Patents by Inventor Tadashi Yamoto

Tadashi Yamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6681937
    Abstract: Receiving pockets are formed by folding open-top box-like structures from paper. The structures are affixed in registration with holes in a tape substrate to receive objects to be packed therein. After the objects are packed, a covering tape is added to secure the packed objects in their respective receiving pockets. The receiving pockets, tape substrate and covering tape are all preferably of paper to permit environmentally friendly disposal after use by incineration or other disposal.
    Type: Grant
    Filed: March 7, 2002
    Date of Patent: January 27, 2004
    Assignee: SMK Corporation
    Inventors: Tadashi Yamoto, Hiroyuki Takehana
  • Publication number: 20020185408
    Abstract: Receiving pockets are formed by folding open-top box-like structures from paper. The structures are affixed in registration with holes in a tape substrate to receive objects to be packed therein. After the objects are packed, a covering tape is added to secure the packed objects in their respective receiving pockets. The receiving pockets, tape substrate and covering tape are all preferably of paper to permit environmentally friendly disposal after use by incineration or other disposal.
    Type: Application
    Filed: March 7, 2002
    Publication date: December 12, 2002
    Inventors: Tadashi Yamoto, Hiroyuki Takehana
  • Patent number: 6276966
    Abstract: A shield plate inhibits high frequency noise generated by a circuit board from interfering with the operation of a jack connector. The jack and shield are mounted on a circuit board and the shield is connected to the shield plate and a common terminal of the jack. The shield plate is elastic and contains magnetic powder with a high flux density to interrupt high frequency noise coming from a direction of a circuit board. When mounted to a device chassis, the shield is connected to the chassis through resilient arms. The chassis, shield, shield plate and common terminal of the jack are all connected together and to a common ground. This configuration reduces incident noise received by the jack, without the need to modify the jack or circuit to optimize noise resistance.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: August 21, 2001
    Assignee: SMK Corporation
    Inventors: Tadashi Yamoto, Hiroshi Suzuki, Motokazu Sasa