Abstract: It is an object to effectively reduce minute clearances generated between a heat radiating member and a vehicle body and ensure good cooling performance while avoiding the occurrence of impact and noise caused by the vibration of a vehicle. A circuit unit U is mounted such that an outer surface 11B of the heat radiating member 10 to which the circuit body 30 is fixed faces a body surface S of the vehicle with a clearance. Preferably, the mounting part 12 fixed to the body of the vehicle is extended, the surface 13 of the mounting part 12 which is in contact with the body is positioned to be substantially parallel to the outer surface 11B of the heat radiating member and a step is provided in both surfaces 13, 11B. In a mounted state, the body and the outer surface 11B of the heat radiating member are facing each other in a substantially parallel state and a clearance is formed between the body and the outer surface of the heat radiating member over the entire area excluding the mounting part 12.

Abstract: A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

Abstract: A casing 20 surrounding a circuit structure 10 consists of a frame 21, a heat sink 30 located in a rear side of the circuit structure 10 and a cover 60 located in a front side. The frame 21 is in a two-component structure consisting of a first frame member 22 shaped a capital letter C and a second frame member 23 disposed in a rear side of a first terminal part 15A. Thereby, before implementing a switching member 13, the circuit structure 10 can be bonded to the heat sink 30 and, thereafter, the first frame member 22 and the second frame member 23 are separately fixed to the heat sink 30 so that the frame 21 surrounding the circuit structure 10 from the periphery can be completed.

Abstract: A casing 20 surrounding a circuit structure 10 consists of a frame 21, a heat sink 30 located in a rear side of the circuit structure 10 and a cover 60 located in a front side. The frame 21 is in a two-component structure consisting of a first frame member 22 shaped a capital letter C and a second frame member 23 disposed in a rear side of a first terminal part 15A. Thereby, before implementing a switching member 13, the circuit structure 10 can be bonded to the heat sink 30 and, thereafter, the first frame member 22 and the second frame member 23 are separately fixed to the heat sink 30 so that the frame 21 surrounding the circuit structure 10 from the periphery can be completed.

Abstract: A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

Abstract: A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

Abstract: An electrical connection box is to be attached to an attachment objective member. The electrical connection box includes: a circuit housing that accommodates a circuit substrate; a fuse box that detachably accommodates a fuse element, the fuse box being provided at an upper portion of the circuit housing in a state where the electrical connection box being attached to the attachment objective member; a plurality of bus bars that connect the circuit substrate and the fuse element; and a water-discharge channel that discharges water flowed into the fuse box to outside of the electrical connection box, the water-discharge channel being provided at a lower part of the bus bars in a state where the electrical connection box is attached to the attachment objective member, and at a position between the circuit housing and the fuse box.

Abstract: It is an object to effectively reduce minute clearances generated between a heat radiating member and a vehicle body and ensure good cooling performance while avoiding the occurrence of impact and noise caused by the vibration of a vehicle. A circuit unit U is mounted such that an outer surface 11B of the heat radiating member 10 to which the circuit body 30 is fixed faces a body surface S of the vehicle with a clearance. Preferably, the mounting part 12 fixed to the body of the vehicle is extended, the surface 13 of the mounting part 12 which is in contact with the body is positioned to be substantially parallel to the outer surface 11B of the heat radiating member and a step is provided in both surfaces 13, 11B. In a mounted state, the body and the outer surface 11B of the heat radiating member are facing each other in a substantially parallel state and a clearance is formed between the body and the outer surface of the heat radiating member over the entire area excluding the mounting part 12.

Abstract: An electrical connection box is described that includes a plurality of connector parts provided on a circuit substrate. Each of the plurality of connector parts may be provided at a different portion of the circuit substrate and may include an engaging portion that may engage with a mating connector part that is exposed outward from the case. In one exemplary embodiment, the connector parts are arrayed, respectively, on an upper circuit substrate and a lower circuit substrate. Therefore, cables extended from the upper connector part and cables extended from the lower connector part may be drawn from the mating connector in parallel and may be easily handled. For example, cables extended from the upper connector part and cables extended from the lower connector part run in parallel and in the same direction with the substrate, thereby making it possible to easily package the cables into one bundle.

Abstract: An electrical connection box is to be attached to an attachment objective member. The electrical connection box includes: a circuit housing that accommodates a circuit substrate; a fuse box that detachably accommodates a fuse element, the fuse box being provided at an upper portion of the circuit housing in a state where the electrical connection box being attached to the attachment objective member; a plurality of bus bars that connect the circuit substrate and the fuse element; and a water-discharge channel that discharges water flowed into the fuse box to outside of the electrical connection box, the water-discharge channel being provided at a lower part of the bus bars in a state where the electrical connection box is attached to the attachment objective member, and at a position between the circuit housing and the fuse box.

