Abstract: In a resin-sealed laser diode device, in order to prevent the sealing resin on the front light-emitting end face of the laser diode chip from being deteriorated by the laser beam, a thermosetting rubber-like organic silicone resin layer is formed on the front light-emitting end face to a thickness of at least 50 &mgr;m on the extension of the surface of the active layer. On the side of the rear light-emitting end-face of the laser diode chip, the rubber-like organic silicone resin layer on the photo-diode is curved upwardly with respect to the light receiving surface of the latter. Furthermore, in order to prevent the far field pattern of the laser beam from being made irregular, at least the surface of the end-face protecting film on the light-emitting end face essentially contains silicon dioxide.