Patents by Inventor Tadatoshi Tomita

Tadatoshi Tomita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11574812
    Abstract: A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: February 7, 2023
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Tadatoshi Tomita, Hisashi Genjima, Gen You, Takahiro Kitano
  • Patent number: 10586711
    Abstract: A substrate processing method of processing a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, the substrate processing method includes: a block copolymer coating step of applying the block copolymer onto the substrate on which a predetermined projecting and recessed pattern is formed, to form a coating film of the block copolymer; a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer; a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer; and after the block copolymer coating step and before the polymer removal step, a film thickness reduction step of reducing a film thickness of the coating film of the block copolymer.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: March 10, 2020
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Tadatoshi Tomita, Hisashi Genjima, Takahiro Kitano
  • Publication number: 20190341255
    Abstract: A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
    Type: Application
    Filed: July 19, 2019
    Publication date: November 7, 2019
    Inventors: Makoto MURAMATSU, Tadatoshi TOMITA, Hisashi GENJIMA, Gen YOU, Takahiro KITANO
  • Patent number: 10418242
    Abstract: A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: September 17, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Tadatoshi Tomita, Hisashi Genjima, Gen You, Takahiro Kitano
  • Patent number: 10329144
    Abstract: A substrate treatment method using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer includes a polymer separating step, wherein a ratio of a molecular weight of the hydrophilic polymer in the block copolymer is adjusted to 20% to 40% so that the hydrophilic polymers align at positions corresponding to a hexagonal close-packed structure in a plan view after the polymer separating step, and at the polymer separating step, a columnar first hydrophilic polymer is phase-separated on each of circular patterns of hydrophobic coating films and a columnar second hydrophilic polymer is phase-separated between the first hydrophilic polymers, and a diameter of the circular pattern is set so that the first hydrophilic polymers and the second hydrophilic polymers align at positions corresponding to the hexagonal close-packed structure in a plan view.
    Type: Grant
    Filed: February 10, 2016
    Date of Patent: June 25, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Tadatoshi Tomita, Hisashi Genjima, Gen You, Takahiro Kitano, Takanori Nishi
  • Patent number: 10121659
    Abstract: The present invention, when forming a pattern on a substrate, forms a film of a block copolymer containing at least two polymers on the substrate, heats the film of the block copolymer under a solvent vapor atmosphere to subject the block copolymer to phase separation, and removes one of the polymers in the film of the phase-separated block copolymer, thereby accelerating fluidization of the polymers of the block copolymer to enable acceleration of the phase separation.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: November 6, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Keiji Tanouchi
  • Publication number: 20180269072
    Abstract: A substrate processing method of processing a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, the substrate processing method includes: a block copolymer coating step of applying the block copolymer onto the substrate on which a predetermined projecting and recessed pattern is formed, to form a coating film of the block copolymer; a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer; a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer; and after the block copolymer coating step and before the polymer removal step, a film thickness reduction step of reducing a film thickness of the coating film of the block copolymer.
    Type: Application
    Filed: October 20, 2016
    Publication date: September 20, 2018
    Inventors: Makoto MURAMATSU, Tadatoshi TOMITA, Hisashi GENJIMA, Takahiro KITANO
  • Publication number: 20180065843
    Abstract: A substrate treatment method using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer includes a polymer separating step, wherein a ratio of a molecular weight of the hydrophilic polymer in the block copolymer is adjusted to 20% to 40% so that the hydrophilic polymers align at positions corresponding to a hexagonal close-packed structure in a plan view after the polymer separating step, and at the polymer separating step, a columnar first hydrophilic polymer is phase-separated on each of circular patterns of hydrophobic coating films and a columnar second hydrophilic polymer is phase-separated between the first hydrophilic polymers, and a diameter of the circular pattern is set so that the first hydrophilic polymers and the second hydrophilic polymers align at positions corresponding to the hexagonal close-packed structure in a plan view.
    Type: Application
    Filed: February 10, 2016
    Publication date: March 8, 2018
    Inventors: Makoto MURAMATSU, Tadatoshi TOMITA, Hisashi GENJIMA, Gen YOU, Takahiro KITANO, Takanori NISHI
  • Publication number: 20180019118
    Abstract: The present invention, when forming a pattern on a substrate, forms a film of a block copolymer containing at least two polymers on the substrate, heats the film of the block copolymer under a solvent vapor atmosphere to subject the block copolymer to phase separation, and removes one of the polymers in the film of the phase-separated block copolymer, thereby accelerating fluidization of the polymers of the block copolymer to enable acceleration of the phase separation.