Abstract: An electrical connection box includes: a circuit substrate having a conducting channel formed thereon; a case that accommodates the circuit substrate; a plurality of connector parts provided on the circuit substrate and having an engaging portion that engages with a mating connector part, the engaging portion being exposed outward from the case; and a plurality of conductive members that are electrically connected to the conducting channel, wherein an end portion of the conductive members is accommodated within the connector parts respectively, and wherein each of the connector parts is provided to be engaged with a respective mating connector in a direction parallel to the circuit substrate and the direction same with one another.

Abstract: A circuit configuration member has a space capable of storing a resin in a liquid state is formed on the adhering face and on an inner side of the case main body. The adhering face of the heat radiating member and the circuit configuration member are adhered by an adhering member at inside of the space by integrally molding the case main body arranged to surround the circuit configuration member and the heat radiating member.

Abstract: The heater module (30) for heating an optical waveguide device (2) is provided with a ceramics heater (40) having a heating circuit (42) adapted to generate heat when energized and an AlN ceramics layer (44) stacked on the heating circuit.

Abstract: To provide a heater module which can improve the temperature uniformity in an optical waveguide while keeping the power consumption and the thickness of the optical waveguide module. A heater module 20 in accordance with the present invention is a heater module 20 for heating an optical waveguide device 12 so as to regulate its temperature; and comprises a heat-generating circuit 22 adapted to generate heat when energized, and a heat-transmitting section 21 disposed on the upper face of the heat-generating circuit 22 and formed with a recessed groove portion for mounting the optical waveguide device 12. When the optical waveguide device 12 is mounted on the bottom face of the heat-transmitting section 21 formed with the recessed groove section, the optical waveguide device 12 can be heated not only from its bottom face, but also from its side faces by edge parts constituting the recessed groove portion, whereby the temperature uniformity can be enhanced.

Abstract: To provide a heater module which can improve the temperature uniformity in an optical waveguide while keeping the power consumption and the thickness of the optical waveguide module.

Abstract: A highly reliable connecting lead for devices that mount semiconductors. The lead is made of copper or copper alloy. The thickness of the oxide film at the interface between the copper or copper alloy lead and an aluminum bump electrode is 10 nm or less. The contents of oxygen and carbon in the aluminum bump electrode are 1 atm % or less each.

Abstract: A field emission device according to the present invention comprises a support substrate; a cathode mounted on a surface of said support substrate; a first diamond portion located on any surface of said substrate, said first diamond portion substantially having an electrical connection with said cathode; a second diamond portion located on the substrate surface on which said first diamond portion is also located, said second diamond portion including plurality of diamond protuberances; and an anode positioned spaced apart from said first and second diamond portions, wherein a space is formed between said anode and said second diamond portion.

Abstract: An ohmic electorde of the present invention comprises a contact electrode layer formed on a p-type diamond semiconductor layer formed on a substrate so as to be in ohmic contact with the p-type diamond semiconductor layer and to have low contact resistance and high heat resistance, and a lead electrode layer formed on the contact electrode layer so as to have low lead wire resistance and high heat resistance. Specifically, the contact electrode layer is made of either a carbide of at least one metal selected from a metal group comprising Ti, Zr, and Hf, or a carbide of an alloy containing at least one metal selected from the metal group. Since the carbide of the metal or alloy forming the contact electrode layer is stabler in respect of energy because of reduced formation enthalpy than the metal or alloy itself, it is very unlikely to diffuse.

Abstract: A diamond semiconductor device of the present invention comprises an n-type diamond layer to which an n-type dopant is doped at high concentration so that metal conduction dominates, a p-type diamond layer to which a p-type dopant is doped at high concentration so that metal conduction dominates, and a high resistance diamond layer formed between the n-type diamond layer and the p-type diamond layer. Here, the thickness and the doping concentration of the high resistance diamond layer are values at which semiconductor conduction dominates. Then, in a case that an applied voltage is forward bias, electrons are injected from the n-type region to the p-type region through the conduction band of the high resistance region, and holes are injected from the p-type region to the n-type region through the valance band of the high resistance region, so that a current flows.

Abstract: An electron device of the present invention comprises an i-type diamond layer formed on a substrate, and an n-type diamond layer formed on the i-type diamond layer and having a first surface region formed flatly and a second surface region containing an emitter portion, which are set in a vacuum container, in which the emitter portion formed of the n-type diamond has a bottom area 10 or less .mu.m square and projects relative to the first surface region. In the n-type diamond layer, a difference is fine between the conduction band and the vacuum level. Also, since the n-type diamond layer is doped with an n-type dopant in a high concentration, metal conduction is dominant as conduction of electrons. Therefore, setting the temperature of the substrate at a predetermined temperature and generating an electric field near the surface of the emitter portion, electrons are emitted with a high efficiency from the tip portion of the emitter portion into the vacuum.