Publication date: September 28, 2017Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Shunsuke ISHIKAWA, Kensuke NAKANISHI, Yuka MATSUSHIMA, Tadashi TAKEMOTO
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Publication number: 20160368448Abstract: Provided is an air-bag integrally formed by hollow weaving and including a control seam for restricting expansion. The control seam is extended from the base fabric on one surface of an expansion portion of the air-bag to the base fabric on another surface, and the base fabrics are joined. The control seam extending from the base fabric on the one surface to the base fabric on the other surface, and the control seam extending symmetrically from the base fabric on the other surface to the base fabric on the one surface constitute a pair of control seams One or more pairs of the restriction yarns are arranged in a block shape, forming a restriction yarn block. Adjacent restriction yarn blocks are disposed in a parallelly staggered manner with respect to the direction in which the restriction yarns extend.Type: ApplicationFiled: July 8, 2014Publication date: December 22, 2016Applicant: SUMISHO AIRBAG SYSTEMS CO., LTD.Inventors: Masatoshi Yoshida, Tadashi Takemoto
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Publication number: 20160288271Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less. A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.Type: ApplicationFiled: August 28, 2014Publication date: October 6, 2016Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki IKEDA, Kosuke INOUE, Kazuya ICHIKAWA, Tadashi TAKEMOTO
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Publication number: 20160271737Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.Type: ApplicationFiled: August 28, 2014Publication date: September 22, 2016Applicant: HARIMA CHEMICALS, INCORPORATEDInventors: Kazuki IKEDA, Kosuke INOUE, Kazuya ICHIKAWA, Tadashi TAKEMOTO
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Patent number: 9445508Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.Type: GrantFiled: June 25, 2013Date of Patent: September 13, 2016Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Kensuke Nakanishi, Kosuke Inoue, Kazuya Ichikawa, Tetsuyuki Shigesada, Tadashi Takemoto
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Patent number: 9221129Abstract: A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less.Type: GrantFiled: June 25, 2013Date of Patent: December 29, 2015Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
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Patent number: 9221132Abstract: A solder alloy is a tin-silver-copper solder alloy containing tin, silver, copper, nickel, antimony, bismuth, and indium, and substantially does not contain germanium, wherein relative to the total amount of the solder alloy, the silver content is more than 0.05 mass % and less than 0.2 mass %, and the antimony content is 0.01 mass % or more and less than 2.5 mass %.Type: GrantFiled: November 16, 2012Date of Patent: December 29, 2015Assignee: HARIMA CHEMICALS, INCORPORATEDInventors: Yoji Imamura, Kazuki Ikeda, JinYu Piao, Tadashi Takemoto
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Publication number: 20150305167Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.Type: ApplicationFiled: June 25, 2013Publication date: October 22, 2015Inventors: Kensuke NAKANISHI, Kosuke INOUE, Kazuya ICHIKAWA, Tetsuyuki SHIGESADA, Tadashi TAKEMOTO