Abstract: A semiconductor device according to the present disclosure includes a base body having a first face and a second face, a lead passing through a through hole penetrating the base body and extending to a side of the first face, a sealing body filling the through hole, a dielectric substrate having a first main surface and a second main surface erected with respect to the first face, a semiconductor laser provided on a side of the first main surface of the dielectric substrate, a signal line provided on the first main surface and electrically connected to the semiconductor laser, a connecting member electrically connecting the signal line and the lead to each other, and a rear surface conductor provided on the second main surface, wherein the sealing body is provided directly below the rear surface conductor as viewed from a direction perpendicular to the first face.

Abstract: A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.

Abstract: An optical axis adjustment method for an integrated optical module includes: measuring output currents by changing a wavelength of a light beam incident on a package; detecting, with first and second light receiving elements, light beams resulted from demultiplexing the incident light beam with first and second filters; detecting center wavelengths of a first light beam and a second light beam based on a change in the output currents in response to a change in the wavelength of the incident light beam; comparing the center wavelengths of the first light beam and the second light beam with design transmission wavelengths of the first filter and the second filter, and defining respective differences as a first wavelength deviation and a second wavelength deviation; and adjusting a position of the optical demultiplexer to make a total sum of the first wavelength deviation and the second wavelength deviation small.

Abstract: An optical axis adjustment method for an integrated optical module includes: measuring output currents by changing a wavelength of a light beam incident on a package; detecting, with first and second light receiving elements, light beams resulted from demultiplexing the incident light beam with first and second filters; detecting center wavelengths of a first light beam and a second light beam based on a change in the output currents in response to a change in the wavelength of the incident light beam; comparing the center wavelengths of the first light beam and the second light beam with design transmission wavelengths of the first filter and the second filter, and defining respective differences as a first wavelength deviation and a second wavelength deviation; and adjusting a position of the optical demultiplexer to make a total sum of the first wavelength deviation and the second wavelength deviation small.

Abstract: A method of manufacturing a wavelength multiplexing optical communication module which includes a plurality of light emitting elements, a plurality of optical lenses adjusting wavefronts of emergent lights from the plurality of light emitting elements, and a multiplexer combining the lights adjusted by the plurality of optical lenses, includes: applying a resin on a carrier so as to have a shape with a curvature symmetric about a rotation axis; and bonding a lower surface of the optical lens to the carrier with the resin, wherein a recess having a curvature is formed at a center of the lower surface of the optical lens.

Abstract: A semiconductor optical device includes a stem; a semiconductor optical element mounted on the stem; a resin cap including a cylindrical body portion, a plate portion, and an edge portion; and a lens attached integrally to the plate portion of the cap. The edge portion of the cap is bonded to the stem so that the cap covers the semiconductor optical element. The cylindrical body portion of the cap has at least one first portion and second portions which are spaced apart from each other in the circumferential direction of the cylindrical body portion and which project inwardly relative to the at least one first portion. The stem has projections, and each projection vertically underlies and engages or contacts a surface of a respective one of the second portions of the cap.

Abstract: A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall, a second curved surface is located on a perimeter of an undersurface of the lid, and the first curved surface of the side wall contacts the second curved surface of the lid.

Abstract: A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall, a second curved surface is located on a perimeter of an undersurface of the lid, and the first curved surface of the side wall contacts the second curved surface of the lid.

Abstract: A semiconductor optical device includes a stem; a semiconductor optical element mounted on the stem; a resin cap including a cylindrical body portion, a plate portion, and an edge portion; and a lens attached integrally to the plate portion of the cap. The edge portion of the cap is bonded to the stem so that the cap covers the semiconductor optical element. The cylindrical body portion of the cap has at least one first portion and second portions which are spaced apart from each other in the circumferential direction of the cylindrical body portion and which project inwardly relative to the at least one first portion. The stem has projections, and each projection vertically underlies and engages or contacts a surface of a respective one of the second portions of the cap.

Abstract: An optical receptacle which couples a connector ferrule in which an optical fiber is inserted and an optical semiconductor package. The optical receptacle comprises: a precise sleeve which holds the connector ferrule; a receptacle body including a connection portion connected to the optical semiconductor package, a cylindrical portion in which the precise sleeve is inserted; a partition portion located between the connection portion and the cylindrical portion; and a transparent member confined in a region between an inner end portion of the precise sleeve and the partition portion, without being fixed.

Abstract: An optical receptacle which couples a connector ferrule in which an optical fiber is inserted and an optical semiconductor package. The optical receptacle comprises: a precise sleeve which holds the connector ferrule; a receptacle body including a connection portion connected to the optical semiconductor package, a cylindrical portion in which the precise sleeve is inserted; a partition portion located between the connection portion and the cylindrical portion; and a transparent member confined in a region between an inner end portion of the precise sleeve and the partition portion, without being fixed.