Abstract: In a semiconductor device having a laminated metal layer in which a metal layer whose main component is aluminum and a metal layer whose main component is nickel are laminated on each other, the ratio (tAl/tNi) of the thickness (tAl) of the metal layer whose main component is aluminum to that (tNi) of the metal layer whose main component is nickel is controlled to 5 or larger, so that part of the metal layer whose main component is aluminum remains even if an Al—Ni intermetallic compound is formed.

Abstract: A common lens barrel can be detachably attached to a plurality of TV camera bodies each having at least one filter provided in front of an image pickup device. The filters of the respective camera bodies have different thicknesses, and the common lens barrel has a plurality of lens groups. The lens barrel includes a focusing mechanisms and a mechanism for varying a distance between specific lens groups of the plurality of lens groups in accordance with the thickness of the filter of the camera body to which the common lens barrel is attached.

Abstract: A lens barrel is provided having a lens system, and two annular members that are engaged and rotatable relative to one another, with one of the annular members being arranged inside of the other. A lens group is connected to one of the two annular members, and a biasing mechanism for forcing the two annular members into flush tangential contact is provided. A line of contact of the two annular members is substantially parallel to an optical axis of the lens system.

Abstract: A solder is disposed outside a joint area without putting a solder foil in an area to be joined or performing preparatory soldering, and soldering is performed by making the melted solder permeate the joint area by a capillary phenomenon. Further, one member is supported by a solder, and a joint solder layer of desired thickness is obtained by use of a jig for supporting the one and the other member at a predetermined distance therebetween when the solder is melted. Further, if a solder outside a joint area is made to stand vertically in its longitudinal direction, and melted at such a state, pressure caused by self-weight is given to the melted solder, and oxide of the solder surface is separated from the melted solder, so that it is possible to further reduce the generation of voids.

Abstract: A photographic lens mount has a tripod portion that is rotatable about the optical axis of the lens. A rack and pinion type of focussing mechanism is used and the pinion is fixed with respect to the tripod mounting seat irrespective of the rotational position of the lens support and the camera body. The ring portion of the gear mechanism is formed on a ring that is rotatable with respect to the camera support around the optical axis.