    Type: Application
    Filed: September 27, 2017
    Publication date: January 18, 2018
    Inventors: Makoto MURAMATSU, Takahiro KITANO, Tadatoshi TOMITA, Keiji TANOUCHI
  • Patent number: 9859118
    Abstract: The present invention, when forming a pattern on a substrate, forms a film of a block copolymer containing at least two polymers on the substrate, heats the film of the block copolymer under a solvent vapor atmosphere to subject the block copolymer to phase separation, and removes one of the polymers in the film of the phase-separated block copolymer, thereby accelerating fluidization of the polymers of the block copolymer to enable acceleration of the phase separation.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: January 2, 2018
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Keiji Tanouchi
  • Patent number: 9810987
    Abstract: A substrate treatment method includes: a polymer separation step of phase-separating a block copolymer into a hydrophilic polymer and a hydrophobic polymer; and a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer, wherein in the polymer removal step, the hydrophilic polymer is removed by: irradiating the phase-separated block copolymer with an energy ray; then supplying a first polar organic solvent having a first degree of dissolving the hydrophilic polymer, being lower in boiling point than water and capable of dissolving water, and not dissolving the hydrophobic polymer, to the block copolymer; and then supplying a second polar organic solvent having a second dissolving degree lower than the first dissolving degree, being higher in boiling point than water, and not dissolving the hydrophobic polymer, to the block copolymer.
    Type: Grant
    Filed: June 6, 2014
    Date of Patent: November 7, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Takanori Nishi, Shinichiro Kawakami, Takashi Yamauchi
  • Publication number: 20170287749
    Abstract: A substrate treatment method of treating a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, includes: a resist pattern formation step of forming a predetermined resist pattern by a resist film on the substrate; a thin film formation step of forming a thin film for suppressing deformation of the resist pattern on a surface of the resist pattern; a block copolymer coating step of applying a block copolymer to the substrate after the formation of the thin film; and a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer.
    Type: Application
    Filed: September 15, 2015
    Publication date: October 5, 2017
    Inventors: Makoto MURAMATSU, Tadatoshi TOMITA, Hisashi GENJIMA, Gen YOU, Takahiro KITANO
  • Patent number: 9748101
    Abstract: The present invention is configured to: form, on a substrate, a neutral layer having an intermediate affinity to a hydrophilic polymer and a hydrophobic polymer; form a resist pattern by performing exposure processing on a resist film formed on the neutral layer and then developing the resist film after the exposure processing; perform a surface treatment on the resist pattern by supplying an organic solvent having a polarity to the resist pattern; apply the block copolymer onto the neutral layer; and phase-separate the block copolymer on the neutral layer into the hydrophilic polymer and the hydrophobic polymer.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 29, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Keiji Tanouchi, Soichiro Okada
  • Patent number: 9741583
    Abstract: A substrate treatment method includes: forming a plurality of circular patterns of a resist film on a substrate; thereafter applying a first block copolymer; then phase-separating the first block copolymer into a hydrophilic polymer and a hydrophobic polymer; thereafter selectively removing the hydrophilic polymer; then selectively removing the resist film from a top of the substrate; thereafter applying a second block copolymer to the substrate; then phase-separating the second block copolymer into a hydrophilic polymer and a hydrophobic polymer; and thereafter selectively removing the hydrophilic polymer from the phase-separated second block copolymer. A ratio of a molecular weight of the hydrophilic polymer in the first block copolymer and the second block copolymer is 20% to 40%.
    Type: Grant
    Filed: April 16, 2015
    Date of Patent: August 22, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Gen You, Takanori Nishi
  • Publication number: 20170133235
    Abstract: A substrate treatment method includes: forming a plurality of circular patterns of a resist film on a substrate; thereafter applying a first block copolymer; then phase-separating the first block copolymer into a hydrophilic polymer and a hydrophobic polymer; thereafter selectively removing the hydrophilic polymer; then selectively removing the resist film from a top of the substrate; thereafter applying a second block copolymer to the substrate; then phase-separating the second block copolymer into a hydrophilic polymer and a hydrophobic polymer; and thereafter selectively removing the hydrophilic polymer from the phase-separated second block copolymer. A ratio of a molecular weight of the hydrophilic polymer in the first block copolymer and the second block copolymer is 20% to 40%.
