Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An image sensor module includes a light source unit that emits a linear light beam elongate in a primary scanning direction to an object to be read, and a lens unit including an incidence surface and an output surface oriented opposite to each other. The lens unit is configured to receive light from the object through the incidence surface and output the light through the output surface. The module also includes a sensor IC that receives the light outputted from the output surface, a housing that holds the light source unit and the lens unit, and a support member that supports the lens unit such that the incidence surface is located more distant from the sensor IC than the output surface in a secondary scanning direction. The support member includes a reflection surface that reflects the light from the object toward the incidence surface.

Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

Abstract: A chip type variable electronic part includes an insulating substrate with a through hole, an adjustment rotor formed of a metal plate in a bowl shape to receive a screwdriver and disposed on the upper surface of the insulating substrate, an internal terminal electrode plate made of a metal plate disposed in close contact with a lower surface of the insulating substrate, and a shaft portion integrally formed with the internal terminal electrode plate to be fitted in the through hole. A bottom plate of the adjustment rotor is rotatably fitted to the upper end portion of the shaft portion, and the upper end portion of the shaft portion is crimped to outwardly extend over the upper surface of the bottom plate. A portion of the bottom plate of the adjustment rotor, fitted over the shaft portion, is located at a lower level than the uppermost edge of an inner portion of the through hole on the upper surface of the insulating substrate.

Abstract: A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.

Abstract: A chip type variable electronic part includes an insulating substrate with a through hole, an adjustment rotor formed of a metal plate in a bowl shape and disposed on the upper surface of the insulating substrate, an internal terminal electrode plate made of a metal plate disposed in close contact with the lower surface of the insulating substrate, and a hollow shaft integrally formed with the internal terminal electrode plate to be fitted in the through hole. The adjustment rotor has a bottom plate rotatably fitted to an upper end portion of the hollow shaft so that the bottom plate makes close contact with the surface of the insulating substrate. The upper end portion of the hollow shaft is crimped to outwardly extend. The bottom plate of the adjustment rotor is smaller in thickness than the remaining portions. Thus, the overall height is reduced without reducing the insertion depth of a screwdriver into the rotor, and without degrading the strength of the insulating substrate.

Abstract: A method for cutting a lead terminal of a packaged electronic component including a resin package (5), an element (2) covered by the package (5), and a lead terminal (3) connected to the element (2) and including a protruding portion extending out of the package (5). The method includes the steps of forming a narrow bridge portion (23) at the lead terminal (3) by removing a part of the protruding portion, providing a metal plate to the protruding portion of the lead terminal (3), and cutting the lead terminal (3) at the narrow bridge portion (23).

Abstract: A chip type variable electronic part includes an insulating substrate with a through hole, an adjustment rotor formed of a metal plate in a bowl shape to receive a screwdriver and disposed on the upper surface of the insulating substrate, an internal terminal electrode plate made of a metal plate disposed in close contact with a lower surface of the insulating substrate, and a shaft portion integrally formed with the internal terminal electrode plate to be fitted in the through hole. A bottom plate of the adjustment rotor is rotatably fitted to the upper end portion of the shaft portion, and the upper end portion of the shaft portion is crimped to outwardly extend over the upper surface of the bottom plate. A portion of the bottom plate of the adjustment rotor, fitted over the shaft portion, is located at a lower level than the uppermost edge of an inner portion of the through hole on the upper surface of the insulating substrate.

Abstract: A chip resistor (A1) comprises a first insulation layer (2A) covering the regions between a plurality of electrodes (3) on a rear surface (10a) of a resistor (1), and a second insulation layer covering a pair of side faces of the resistor (1). Inadvertent adhesion of solder to an improper part of the resistor (1) can thereby be eliminated. A solder layer (4) is preferably formed on a pair of end faces (10d) of the resistor (1). In so doing, a solder fillet can be formed appropriately.