    Type: Application
    Filed: April 16, 2015
    Publication date: May 11, 2017
    Inventors: Makoto MURAMATSU, Takahiro KITANO, Tadatoshi TOMITA, Gen YOU, Takanori NISHI
  • Patent number: 9618849
    Abstract: The present invention is a pattern forming method of forming a pattern on a substrate using a block copolymer, the pattern forming method including the steps of: forming a film of a block copolymer containing at least two kinds of polymers on the substrate; heating the film of the block copolymer; irradiating the heated film of the block copolymer with ultraviolet light in an atmosphere of an inert gas; and supplying an organic solvent to the film of the block copolymer irradiated with the ultraviolet light.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 11, 2017
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Keiji Tanouchi
  • Patent number: 9530645
    Abstract: A photoresist pattern used for forming a pattern of a block copolymer is formed on a substrate, and then an acid solution is supplied and an alkaline solution is further supplied to the photoresist pattern so as to slim and smooth the photoresist pattern. A block copolymer solution is applied to the substrate on which the smoothed photoresist pattern has been formed, to form a film of the block copolymer, and the film is heated.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: December 27, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Makoto Muramatsu, Takahiro Kitano, Tadatoshi Tomita, Keiji Tanouchi
  • Publication number: 20160293403
    Abstract: The present invention, when forming a pattern on a substrate, forms a film of a block copolymer containing at least two polymers on the substrate, heats the film of the block copolymer under a solvent vapor atmosphere to subject the block copolymer to phase separation, and removes one of the polymers in the film of the phase-separated block copolymer, thereby accelerating fluidization of the polymers of the block copolymer to enable acceleration of the phase separation.
    Type: Application
    Filed: November 25, 2013
    Publication date: October 6, 2016
    Inventors: Makoto MURAMATSU, Takahiro KITANO, Tadatoshi TOMITA, Keiji TANOUCHI
  • Patent number: 9418860
    Abstract: A method is provided for forming a patterned topography on a substrate. The substrate is provided with features formed atop that constitute an existing topography, and a template for directed self-assembly (DSA) is formed surrounding the exposed topography. Further to the method, the exposed template surfaces are chemically treated. In one embodiment, the surfaces are treated with a hydrogen-containing reducing chemistry to alter the surfaces to a less oxidized state. In another embodiment, the surfaces are coated with a first phase of a block copolymer (BCP) to render the surfaces more attractive to the first phase than prior to the coating. The template is then filled with the BCP to cover the exposed topography, and then the BCP is annealed within the template to drive self-assembly in alignment with the topography. Developing the annealed BCP exposes a DSA pattern immediately overlying the topography.
    Type: Grant
    Filed: October 20, 2014
    Date of Patent: August 16, 2016
    Assignee: Tokyo Electron Limited
    Inventors: Mark H. Somervell, Makoto Muramatsu, Benjamen M. Rathsack, Tadatoshi Tomita, Hisashi Genjima, Hidetami Yaegashi, Kenichi Oyama
  • Publication number: 20160124307
    Abstract: A substrate treatment method includes: a polymer separation step of phase-separating a block copolymer into a hydrophilic polymer and a hydrophobic polymer; and a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer, wherein in the polymer removal step, the hydrophilic polymer is removed by: irradiating the phase-separated block copolymer with an energy ray; then supplying a first polar organic solvent having a first degree of dissolving the hydrophilic polymer, being lower in boiling point than water and capable of dissolving water, and not dissolving the hydrophobic polymer, to the block copolymer; and then supplying a second polar organic solvent having a second dissolving degree lower than the first dissolving degree, being higher in boiling point than water, and not dissolving the hydrophobic polymer, to the block copolymer.
    Type: Application
    Filed: June 6, 2014
    Publication date: May 5, 2016
    Inventors: Makoto MURAMATSU, Takahiro KITANO, Tadatoshi TOMITA, Takanori NISHI, Shinichiro KAWAKAMI, Takashi YAMAUCHI